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                             54 results found
no title author magazine year volume issue page(s) type
1 A ceramic capacitor substrate for high speed switching VLSI chips
16 4 p. 40-41
 article
2 A CMOS process for VLSI instrumentation
16 4 p. 44
 article
3 Advances in VLSI plasma etching
16 4 p. 43
 article
4 An integrated LSI design aids system Martin, G.
16 4 p. 38
 article
5 A novel approach for higher yield in thick-film resistors Matkari, A.K.
16 4 p. 42
 article
6 Answer to the comment by Dzekov Tomislav and Arsov Goce in Microelectronics Journal Vol. 15 No 3 by B. L. Dokić (See page 32) Dokić, Branko L.
16 4 p. 30-31
 article
7 A review of self-scanned image sensors Beynon, J.D.E.
16 4 p. 39
 article
8 A submicron CMOS/SOS process for VLSI
16 4 p. 42-43
 article
9 A thick film conductive microline fabrication technique Singh, Awatar
16 4 p. 17-21
 article
10 Bonding refractory sputtering targets
16 4 p. 43
 article
11 Comments on ‘Influence of series and parallel transistors on DC characteristics of CMOS logic circuits’ Tomislav, Dzekov
16 4 p. 32-33
 article
12 Comparison of new technologies for VLSI: possibilities and limitations Nishi, Yoshio
16 4 p. 39
 article
13 Controlled anisotropic etching of polysilicon
16 4 p. 43
 article
14 Copper impurity levels in silicon
16 4 p. 41
 article
15 DKG 160 photomask inspection equipment localizes defects in IC patterns
16 4 p. 44
 article
16 Editorial Butcher, John
16 4 p. 3-4
 article
17 Evaluating the MIL-STD-883B alternate die visual screen for LSI
16 4 p. 41
 article
18 Forthcoming events
16 4 p. 46-48
 article
19 How a new generation of microprocessors supports modular programming in high-level languages Hartman, Alfred C.
16 4 p. 39
 article
20 Ideal projection lithography using a multilayer resist process
16 4 p. 42
 article
21 Ion distribution near a mask edge with arbitrary shape for VLSI IC applications Lutsch, A.G.K.
16 4 p. 5-16
 article
22 Isolation tecniques for very large scale integration
16 4 p. 41
 article
23 Laser processing cuts wider swath
16 4 p. 44
 article
24 Linewidth measurement on IC masks by diffraction from grating test patterns
16 4 p. 44
 article
25 Mechanical technology and quality assurance as applied to a video recorder drive mechanism
16 4 p. 44
 article
26 Metal migrations outside the package during accelerated life tests
16 4 p. 43
 article
27 Metrology in mask manufacturing
16 4 p. 43
 article
28 Multi-chamber dry etching system
16 4 p. 43
 article
29 Multi-chip module test and diagnostic methodology
16 4 p. 44
 article
30 New generation semiconductor C. W. laser packages with full herimeticity, integral power monitoring and direct fibre optic launching Ashton, J.E.U.
16 4 p. 39-40
 article
31 New thick film multilayer interconnection technology using a Nd-YAG laser
16 4 p. 40
 article
32 [No title] Arrowsmith, T.
16 4 p. 35
 article
33 [No title] Arrowsmith, T.
16 4 p. 35
 article
34 [No title] Wilson, Kenneth F.
16 4 p. 36
 article
35 Novel insensitive minimal-grounded-element dual-polarity ratio-type function generation Nandi, R.
16 4 p. 25-28
 article
36 Packaging reliability—how to define and measure it
16 4 p. 41-42
 article
37 Pin-fet receivers for 1.3 micron fibre optic systems Burges, J.W.
16 4 p. 40
 article
38 Power semiconductor packaging
16 4 p. 44
 article
39 Semiconductor processing
16 4 p. 43
 article
40 Significant features of solder connections to gold-plated thin films
16 4 p. 40
 article
41 Silver migration in thick film conductors and chip attachment resins Coleman, M.V.
16 4 p. 42
 article
42 Some considerations for peripheral circuits for bubble memory Okada, M.
16 4 p. 39
 article
43 Specific contact resistance and noise in contacts on thin layers
16 4 p. 44
 article
44 The chemistry and stability of ruthenium-based resistors
16 4 p. 41
 article
45 The contiguous disk technology for high density bubble memories Jouve, H.
16 4 p. 38-39
 article
46 The development of fibre optic systems for industrial applications Harper, D.W.
16 4 p. 40
 article
47 Thermal-wave microscopy
16 4 p. 42
 article
48 The role of transport in very small devices for VLSI Ferry, D.K.
16 4 p. 38
 article
49 The silicon process balancing act for VLSI
16 4 p. 43
 article
50 The use of molybdenum in semiconductor devices
16 4 p. 41
 article
51 Thick film materials and reliability
16 4 p. 40
 article
52 Trends in metallization materials
16 4 p. 41
 article
53 Use of PVC for front surface protection of wafers during electrolytic gold backing Nieuwoudt, Michèl K.
16 4 p. 22-23
 article
54 Wafer steppers: considering the issues
16 4 p. 42
 article
                             54 results found
 
 Koninklijke Bibliotheek - National Library of the Netherlands