| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Absorption effects on ESR and conductance of RF sputtered a-Si films
|
|
|
|
13 |
4 |
p. 41
|
artikel
|
| 2 |
A new production technique: Ion milling
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 3 |
An offset-free switched-capacitor biquad
|
Gregorian, Roubik
|
|
|
13 |
4 |
p. 37-40
|
artikel
|
| 4 |
A review of bulk unipolar diodes and their applications
|
Board, K.
|
|
|
13 |
4 |
p. 19-22
|
artikel
|
| 5 |
A simple optimisation procedure for bipolar subnanosecond ICs with low power dissipation
|
Ranfft, R.
|
|
|
13 |
4 |
p. 23-28
|
artikel
|
| 6 |
Book review
|
Mander, H.F.
|
|
|
13 |
4 |
p. 44
|
artikel
|
| 7 |
Book review
|
Krejcik, Milos
|
|
|
13 |
4 |
p. 44
|
artikel
|
| 8 |
Book review
|
Krejcik, Milos
|
|
|
13 |
4 |
p. 44
|
artikel
|
| 9 |
Characteristics of metal-semiconductor contacts fabricated by the electroless deposition method
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 10 |
Comparison of enamelled steel substrate properties for thick film use
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 11 |
Contamination control in lead bonding to thick and thin films
|
|
|
|
13 |
4 |
p. 41
|
artikel
|
| 12 |
Deep UV projection system
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 13 |
Editorial
|
Butcher, John
|
|
|
13 |
4 |
p. 3
|
artikel
|
| 14 |
Electrical Rutherford backscattering and transmission electron microscopy studies of furnace annealed zinc implanted GaAs
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 15 |
Electric measurement of impurity concentration in p-type epitaxially grown and ion-implanted base regions
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 16 |
Electron beam harmlessly probes high-density chips
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 17 |
Energy saving production of silicon single crystal solar cells by ion implantation and laser annealing
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 18 |
Fabrication process techniques for switched-capacitor filter circuits
|
Maddox, R.L.
|
|
|
13 |
4 |
p. 29-36
|
artikel
|
| 19 |
20 GHz low noise beam lead GaAs FET
|
Baudet, Pierre
|
|
|
13 |
4 |
p. 15-18
|
artikel
|
| 20 |
I/C packaging and interconnection developments
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 21 |
Influence of manufacturing process on ultrasonic bondability of thick film gold conductors
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 22 |
Liquid crystal technique as a failure analysis tool
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 23 |
LSI circuit for AC motor speed control
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 24 |
LSI helps telephones go digital
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 25 |
Magnetic bubble reliability testing — component and system level aspects
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 26 |
Mask making for custom VLSI
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 27 |
Medium-power GaAs bipolar transistors
|
Beneking, H.
|
|
|
13 |
4 |
p. 5-14
|
artikel
|
| 28 |
New light-sensitive positive-working thick resist materials for various electronic applications
|
|
|
|
13 |
4 |
p. 41
|
artikel
|
| 29 |
Overlay in lithography
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 30 |
Quality assurance of electrical distribution products
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 31 |
Reticles for wafer imaging systems
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 32 |
Scanning light spot analysis of faulty solar cells
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 33 |
Simultaneous contacting — modern assembly methods of microelectronics
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 34 |
Step-and-repeat wafer imaging
|
|
|
|
13 |
4 |
p. 42
|
artikel
|
| 35 |
Stimulus unit simplifies failure analysis
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 36 |
Theremoelectric heat pumps cool packages electronically
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
| 37 |
Thick-film base-metal conductors on beryllia
|
|
|
|
13 |
4 |
p. 41
|
artikel
|
| 38 |
Yield model for productivity optimisation of VLSI memory chips with redundancy and partially good product
|
|
|
|
13 |
4 |
p. 43
|
artikel
|
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