| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accurate single section model of uniform C-R-NC structures
|
Kumar, U.
|
|
|
11 |
3 |
p. 31-32
|
artikel
|
| 2 |
A fast response non-contact type potentiometer using an improved CdSe film
|
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|
|
11 |
3 |
p. 34
|
artikel
|
| 3 |
Ageing tests on microwave integrated circuits
|
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|
|
11 |
3 |
p. 36
|
artikel
|
| 4 |
A low power thermal head realising high quality printing
|
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|
11 |
3 |
p. 34
|
artikel
|
| 5 |
Alternative methods for determining chip inductor parameters
|
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|
|
11 |
3 |
p. 36
|
artikel
|
| 6 |
A microelectronics packaging technology for consumer product applications
|
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|
|
11 |
3 |
p. 35
|
artikel
|
| 7 |
Assessment of moisture permeation of an epoxy sealed test module
|
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|
|
11 |
3 |
p. 35
|
artikel
|
| 8 |
A thick film active filter for PCM communication systems
|
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|
|
11 |
3 |
p. 37
|
artikel
|
| 9 |
A thick film capacitive temperature sensor
|
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|
11 |
3 |
p. 33
|
artikel
|
| 10 |
Book Review
|
Gledhill, R.J.
|
|
|
11 |
3 |
p. 38
|
artikel
|
| 11 |
Book Review
|
Butcher, J.B.
|
|
|
11 |
3 |
p. 39
|
artikel
|
| 12 |
Book Review
|
Weatherley, R.
|
|
|
11 |
3 |
p. 39
|
artikel
|
| 13 |
Book Review
|
Weatherley, R.
|
|
|
11 |
3 |
p. 39-40
|
artikel
|
| 14 |
Book Review
|
Weatherley, R.
|
|
|
11 |
3 |
p. 39
|
artikel
|
| 15 |
Book Review
|
Matthews, R.B.
|
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|
11 |
3 |
p. 40
|
artikel
|
| 16 |
Breakdown in ceramic capacitors under pulsed high voltage stress
|
|
|
|
11 |
3 |
p. 35-36
|
artikel
|
| 17 |
Characteristics of an indium-tin oxide transparent conductor deposited from organometallic compositions
|
|
|
|
11 |
3 |
p. 34
|
artikel
|
| 18 |
Chemical etching of silicon, germanium, gallium arsenide, and gallium phosphide
|
|
|
|
11 |
3 |
p. 35
|
artikel
|
| 19 |
Chip-joining — A review
|
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|
11 |
3 |
p. 35
|
artikel
|
| 20 |
Combined environment reliability test (CERT)
|
|
|
|
11 |
3 |
p. 36
|
artikel
|
| 21 |
Correlation of thin film adhesion with current noise measurements of Ta2N-Cr-Au resistors on sapphire and alumina substrates
|
|
|
|
11 |
3 |
p. 37
|
artikel
|
| 22 |
Design of ion implanted resistors with low 1/f noise
|
Das, C.J.M.
|
|
|
11 |
3 |
p. 24-27
|
artikel
|
| 23 |
Detection of conductive condensates resulting from adhesive outgassing in hybrid microcircuits
|
|
|
|
11 |
3 |
p. 37
|
artikel
|
| 24 |
Detection of cracking during rotational soldering of a high reliability and voltage ceramic capacitor
|
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|
|
11 |
3 |
p. 36
|
artikel
|
| 25 |
Editorial
|
Butcher, John
|
|
|
11 |
3 |
p. 3
|
artikel
|
| 26 |
Energy saving production of silicon single crystal solar cells by ion implantation and laser annealing
|
Krimmel, E.F.
|
|
|
11 |
3 |
p. 28-30
|
artikel
|
| 27 |
High frequency measurement of Q-factors of ceramic chip capacitors
|
|
|
|
11 |
3 |
p. 36-37
|
artikel
|
| 28 |
High temperature properties of solid tantalum chip capacitors
|
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|
11 |
3 |
p. 33
|
artikel
|
| 29 |
Hybrid IC structures using solder reflow technology
|
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|
11 |
3 |
p. 34
|
artikel
|
| 30 |
Intervalley diffusion of hot electrons in germanium
|
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|
11 |
3 |
p. 34
|
artikel
|
| 31 |
Lead forming and outer lead bond pattern design of tape bonded hybrids
|
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|
11 |
3 |
p. 33
|
artikel
|
| 32 |
Low-cost microcomputing: The personal computer and single-board computer revolutions
|
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|
11 |
3 |
p. 37
|
artikel
|
| 33 |
Low expansivity organic substrate for flip-chip bonding
|
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|
|
11 |
3 |
p. 35
|
artikel
|
| 34 |
LSI: the testing nightmare
|
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|
|
11 |
3 |
p. 36
|
artikel
|
| 35 |
Material characterisation of thick film resistor pastes
|
|
|
|
11 |
3 |
p. 34
|
artikel
|
| 36 |
Microprocessors for high accuracy component measurement
|
|
|
|
11 |
3 |
p. 37
|
artikel
|
| 37 |
New developments in high voltage planar thyristors for use in automobile
|
|
|
|
11 |
3 |
p. 37
|
artikel
|
| 38 |
Noise injection as a measure of semiconductor component performance and degradation
|
|
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|
11 |
3 |
p. 36
|
artikel
|
| 39 |
Non-destructive Bond Pull in high reliability applications
|
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|
|
11 |
3 |
p. 37
|
artikel
|
| 40 |
Optimal selection of sequential tests for reliability
|
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|
11 |
3 |
p. 37
|
artikel
|
| 41 |
Solderable low contact resistance metallisations for PTC thermistors
|
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|
11 |
3 |
p. 33
|
artikel
|
| 42 |
Temperature coefficient of resistance for p- and n-type silicon
|
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|
11 |
3 |
p. 33
|
artikel
|
| 43 |
The cathode-ray tube — Why it will not go away
|
Robbins, D.J.
|
|
|
11 |
3 |
p. 10-23
|
artikel
|
| 44 |
The evaluation of CMOS static-charge protection networks and failure mechanisms associated with overstress conditions as related to device life
|
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|
|
11 |
3 |
p. 36
|
artikel
|
| 45 |
The microelectronic wire bond pull test — How to use it, how to abuse it
|
|
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|
11 |
3 |
p. 35
|
artikel
|
| 46 |
Thermal compression bond failures due to incomplete sintering of alumina ceramics
|
|
|
|
11 |
3 |
p. 36
|
artikel
|
| 47 |
Thermocompression bondability of bare copper leads
|
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|
|
11 |
3 |
p. 35
|
artikel
|
| 48 |
The ultrasonic welding mechanism as applied to aluminium- and gold-wire bonding in microelectronics
|
|
|
|
11 |
3 |
p. 34
|
artikel
|
| 49 |
When — If ever — Will the CRT be replaced by a flat display panel?
|
Brody, T.P.
|
|
|
11 |
3 |
p. 5-9
|
artikel
|
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