| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A mathematical study of space-charge layer capacitance for an abrupt p-n semiconductor junction
|
|
|
|
10 |
3 |
p. 39
|
artikel
|
| 2 |
Analytical technique for the design of DMOS transistors
|
|
|
|
10 |
3 |
p. 39
|
artikel
|
| 3 |
Anodic oxidation and MOS devices of GaAs and GaP
|
|
|
|
10 |
3 |
p. 40
|
artikel
|
| 4 |
A numerical analysis of various cross sheet resistor test structures
|
|
|
|
10 |
3 |
p. 41-42
|
artikel
|
| 5 |
Application of tape automated bonding technology to hybrid microcircuits
|
|
|
|
10 |
3 |
p. 39
|
artikel
|
| 6 |
Book Review
|
Tillotson, J.
|
|
|
10 |
3 |
p. 43
|
artikel
|
| 7 |
Book Review
|
Weatherley, R.T.
|
|
|
10 |
3 |
p. 43
|
artikel
|
| 8 |
Book Review
|
Weatherley, R.T.
|
|
|
10 |
3 |
p. 43-44
|
artikel
|
| 9 |
Book Review
|
Webb, N.G.
|
|
|
10 |
3 |
p. 44
|
artikel
|
| 10 |
Book Review
|
Matthews, R.B.
|
|
|
10 |
3 |
p. 44
|
artikel
|
| 11 |
Book Review
|
Matthews, R.B.
|
|
|
10 |
3 |
p. 44
|
artikel
|
| 12 |
Cadmium telluride nuclear radiation detectors
|
|
|
|
10 |
3 |
p. 40
|
artikel
|
| 13 |
Controlling switching supplies with LSI circuits
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
| 14 |
Designing the maximum performance into bit-slice minicomputers
|
|
|
|
10 |
3 |
p. 38
|
artikel
|
| 15 |
Design of a single-stress relaxation test for pressure connections
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
| 16 |
Double-junction photosensitive devices with high uv responsivity
|
|
|
|
10 |
3 |
p. 38
|
artikel
|
| 17 |
Editorial
|
Butcher, John B.
|
|
|
10 |
3 |
p. 3
|
artikel
|
| 18 |
Effect of heat treatment on chemical and electronic structure of solid SiO; an electron spectroscopy study
|
|
|
|
10 |
3 |
p. 41
|
artikel
|
| 19 |
Electrically conductive epoxies for screen printing applications
|
|
|
|
10 |
3 |
p. 39-40
|
artikel
|
| 20 |
Extremely uniform thin films by vacuum deposition from a ‘tube source’
|
|
|
|
10 |
3 |
p. 41
|
artikel
|
| 21 |
High purity chemicals in semicon production
|
|
|
|
10 |
3 |
p. 40
|
artikel
|
| 22 |
Influence of temperature on the structure and properties of an anodised native GaAs oxide
|
|
|
|
10 |
3 |
p. 40
|
artikel
|
| 23 |
Integrated circuit regulators
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
| 24 |
Investigations of metal contacts to amorphous evaporated Ge films
|
|
|
|
10 |
3 |
p. 40
|
artikel
|
| 25 |
Invited: recent advances in microwave devices
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
| 26 |
Large-scale integration is ready to answer the call of telecommunications
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
| 27 |
Lead-indium for controlled-collapse chip joining
|
|
|
|
10 |
3 |
p. 40
|
artikel
|
| 28 |
Liquid phase epitaxy apparatus for multiple layers utilising centrifugal forces
|
|
|
|
10 |
3 |
p. 41
|
artikel
|
| 29 |
Materials selection in hybrid product design
|
|
|
|
10 |
3 |
p. 41
|
artikel
|
| 30 |
Microelectronic balanced modulator
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
| 31 |
Microprocessor architecture
|
Gruszynski, A.B.
|
|
|
10 |
3 |
p. 8-10
|
artikel
|
| 32 |
Microprocessor implementation of the kalman filter
|
Page, M.
|
|
|
10 |
3 |
p. 16-22
|
artikel
|
| 33 |
Microprocessors and integrated electronic technology
|
|
|
|
10 |
3 |
p. 38
|
artikel
|
| 34 |
Microprocessors: from characterisation to production
|
Bilbault, Michel
|
|
|
10 |
3 |
p. 11-15
|
artikel
|
| 35 |
Microprocessor trends
|
Smolin, Michael
|
|
|
10 |
3 |
p. 5-7
|
artikel
|
| 36 |
Microprogrammable digital filter implementation using bipolar microprocessors
|
Woodward, M.E.
|
|
|
10 |
3 |
p. 23-31
|
artikel
|
| 37 |
New application for Se-Ge glasses to silicon microfabrication technology
|
|
|
|
10 |
3 |
p. 41
|
artikel
|
| 38 |
New gold alloy for aluminium bonding in MOS hermetic packages
|
|
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|
10 |
3 |
p. 40
|
artikel
|
| 39 |
Non-uniformly distributed multi-layer RC phase compensating networks
|
Pal, K.
|
|
|
10 |
3 |
p. 32-37
|
artikel
|
| 40 |
Optical MTF evaluation techniques for microelectronic printers
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
| 41 |
Organics used in microelectronics: a review of outgassing materials and efforts
|
|
|
|
10 |
3 |
p. 39
|
artikel
|
| 42 |
Properties of die bond alloys relating to thermal fatigue
|
|
|
|
10 |
3 |
p. 39
|
artikel
|
| 43 |
Reduced lateral diffusion and reverse leakage in Be-implanted GaAs1−x P x diodes
|
|
|
|
10 |
3 |
p. 41
|
artikel
|
| 44 |
RGB colour decoder using three ICs from the TDA2500 range
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
| 45 |
Screening procedure for adhesion degradation due to solder leaching in thick-film hybrid microcircuits
|
|
|
|
10 |
3 |
p. 39
|
artikel
|
| 46 |
Single C-MOS-IC forms pulse-width modulator
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
| 47 |
Some investigations on secondary breakdown in p-n junctions considering the effect of thermally generated carriers
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
| 48 |
Sound velocity in amorphous Ge and Si
|
|
|
|
10 |
3 |
p. 41
|
artikel
|
| 49 |
The effect of film thickness on certain properties of Cr-SiO cermet thin films
|
|
|
|
10 |
3 |
p. 41
|
artikel
|
| 50 |
Thermal oxidation of GaAs
|
|
|
|
10 |
3 |
p. 41
|
artikel
|
| 51 |
Thin film resistor networks in hybrid circuits
|
|
|
|
10 |
3 |
p. 38-39
|
artikel
|
| 52 |
Thin film SQUIDs for magnetic field measurements
|
|
|
|
10 |
3 |
p. 40
|
artikel
|
| 53 |
Where and when to use which data converter
|
|
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|
10 |
3 |
p. 42
|
artikel
|
| 54 |
Where there's smoke, there will be an IC
|
|
|
|
10 |
3 |
p. 42
|
artikel
|
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