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                             54 results found
no title author magazine year volume issue page(s) type
1 A mathematical study of space-charge layer capacitance for an abrupt p-n semiconductor junction
10 3 p. 39
article
2 Analytical technique for the design of DMOS transistors
10 3 p. 39
article
3 Anodic oxidation and MOS devices of GaAs and GaP
10 3 p. 40
article
4 A numerical analysis of various cross sheet resistor test structures
10 3 p. 41-42
article
5 Application of tape automated bonding technology to hybrid microcircuits
10 3 p. 39
article
6 Book Review Tillotson, J.

10 3 p. 43
article
7 Book Review Weatherley, R.T.

10 3 p. 43
article
8 Book Review Weatherley, R.T.

10 3 p. 43-44
article
9 Book Review Webb, N.G.

10 3 p. 44
article
10 Book Review Matthews, R.B.

10 3 p. 44
article
11 Book Review Matthews, R.B.

10 3 p. 44
article
12 Cadmium telluride nuclear radiation detectors
10 3 p. 40
article
13 Controlling switching supplies with LSI circuits
10 3 p. 42
article
14 Designing the maximum performance into bit-slice minicomputers
10 3 p. 38
article
15 Design of a single-stress relaxation test for pressure connections
10 3 p. 42
article
16 Double-junction photosensitive devices with high uv responsivity
10 3 p. 38
article
17 Editorial Butcher, John B.

10 3 p. 3
article
18 Effect of heat treatment on chemical and electronic structure of solid SiO; an electron spectroscopy study
10 3 p. 41
article
19 Electrically conductive epoxies for screen printing applications
10 3 p. 39-40
article
20 Extremely uniform thin films by vacuum deposition from a ‘tube source’
10 3 p. 41
article
21 High purity chemicals in semicon production
10 3 p. 40
article
22 Influence of temperature on the structure and properties of an anodised native GaAs oxide
10 3 p. 40
article
23 Integrated circuit regulators
10 3 p. 42
article
24 Investigations of metal contacts to amorphous evaporated Ge films
10 3 p. 40
article
25 Invited: recent advances in microwave devices
10 3 p. 42
article
26 Large-scale integration is ready to answer the call of telecommunications
10 3 p. 42
article
27 Lead-indium for controlled-collapse chip joining
10 3 p. 40
article
28 Liquid phase epitaxy apparatus for multiple layers utilising centrifugal forces
10 3 p. 41
article
29 Materials selection in hybrid product design
10 3 p. 41
article
30 Microelectronic balanced modulator
10 3 p. 42
article
31 Microprocessor architecture Gruszynski, A.B.

10 3 p. 8-10
article
32 Microprocessor implementation of the kalman filter Page, M.

10 3 p. 16-22
article
33 Microprocessors and integrated electronic technology
10 3 p. 38
article
34 Microprocessors: from characterisation to production Bilbault, Michel

10 3 p. 11-15
article
35 Microprocessor trends Smolin, Michael

10 3 p. 5-7
article
36 Microprogrammable digital filter implementation using bipolar microprocessors Woodward, M.E.

10 3 p. 23-31
article
37 New application for Se-Ge glasses to silicon microfabrication technology
10 3 p. 41
article
38 New gold alloy for aluminium bonding in MOS hermetic packages
10 3 p. 40
article
39 Non-uniformly distributed multi-layer RC phase compensating networks Pal, K.

10 3 p. 32-37
article
40 Optical MTF evaluation techniques for microelectronic printers
10 3 p. 42
article
41 Organics used in microelectronics: a review of outgassing materials and efforts
10 3 p. 39
article
42 Properties of die bond alloys relating to thermal fatigue
10 3 p. 39
article
43 Reduced lateral diffusion and reverse leakage in Be-implanted GaAs1−x P x diodes
10 3 p. 41
article
44 RGB colour decoder using three ICs from the TDA2500 range
10 3 p. 42
article
45 Screening procedure for adhesion degradation due to solder leaching in thick-film hybrid microcircuits
10 3 p. 39
article
46 Single C-MOS-IC forms pulse-width modulator
10 3 p. 42
article
47 Some investigations on secondary breakdown in p-n junctions considering the effect of thermally generated carriers
10 3 p. 42
article
48 Sound velocity in amorphous Ge and Si
10 3 p. 41
article
49 The effect of film thickness on certain properties of Cr-SiO cermet thin films
10 3 p. 41
article
50 Thermal oxidation of GaAs
10 3 p. 41
article
51 Thin film resistor networks in hybrid circuits
10 3 p. 38-39
article
52 Thin film SQUIDs for magnetic field measurements
10 3 p. 40
article
53 Where and when to use which data converter
10 3 p. 42
article
54 Where there's smoke, there will be an IC
10 3 p. 42
article
                             54 results found
 
 Koninklijke Bibliotheek - National Library of the Netherlands