| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comprehensive study of a multiplicative elastoplasticity model coupled to damage including parameter identification
|
Mahnken, Rolf
|
|
2000
|
74 |
2 |
p. 179-200
22 p.
|
artikel
|
| 2 |
A micromechanical approach for the analysis of damage in laminated composite structures
|
Luciano, Raimondo
|
|
2000
|
74 |
2 |
p. 201-214
14 p.
|
artikel
|
| 3 |
A 14-node brick element, PN5X1, exactly representing linear stress fields
|
Bassayya, K.
|
|
2000
|
74 |
2 |
p. 147-165
19 p.
|
artikel
|
| 4 |
A 14-node brick element, PN5X1, for plates and shells
|
Bassayya, K.
|
|
2000
|
74 |
2 |
p. 167-178
12 p.
|
artikel
|
| 5 |
A three-node cable element ensuring the continuity of the horizontal tension; a clamp–cable element
|
Aufaure, M.
|
|
2000
|
74 |
2 |
p. 243-251
9 p.
|
artikel
|
| 6 |
Free vibration analysis of delaminated composite beams
|
Lee, Jaehong
|
|
2000
|
74 |
2 |
p. 121-129
9 p.
|
artikel
|
| 7 |
Stochastic multistage algorithms for multimodal structural optimization
|
Lin, C-Y.
|
|
2000
|
74 |
2 |
p. 233-241
9 p.
|
artikel
|
| 8 |
Structural responses considering the vertical component of earthquakes
|
Salazar, Alfredo Reyes
|
|
2000
|
74 |
2 |
p. 131-145
15 p.
|
artikel
|
| 9 |
Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging
|
Basaran, Cemal
|
|
2000
|
74 |
2 |
p. 215-231
17 p.
|
artikel
|
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