| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A domain decomposition method for the simulation of fracture in polysilicon MEMS
|
Confalonieri, Federica
|
|
2013
|
53 |
8 |
p. 1045-1054
10 p.
|
artikel
|
| 2 |
A multi-attribute classification fusion system for insulated gate bipolar transistor diagnostics
|
Tamilselvan, Prasanna
|
|
2013
|
53 |
8 |
p. 1117-1129
13 p.
|
artikel
|
| 3 |
Characterization of intermetallic compounds in Cu–Al ball bonds: Mechanical properties, interface delamination and thermal conductivity
|
Kouters, M.H.M.
|
|
2013
|
53 |
8 |
p. 1068-1075
8 p.
|
artikel
|
| 4 |
Design methodologies for reliability of SSL LED boards
|
Jakovenko, J.
|
|
2013
|
53 |
8 |
p. 1076-1083
8 p.
|
artikel
|
| 5 |
Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires
|
Hsueh, Hao-Wen
|
|
2013
|
53 |
8 |
p. 1159-1163
5 p.
|
artikel
|
| 6 |
Electrochemical corrosion behaviour of copper under periodic wet–dry cycle condition
|
Huang, Hualiang
|
|
2013
|
53 |
8 |
p. 1149-1158
10 p.
|
artikel
|
| 7 |
Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
|
Wymysłowski, Artur
|
|
2013
|
53 |
8 |
p. 1043-1044
2 p.
|
artikel
|
| 8 |
High-precision Berenger modes of dual-layer micro-waveguides terminated with a perfectly matched layer for on-chip optical interconnections
|
Zhu, Jianxin
|
|
2013
|
53 |
8 |
p. 1164-1167
4 p.
|
artikel
|
| 9 |
Inside front cover - Editorial board
|
|
|
2013
|
53 |
8 |
p. IFC-
1 p.
|
artikel
|
| 10 |
Low gate interface traps AlGaN/GaN HEMTs using a lattice matched ZrZnO transparent gate design
|
Chiu, Hsien-Chin
|
|
2013
|
53 |
8 |
p. 1130-1136
7 p.
|
artikel
|
| 11 |
Mechanical problems of novel back contact solar modules
|
Kraemer, Frank
|
|
2013
|
53 |
8 |
p. 1095-1100
6 p.
|
artikel
|
| 12 |
Modelling methodology for thermal analysis of hot solder dip process
|
Stoyanov, Stoyan
|
|
2013
|
53 |
8 |
p. 1055-1067
13 p.
|
artikel
|
| 13 |
Molecularly derived mesoscale modeling of an epoxy/Cu interface: Interface roughness
|
Iwamoto, Nancy
|
|
2013
|
53 |
8 |
p. 1101-1110
10 p.
|
artikel
|
| 14 |
Self-alignment of micro-parts using capillary interaction: Unified modeling and misalignment analysis
|
Gao, ShiQing
|
|
2013
|
53 |
8 |
p. 1137-1148
12 p.
|
artikel
|
| 15 |
Thermal resistance investigations on new leadframe-based LED packages and boards
|
Pardo, B.
|
|
2013
|
53 |
8 |
p. 1084-1094
11 p.
|
artikel
|
| 16 |
Transport of moisture at epoxy–SiO2 interfaces investigated by molecular modeling
|
Hölck, O.
|
|
2013
|
53 |
8 |
p. 1111-1116
6 p.
|
artikel
|
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