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Journal description
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Details for article 3 of 16 found articles
| Title: |
Characterization of intermetallic compounds in Cu–Al ball bonds: Mechanical properties, interface delamination and thermal conductivity |
| Author: |
Kouters, M.H.M. Gubbels, G.H.M. Dos Santos Ferreira, O. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 53 (2013) nr. 8 pages 8 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 16 found articles
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