| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Advanced analysis on board trace reliability of WLCSP under drop impact
|
Syed, Ahmer
|
|
2010
|
50 |
7 |
p. 928-936
9 p.
|
artikel
|
| 2 |
A multi-scale approach for investigation of interfacial delamination in electronic packages
|
Fan, Hai Bo
|
|
2010
|
50 |
7 |
p. 893-899
7 p.
|
artikel
|
| 3 |
Assembly reliability assessment and life estimation for a stacked area array device
|
Satyanarayan Iyer,
|
|
2010
|
50 |
7 |
p. 978-985
8 p.
|
artikel
|
| 4 |
Calendar
|
|
|
2010
|
50 |
7 |
p. I-III
nvt p.
|
artikel
|
| 5 |
Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs
|
Farley, D.
|
|
2010
|
50 |
7 |
p. 937-947
11 p.
|
artikel
|
| 6 |
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package
|
Ong, Yue Ying
|
|
2010
|
50 |
7 |
p. 986-994
9 p.
|
artikel
|
| 7 |
Dynamic responses of PCB under product-level free drop impact
|
Yu, Da
|
|
2010
|
50 |
7 |
p. 1028-1038
11 p.
|
artikel
|
| 8 |
Effect of glue on reliability of flip chip BGA packages under thermal cycling
|
Nguyen, Tung T.
|
|
2010
|
50 |
7 |
p. 1000-1006
7 p.
|
artikel
|
| 9 |
Electron transport in two dimensional electron gas formed at the heterojunction of Al x Ga(1− x )N/GaN at microwave frequencies
|
Chakraborty, A.
|
|
2010
|
50 |
7 |
p. 965-970
6 p.
|
artikel
|
| 10 |
Experimental study of WL-CSP reliability subjected to a four-point bend-test
|
Le Coq, Cédric
|
|
2010
|
50 |
7 |
p. 1007-1013
7 p.
|
artikel
|
| 11 |
Failure and degradation mechanisms of high-power white light emitting diodes
|
Yang, Shih-Chun
|
|
2010
|
50 |
7 |
p. 959-964
6 p.
|
artikel
|
| 12 |
Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
|
Wymysłowski, Artur
|
|
2010
|
50 |
7 |
p. 891-892
2 p.
|
artikel
|
| 13 |
Improved electrical characteristics and reliability of amorphous InGaZnO metal–insulator–semiconductor capacitor with high κ HfO x N y gate dielectric
|
Zou, Xiao
|
|
2010
|
50 |
7 |
p. 954-958
5 p.
|
artikel
|
| 14 |
Inside front cover - Editorial board
|
|
|
2010
|
50 |
7 |
p. IFC-
1 p.
|
artikel
|
| 15 |
Interface delamination analysis of TQFP package during solder reflow
|
Guojun, Hu
|
|
2010
|
50 |
7 |
p. 1014-1020
7 p.
|
artikel
|
| 16 |
Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation
|
Young, Wen-Bin
|
|
2010
|
50 |
7 |
p. 995-999
5 p.
|
artikel
|
| 17 |
Modeling of board-level package by Finite Element Analysis and laser interferometer measurements
|
Zhang, Bo
|
|
2010
|
50 |
7 |
p. 1021-1027
7 p.
|
artikel
|
| 18 |
Molecular dynamics approach to structure–property correlation in epoxy resins for thermo-mechanical lifetime modeling
|
Wunderle, B.
|
|
2010
|
50 |
7 |
p. 900-909
10 p.
|
artikel
|
| 19 |
Optimization of high voltage LDMOSFETs with complex multiple-resistivity drift region and field plate
|
Chang, Yang-Hua
|
|
2010
|
50 |
7 |
p. 949-953
5 p.
|
artikel
|
| 20 |
Prediction of cure induced warpage of micro-electronic products
|
de Vreugd, J.
|
|
2010
|
50 |
7 |
p. 910-916
7 p.
|
artikel
|
| 21 |
Prediction of the epoxy moulding compound aging effect on package reliability
|
Noijen, Sander
|
|
2010
|
50 |
7 |
p. 917-922
6 p.
|
artikel
|
| 22 |
Reliability modeling on a MOSFET power package based on embedded die technology
|
Yang, Daoguo
|
|
2010
|
50 |
7 |
p. 923-927
5 p.
|
artikel
|
| 23 |
Strength violation effect on soft-error detection in sub-micron technology
|
Javaheri, R.
|
|
2010
|
50 |
7 |
p. 971-977
7 p.
|
artikel
|
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