nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A method to eliminate the event accumulation problem from a memory affected by multiple bit upsets
|
Antonio Maestro, Juan |
|
2009 |
49 |
7 |
p. 707-715 9 p. |
artikel |
2 |
A new two-dimensional subthreshold behavior model for the short-channel asymmetrical dual-material double-gate (ADMDG) MOSFET’s
|
Chiang, Te-Kuang |
|
2009 |
49 |
7 |
p. 693-698 6 p. |
artikel |
3 |
A surface potential and quasi-Fermi potential based drain current model for pocket-implanted MOS transistors in subthreshold regime
|
Baishya, S. |
|
2009 |
49 |
7 |
p. 681-688 8 p. |
artikel |
4 |
Calendar
|
|
|
2009 |
49 |
7 |
p. I-II nvt p. |
artikel |
5 |
Drop impact reliability of edge-bonded lead-free chip scale packages
|
Farris, Andrew |
|
2009 |
49 |
7 |
p. 761-770 10 p. |
artikel |
6 |
Dynamic performance of graded channel DG FD SOI n-MOSFETs for minimizing the gate misalignment effect
|
Sharma, Rupendra Kumar |
|
2009 |
49 |
7 |
p. 699-706 8 p. |
artikel |
7 |
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints
|
Jen, Ming-Hwa R. |
|
2009 |
49 |
7 |
p. 734-745 12 p. |
artikel |
8 |
Fabrication of micro-moiré gratings on a strain sensor structure for deformation analysis with micro-moiré technique
|
Xie, Huimin |
|
2009 |
49 |
7 |
p. 727-733 7 p. |
artikel |
9 |
Feasibility study of non-conductive film (NCF) for plasma display panel (PDP) application
|
Hwang, Jin-Sang |
|
2009 |
49 |
7 |
p. 806-812 7 p. |
artikel |
10 |
Indirect fitting procedure to separate the effects of mobility degradation and source-and-drain resistance in MOSFET parameter extraction
|
Ortiz-Conde, Adelmo |
|
2009 |
49 |
7 |
p. 689-692 4 p. |
artikel |
11 |
Inside front cover - Editorial board
|
|
|
2009 |
49 |
7 |
p. IFC- 1 p. |
artikel |
12 |
Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages
|
Gain, Asit Kumar |
|
2009 |
49 |
7 |
p. 746-753 8 p. |
artikel |
13 |
Intrinsic stress fracture energy measurements for PECVD thin films in the SiO x C y N z:H system
|
King, S.W. |
|
2009 |
49 |
7 |
p. 721-726 6 p. |
artikel |
14 |
Measuring stress next to Au ball bond during high temperature aging
|
Mayer, M. |
|
2009 |
49 |
7 |
p. 771-781 11 p. |
artikel |
15 |
Multi-functional systolic array with reconfigurable micro-power processing elements
|
Milovanović, E.I. |
|
2009 |
49 |
7 |
p. 813-820 8 p. |
artikel |
16 |
[No title]
|
Amin, Ahmed |
|
2009 |
49 |
7 |
p. 821-822 2 p. |
artikel |
17 |
Prototyping of a reliable 3D flexible IC cube package by laser micromachining
|
Berényi, Richárd |
|
2009 |
49 |
7 |
p. 800-805 6 p. |
artikel |
18 |
Reliability analysis of temperature step-stress tests on III–V high concentrator solar cells
|
González, José Ramón |
|
2009 |
49 |
7 |
p. 673-680 8 p. |
artikel |
19 |
Sensitivity analysis of simplified Printed Circuit Board finite element models
|
Amy, Robin Alastair |
|
2009 |
49 |
7 |
p. 791-799 9 p. |
artikel |
20 |
The characterization of electrically conductive silver ink patterns on flexible substrates
|
Merilampi, S. |
|
2009 |
49 |
7 |
p. 782-790 9 p. |
artikel |
21 |
The influence of electron-beam irradiation on electrical characteristics of metal–insulator–semiconductor capacitors based on a high-k dielectric stack of HfTiSiO(N) and HfTiO(N) layers
|
Thangadurai, P. |
|
2009 |
49 |
7 |
p. 716-720 5 p. |
artikel |
22 |
Vibration reliability test and finite element analysis for flip chip solder joints
|
Che, F.X. |
|
2009 |
49 |
7 |
p. 754-760 7 p. |
artikel |