| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A method to eliminate the event accumulation problem from a memory affected by multiple bit upsets
|
Antonio Maestro, Juan
|
|
2009
|
49 |
7 |
p. 707-715
9 p.
|
article
|
| 2 |
A new two-dimensional subthreshold behavior model for the short-channel asymmetrical dual-material double-gate (ADMDG) MOSFET’s
|
Chiang, Te-Kuang
|
|
2009
|
49 |
7 |
p. 693-698
6 p.
|
article
|
| 3 |
A surface potential and quasi-Fermi potential based drain current model for pocket-implanted MOS transistors in subthreshold regime
|
Baishya, S.
|
|
2009
|
49 |
7 |
p. 681-688
8 p.
|
article
|
| 4 |
Calendar
|
|
|
2009
|
49 |
7 |
p. I-II
nvt p.
|
article
|
| 5 |
Drop impact reliability of edge-bonded lead-free chip scale packages
|
Farris, Andrew
|
|
2009
|
49 |
7 |
p. 761-770
10 p.
|
article
|
| 6 |
Dynamic performance of graded channel DG FD SOI n-MOSFETs for minimizing the gate misalignment effect
|
Sharma, Rupendra Kumar
|
|
2009
|
49 |
7 |
p. 699-706
8 p.
|
article
|
| 7 |
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints
|
Jen, Ming-Hwa R.
|
|
2009
|
49 |
7 |
p. 734-745
12 p.
|
article
|
| 8 |
Fabrication of micro-moiré gratings on a strain sensor structure for deformation analysis with micro-moiré technique
|
Xie, Huimin
|
|
2009
|
49 |
7 |
p. 727-733
7 p.
|
article
|
| 9 |
Feasibility study of non-conductive film (NCF) for plasma display panel (PDP) application
|
Hwang, Jin-Sang
|
|
2009
|
49 |
7 |
p. 806-812
7 p.
|
article
|
| 10 |
Indirect fitting procedure to separate the effects of mobility degradation and source-and-drain resistance in MOSFET parameter extraction
|
Ortiz-Conde, Adelmo
|
|
2009
|
49 |
7 |
p. 689-692
4 p.
|
article
|
| 11 |
Inside front cover - Editorial board
|
|
|
2009
|
49 |
7 |
p. IFC-
1 p.
|
article
|
| 12 |
Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages
|
Gain, Asit Kumar
|
|
2009
|
49 |
7 |
p. 746-753
8 p.
|
article
|
| 13 |
Intrinsic stress fracture energy measurements for PECVD thin films in the SiO x C y N z:H system
|
King, S.W.
|
|
2009
|
49 |
7 |
p. 721-726
6 p.
|
article
|
| 14 |
Measuring stress next to Au ball bond during high temperature aging
|
Mayer, M.
|
|
2009
|
49 |
7 |
p. 771-781
11 p.
|
article
|
| 15 |
Multi-functional systolic array with reconfigurable micro-power processing elements
|
Milovanović, E.I.
|
|
2009
|
49 |
7 |
p. 813-820
8 p.
|
article
|
| 16 |
[No title]
|
Amin, Ahmed
|
|
2009
|
49 |
7 |
p. 821-822
2 p.
|
article
|
| 17 |
Prototyping of a reliable 3D flexible IC cube package by laser micromachining
|
Berényi, Richárd
|
|
2009
|
49 |
7 |
p. 800-805
6 p.
|
article
|
| 18 |
Reliability analysis of temperature step-stress tests on III–V high concentrator solar cells
|
González, José Ramón
|
|
2009
|
49 |
7 |
p. 673-680
8 p.
|
article
|
| 19 |
Sensitivity analysis of simplified Printed Circuit Board finite element models
|
Amy, Robin Alastair
|
|
2009
|
49 |
7 |
p. 791-799
9 p.
|
article
|
| 20 |
The characterization of electrically conductive silver ink patterns on flexible substrates
|
Merilampi, S.
|
|
2009
|
49 |
7 |
p. 782-790
9 p.
|
article
|
| 21 |
The influence of electron-beam irradiation on electrical characteristics of metal–insulator–semiconductor capacitors based on a high-k dielectric stack of HfTiSiO(N) and HfTiO(N) layers
|
Thangadurai, P.
|
|
2009
|
49 |
7 |
p. 716-720
5 p.
|
article
|
| 22 |
Vibration reliability test and finite element analysis for flip chip solder joints
|
Che, F.X.
|
|
2009
|
49 |
7 |
p. 754-760
7 p.
|
article
|
Journal description