| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Analysis of punch-through breakdown in bulk silicon RF power LDMOS transistors
|
Cortés, I.
|
|
2008
|
48 |
2 |
p. 173-180
8 p.
|
artikel
|
| 2 |
Comparison of thermoreflectance and scanning thermal microscopy for microelectronic device temperature variation imaging: Calibration and resolution issues
|
Grauby, Stéphane
|
|
2008
|
48 |
2 |
p. 204-211
8 p.
|
artikel
|
| 3 |
Digital image correlation for solder joint fatigue reliability in microelectronics packages
|
Sun, Yaofeng
|
|
2008
|
48 |
2 |
p. 310-318
9 p.
|
artikel
|
| 4 |
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application
|
Hwang, J.S.
|
|
2008
|
48 |
2 |
p. 293-299
7 p.
|
artikel
|
| 5 |
Effects of different drop test conditions on board-level reliability of chip-scale packages
|
Lai, Yi-Shao
|
|
2008
|
48 |
2 |
p. 274-281
8 p.
|
artikel
|
| 6 |
Electrical stress effect on RF power characteristics of SiGe hetero-junction bipolar transistors
|
Huang, Sheng-Yi
|
|
2008
|
48 |
2 |
p. 193-199
7 p.
|
artikel
|
| 7 |
Error propagation analysis using FPGA-based SEU-fault injection
|
Ejlali, Alireza
|
|
2008
|
48 |
2 |
p. 319-328
10 p.
|
artikel
|
| 8 |
Estimation of warpage and thermal stress of IVHs in flip–chip ball grid arrays package by FEM
|
Cho, Seunghyun
|
|
2008
|
48 |
2 |
p. 300-309
10 p.
|
artikel
|
| 9 |
Improved performances of a two-step passivated heterojunction bipolar transistor
|
Cheng, Shiou-Ying
|
|
2008
|
48 |
2 |
p. 200-203
4 p.
|
artikel
|
| 10 |
Influence of sidewall spacer on threshold voltage of MOSFET with high-k gate dielectric
|
Xu, J.P.
|
|
2008
|
48 |
2 |
p. 181-186
6 p.
|
artikel
|
| 11 |
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops
|
Yeh, Chang-Lin
|
|
2008
|
48 |
2 |
p. 282-292
11 p.
|
artikel
|
| 12 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
2 |
p. 331-332
2 p.
|
artikel
|
| 13 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
2 |
p. 333-334
2 p.
|
artikel
|
| 14 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
2 |
p. 329-330
2 p.
|
artikel
|
| 15 |
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy
|
Valdevit, L.
|
|
2008
|
48 |
2 |
p. 245-260
16 p.
|
artikel
|
| 16 |
Reservoir effect in SiCN capped copper/SiO2 interconnects
|
Girault, V.
|
|
2008
|
48 |
2 |
p. 219-224
6 p.
|
artikel
|
| 17 |
Silicon oxynitride integrated waveguide for on-chip optical interconnects applications
|
Wong, C.K.
|
|
2008
|
48 |
2 |
p. 212-218
7 p.
|
artikel
|
| 18 |
The application of polyimide/silicon nitride dual passivation to Al x Ga1−x N/GaN high electron mobility transistors
|
Lau, W.S.
|
|
2008
|
48 |
2 |
p. 187-192
6 p.
|
artikel
|
| 19 |
Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
|
Kandasamy, Ravi
|
|
2008
|
48 |
2 |
p. 261-273
13 p.
|
artikel
|
| 20 |
Thermal stress concentration factors for defects in plated-through-vias
|
Belashov, O.
|
|
2008
|
48 |
2 |
p. 225-244
20 p.
|
artikel
|
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