nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
An experimental approach to characterize rate-dependent failure envelopes and failure site transitions in surface mount assemblies
|
Varghese, J. |
|
2007 |
47 |
7 |
p. 1095-1102 8 p. |
artikel |
2 |
Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process
|
Md Arshad, M.K. |
|
2007 |
47 |
7 |
p. 1120-1126 7 p. |
artikel |
3 |
Design automation to suppress cable discharge event (CDE) induced latchup in 90nm CMOS ASICs
|
Brennan, Ciaran J. |
|
2007 |
47 |
7 |
p. 1069-1073 5 p. |
artikel |
4 |
Effects of device aging on microelectronics radiation response and reliability
|
Fleetwood, D.M. |
|
2007 |
47 |
7 |
p. 1075-1085 11 p. |
artikel |
5 |
Empirical correlation between package-level ball impact test and board-level drop reliability
|
Yeh, Chang-Lin |
|
2007 |
47 |
7 |
p. 1127-1134 8 p. |
artikel |
6 |
Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for semiconductor packaging technology
|
Kung, Huang-Kuang |
|
2007 |
47 |
7 |
p. 1103-1112 10 p. |
artikel |
7 |
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests
|
Laurila, T. |
|
2007 |
47 |
7 |
p. 1135-1144 10 p. |
artikel |
8 |
Experience in HBM ESD testing of high pin count devices
|
Brodbeck, Tilo |
|
2007 |
47 |
7 |
p. 1025-1029 5 p. |
artikel |
9 |
Guest editorial
|
Stadler, Wolfgang |
|
2007 |
47 |
7 |
p. 999- 1 p. |
artikel |
10 |
Implementation of diode and bipolar triggered SCRs for CDM robust ESD protection in 90nm CMOS ASICs
|
Brennan, Ciaran J. |
|
2007 |
47 |
7 |
p. 1030-1035 6 p. |
artikel |
11 |
Integration of an SCR in an active clamp
|
Reynders, K. |
|
2007 |
47 |
7 |
p. 1054-1059 6 p. |
artikel |
12 |
Measurement and analysis of contact resistance in wafer probe testing
|
Liu, D.S. |
|
2007 |
47 |
7 |
p. 1086-1094 9 p. |
artikel |
13 |
[No title]
|
Stojcev, Mile |
|
2007 |
47 |
7 |
p. 1153-1154 2 p. |
artikel |
14 |
Properties of low temperature Sn–Ag–Bi–In solder systems
|
Kim, Keun-Soo |
|
2007 |
47 |
7 |
p. 1113-1119 7 p. |
artikel |
15 |
RF ESD protection strategies: Codesign vs. low-C protection
|
Soldner, W. |
|
2007 |
47 |
7 |
p. 1008-1015 8 p. |
artikel |
16 |
SCR-based ESD protection in nanometer SOI technologies
|
Marichal, Olivier |
|
2007 |
47 |
7 |
p. 1060-1068 9 p. |
artikel |
17 |
SCR operation mode of diode strings for ESD protection
|
Glaser, Ulrich |
|
2007 |
47 |
7 |
p. 1044-1053 10 p. |
artikel |
18 |
Selecting an appropriate ESD protection for discrete RF power LDMOSTs
|
Smedes, T. |
|
2007 |
47 |
7 |
p. 1000-1007 8 p. |
artikel |
19 |
Spice-aided modelling of the UC3842 current mode PWM controller with selfheating taken into account
|
Zarębski, Janusz |
|
2007 |
47 |
7 |
p. 1145-1152 8 p. |
artikel |
20 |
Transient voltage overshoot in TLP testing – Real or artifact?
|
Trémouilles, D. |
|
2007 |
47 |
7 |
p. 1016-1024 9 p. |
artikel |
21 |
Verification of CDM circuit simulation using an ESD evaluation circuit
|
Etherton, M. |
|
2007 |
47 |
7 |
p. 1036-1043 8 p. |
artikel |