| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
An experimental approach to characterize rate-dependent failure envelopes and failure site transitions in surface mount assemblies
|
Varghese, J.
|
|
2007
|
47 |
7 |
p. 1095-1102
8 p.
|
article
|
| 2 |
Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process
|
Md Arshad, M.K.
|
|
2007
|
47 |
7 |
p. 1120-1126
7 p.
|
article
|
| 3 |
Design automation to suppress cable discharge event (CDE) induced latchup in 90nm CMOS ASICs
|
Brennan, Ciaran J.
|
|
2007
|
47 |
7 |
p. 1069-1073
5 p.
|
article
|
| 4 |
Effects of device aging on microelectronics radiation response and reliability
|
Fleetwood, D.M.
|
|
2007
|
47 |
7 |
p. 1075-1085
11 p.
|
article
|
| 5 |
Empirical correlation between package-level ball impact test and board-level drop reliability
|
Yeh, Chang-Lin
|
|
2007
|
47 |
7 |
p. 1127-1134
8 p.
|
article
|
| 6 |
Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for semiconductor packaging technology
|
Kung, Huang-Kuang
|
|
2007
|
47 |
7 |
p. 1103-1112
10 p.
|
article
|
| 7 |
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests
|
Laurila, T.
|
|
2007
|
47 |
7 |
p. 1135-1144
10 p.
|
article
|
| 8 |
Experience in HBM ESD testing of high pin count devices
|
Brodbeck, Tilo
|
|
2007
|
47 |
7 |
p. 1025-1029
5 p.
|
article
|
| 9 |
Guest editorial
|
Stadler, Wolfgang
|
|
2007
|
47 |
7 |
p. 999-
1 p.
|
article
|
| 10 |
Implementation of diode and bipolar triggered SCRs for CDM robust ESD protection in 90nm CMOS ASICs
|
Brennan, Ciaran J.
|
|
2007
|
47 |
7 |
p. 1030-1035
6 p.
|
article
|
| 11 |
Integration of an SCR in an active clamp
|
Reynders, K.
|
|
2007
|
47 |
7 |
p. 1054-1059
6 p.
|
article
|
| 12 |
Measurement and analysis of contact resistance in wafer probe testing
|
Liu, D.S.
|
|
2007
|
47 |
7 |
p. 1086-1094
9 p.
|
article
|
| 13 |
[No title]
|
Stojcev, Mile
|
|
2007
|
47 |
7 |
p. 1153-1154
2 p.
|
article
|
| 14 |
Properties of low temperature Sn–Ag–Bi–In solder systems
|
Kim, Keun-Soo
|
|
2007
|
47 |
7 |
p. 1113-1119
7 p.
|
article
|
| 15 |
RF ESD protection strategies: Codesign vs. low-C protection
|
Soldner, W.
|
|
2007
|
47 |
7 |
p. 1008-1015
8 p.
|
article
|
| 16 |
SCR-based ESD protection in nanometer SOI technologies
|
Marichal, Olivier
|
|
2007
|
47 |
7 |
p. 1060-1068
9 p.
|
article
|
| 17 |
SCR operation mode of diode strings for ESD protection
|
Glaser, Ulrich
|
|
2007
|
47 |
7 |
p. 1044-1053
10 p.
|
article
|
| 18 |
Selecting an appropriate ESD protection for discrete RF power LDMOSTs
|
Smedes, T.
|
|
2007
|
47 |
7 |
p. 1000-1007
8 p.
|
article
|
| 19 |
Spice-aided modelling of the UC3842 current mode PWM controller with selfheating taken into account
|
Zarębski, Janusz
|
|
2007
|
47 |
7 |
p. 1145-1152
8 p.
|
article
|
| 20 |
Transient voltage overshoot in TLP testing – Real or artifact?
|
Trémouilles, D.
|
|
2007
|
47 |
7 |
p. 1016-1024
9 p.
|
article
|
| 21 |
Verification of CDM circuit simulation using an ESD evaluation circuit
|
Etherton, M.
|
|
2007
|
47 |
7 |
p. 1036-1043
8 p.
|
article
|
Journal description