nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill
|
Xie, D.J. |
|
2000 |
40 |
7 |
p. 1191-1198 8 p. |
artikel |
2 |
An investigation on the plasma treatment of integrated circuit bond pads
|
Chong, Y.F |
|
2000 |
40 |
7 |
p. 1199-1206 8 p. |
artikel |
3 |
Assembly-level reliability of flex-substrate BGA, elastomer-on-flex packages and 0.5 mm pitch partial array packages
|
Lall, Pradeep |
|
2000 |
40 |
7 |
p. 1081-1095 15 p. |
artikel |
4 |
Bonding strengths at plastic encapsulant–gold-plated copper leadframe interface
|
Yi, Sung |
|
2000 |
40 |
7 |
p. 1207-1214 8 p. |
artikel |
5 |
Chip scale package issues
|
Ghaffarian, Reza |
|
2000 |
40 |
7 |
p. 1157-1161 5 p. |
artikel |
6 |
Coupled package-device modeling for microelectromechanical systems
|
Bart, Stephen F |
|
2000 |
40 |
7 |
p. 1235-1241 7 p. |
artikel |
7 |
Electro-conductive adhesives for high density package and flip-chip interconnections
|
Wojciechowski, Dominique |
|
2000 |
40 |
7 |
p. 1215-1226 12 p. |
artikel |
8 |
Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies
|
Okura, J.H |
|
2000 |
40 |
7 |
p. 1173-1180 8 p. |
artikel |
9 |
In process stress analysis of flip-chip assemblies during underfill cure
|
Palaniappan, P |
|
2000 |
40 |
7 |
p. 1181-1190 10 p. |
artikel |
10 |
Mechanical cycling fatigue of PBGA package interconnects
|
Leicht, Larry |
|
2000 |
40 |
7 |
p. 1129-1133 5 p. |
artikel |
11 |
Method for rapid testing of thermo-mechanical characteristics of solder joints
|
Nowottnick, M |
|
2000 |
40 |
7 |
p. 1135-1146 12 p. |
artikel |
12 |
Near-CSP plastic ball grid array
|
Owens, Norman L |
|
2000 |
40 |
7 |
p. 1109-1116 8 p. |
artikel |
13 |
[No title]
|
Danto, Yves |
|
2000 |
40 |
7 |
p. 1069-1071 3 p. |
artikel |
14 |
Reliability evaluation of adhesive bonded SMT components in industrial applications
|
Périchaud, M.G. |
|
2000 |
40 |
7 |
p. 1227-1234 8 p. |
artikel |
15 |
Reliability of new packaging concepts
|
Sinnadurai, Nihal |
|
2000 |
40 |
7 |
p. 1073-1080 8 p. |
artikel |
16 |
Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method
|
Evans, John W |
|
2000 |
40 |
7 |
p. 1147-1155 9 p. |
artikel |
17 |
Solder joint fatigue life of fine pitch BGAs – impact of design and material choices
|
Darveaux, Robert |
|
2000 |
40 |
7 |
p. 1117-1127 11 p. |
artikel |
18 |
Thermo-mechanical finite element analysis in press-packed IGBT design
|
Pirondi, A |
|
2000 |
40 |
7 |
p. 1163-1172 10 p. |
artikel |
19 |
Vibration reliability characterization of PBGA assemblies
|
Yang, Q.J |
|
2000 |
40 |
7 |
p. 1097-1107 11 p. |
artikel |