| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A novel fast technique for detecting voiding damage in IC interconnects
|
Foley, S.
|
|
2000
|
40 |
1 |
p. 87-97
11 p.
|
artikel
|
| 2 |
An overview of radiation effects on electronics in the space telecommunications environment
|
Fleetwood, Daniel M.
|
|
2000
|
40 |
1 |
p. 17-26
10 p.
|
artikel
|
| 3 |
A square ring on square ring (SoS) ceramic strength testing technique for VLSI packaging
|
Villani, Angelo
|
|
2000
|
40 |
1 |
p. 131-144
14 p.
|
artikel
|
| 4 |
Drain breakdown in submicron MOSFETs: a review
|
Wong, Hei
|
|
2000
|
40 |
1 |
p. 3-15
13 p.
|
artikel
|
| 5 |
Electrically and radiation induced leakage currents in thin oxides
|
Scarpa, A
|
|
2000
|
40 |
1 |
p. 57-67
11 p.
|
artikel
|
| 6 |
Extension of a multilayer interconnection technology in MCM-Si with opto-electronic facilities
|
De Pauw , H.
|
|
2000
|
40 |
1 |
p. 163-170
8 p.
|
artikel
|
| 7 |
1/f, g–r and burst noise used as a screening threshold for reliability estimation of optoelectronic coupled devices
|
Xu, Jiansheng
|
|
2000
|
40 |
1 |
p. 171-178
8 p.
|
artikel
|
| 8 |
Historical overview and future of optoelectronics reliability for optical fiber communication systems
|
Fukuda, Mitsuo
|
|
2000
|
40 |
1 |
p. 27-35
9 p.
|
artikel
|
| 9 |
Hot carrier degradation for narrow width MOSFET with shallow trench isolation
|
Lee, Woosung
|
|
2000
|
40 |
1 |
p. 49-56
8 p.
|
artikel
|
| 10 |
Influence of chemical corrosion on resistivity and 1/f noise of polysilicon gauges
|
Michelutti, L.
|
|
2000
|
40 |
1 |
p. 179-183
5 p.
|
artikel
|
| 11 |
Influence of gate oxide breakdown on MOSFET device operation
|
Pompl, T.
|
|
2000
|
40 |
1 |
p. 37-47
11 p.
|
artikel
|
| 12 |
Microstructure and electromigration in copper damascene lines
|
Arnaud, Lucile
|
|
2000
|
40 |
1 |
p. 77-86
10 p.
|
artikel
|
| 13 |
Modular approach of a high current MOS compact model for circuit-level ESD simulation including transient gate-coupling behaviour
|
Mergens, Markus
|
|
2000
|
40 |
1 |
p. 99-115
17 p.
|
artikel
|
| 14 |
[No title]
|
Stojadinović, Ninoslav
|
|
2000
|
40 |
1 |
p. 1-
1 p.
|
artikel
|
| 15 |
Overload fracture of package solder joints
|
Katchmar, Roman
|
|
2000
|
40 |
1 |
p. 123-129
7 p.
|
artikel
|
| 16 |
Surface electromigration in copper interconnects
|
McCusker, N.D
|
|
2000
|
40 |
1 |
p. 69-76
8 p.
|
artikel
|
| 17 |
The effect of silicide on ESD performance of transistors
|
Notermans, Guido
|
|
2000
|
40 |
1 |
p. 117-122
6 p.
|
artikel
|
| 18 |
Thermal characterisation of power modules
|
Masana, F.N.
|
|
2000
|
40 |
1 |
p. 155-161
7 p.
|
artikel
|
| 19 |
Thermal reliability of gold–aluminum bonds encapsulated in bi-phenyl epoxy resin
|
Uno, Tomohiro
|
|
2000
|
40 |
1 |
p. 145-153
9 p.
|
artikel
|
Tijdschrift beschrijving