| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Al thermomigration applied to the formation of deep junctions for power device insulation
|
Dilhac, J-M.
|
|
1999
|
39 |
1 |
p. 23-27
5 p.
|
artikel
|
| 2 |
Analysis of high temperature effects on performances and hot-carrier degradation in DC/AC stressed 0.35 μm n-MOSFETs
|
Bravaix, A.
|
|
1999
|
39 |
1 |
p. 35-44
10 p.
|
artikel
|
| 3 |
A new failure mechanism by corrosion of tungsten in a tungsten plug process
|
Bothra, S.
|
|
1999
|
39 |
1 |
p. 59-68
10 p.
|
artikel
|
| 4 |
An insulated gate bipolar transistor employing the plugged n+ anode
|
Chun, J.H
|
|
1999
|
39 |
1 |
p. 29-33
5 p.
|
artikel
|
| 5 |
A step forward in the transient thermal characterization of chips and packages
|
Szkely, V.
|
|
1999
|
39 |
1 |
p. 89-96
8 p.
|
artikel
|
| 6 |
A study on the leakage current of poly-Si TFTs fabricated by metal induced lateral crystallization
|
Ihn, Tae-Hyung
|
|
1999
|
39 |
1 |
p. 53-58
6 p.
|
artikel
|
| 7 |
Avoidance of stiction in the release of highly boron doped micro-actuators fabricated using BESOI substrates
|
Rosa, M.A
|
|
1999
|
39 |
1 |
p. 139-142
4 p.
|
artikel
|
| 8 |
Ball grid array reliability assessment for aerospace applications
|
Ghaffarian, R
|
|
1999
|
39 |
1 |
p. 107-112
6 p.
|
artikel
|
| 9 |
Book review
|
|
|
1999
|
39 |
1 |
p. 147-
1 p.
|
artikel
|
| 10 |
Book review
|
|
|
1999
|
39 |
1 |
p. 149-
1 p.
|
artikel
|
| 11 |
Book review
|
|
|
1999
|
39 |
1 |
p. 145-
1 p.
|
artikel
|
| 12 |
Dislocation multiplication inside contact holes
|
Hsieh, Y.F.
|
|
1999
|
39 |
1 |
p. 15-22
8 p.
|
artikel
|
| 13 |
Editorial
|
|
|
1999
|
39 |
1 |
p. 1-
1 p.
|
artikel
|
| 14 |
Failure analysis for RF characteristics of GaAs MESFETs
|
Kyoung Mun, Jae
|
|
1999
|
39 |
1 |
p. 69-75
7 p.
|
artikel
|
| 15 |
High current bond design rules based on bond pad degradation and fusing of the wire
|
Krabbenborg, B.
|
|
1999
|
39 |
1 |
p. 77-88
12 p.
|
artikel
|
| 16 |
Hot carrier effects in polycrystalline silicon thin-film transistors: analysis of electrical characteristics and noise performance modifications
|
Mariucci, L
|
|
1999
|
39 |
1 |
p. 45-52
8 p.
|
artikel
|
| 17 |
Interconnect resistance characteristics of several flip-chip bumping and assembly techniques
|
Nicewarner, Earl
|
|
1999
|
39 |
1 |
p. 113-121
9 p.
|
artikel
|
| 18 |
Investigation of MOSFET operation in bipolar mode
|
Pershenkov, V.S.
|
|
1999
|
39 |
1 |
p. 133-137
5 p.
|
artikel
|
| 19 |
Plasma cleaning of plastic ball grid array package
|
Lee, C
|
|
1999
|
39 |
1 |
p. 97-105
9 p.
|
artikel
|
| 20 |
Recent advances in the theory of oxide–semiconductor interfaces 1 1 An earlier version of this paper was presented as an invited paper at the 9th Workshop on Dielectrics in Microelectronics, Toulouse, 11–13 March, 1998.
|
Edwards, Arthur H.
|
|
1999
|
39 |
1 |
p. 3-14
12 p.
|
artikel
|
| 21 |
Thermal resistance degradation of surface mounted power devices during thermal cycling
|
Naderman, J
|
|
1999
|
39 |
1 |
p. 123-132
10 p.
|
artikel
|
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