| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A bound heuristic algorithm for solving reliability redundancy optimization
|
Li Jianping,
|
|
1996
|
36 |
3 |
p. 335-339
5 p.
|
artikel
|
| 2 |
A contribution to the design of plastic packages for high voltage power integrated circuits
|
|
|
1996
|
36 |
3 |
p. 448-449
2 p.
|
artikel
|
| 3 |
Active doping instability in n+−p silicon surface avalanche diodes
|
|
|
1996
|
36 |
3 |
p. 452-
1 p.
|
artikel
|
| 4 |
A fault-tolerant permutation network modulo arithmetic processor
|
|
|
1996
|
36 |
3 |
p. 443-
1 p.
|
artikel
|
| 5 |
A maintenance inspection model for a single machine with general failure distribution
|
Hariga, M.A.
|
|
1996
|
36 |
3 |
p. 353-358
6 p.
|
artikel
|
| 6 |
A maintenance strategy for systems subjected to deterioration governed by random shocks
|
|
|
1996
|
36 |
3 |
p. 444-
1 p.
|
artikel
|
| 7 |
Analysis of low energy boron implants in silicon through SiO2 films: implantation damage and anomalous diffusion
|
|
|
1996
|
36 |
3 |
p. 455-456
2 p.
|
artikel
|
| 8 |
A new contactless S-polarized reflectance technique for determining the Si film and buried oxide thickness in silicon-on-insulator materials
|
|
|
1996
|
36 |
3 |
p. 452-
1 p.
|
artikel
|
| 9 |
A new reliability test for multilayer ceramic capacitors
|
|
|
1996
|
36 |
3 |
p. 442-
1 p.
|
artikel
|
| 10 |
An experimental study of 1.5 keV X-ray radiation effects on CMOS devices
|
Srivastava, A.
|
|
1996
|
36 |
3 |
p. 323-333
11 p.
|
artikel
|
| 11 |
A novel hot carrier reliability monitor for LDD p-MOSFETs
|
|
|
1996
|
36 |
3 |
p. 453-
1 p.
|
artikel
|
| 12 |
Application of lead-free eutectic SnAg solder in no-clean thick film electronic modules
|
|
|
1996
|
36 |
3 |
p. 453-
1 p.
|
artikel
|
| 13 |
A practical lifetime prediction method for inter-poly oxides
|
|
|
1996
|
36 |
3 |
p. 442-
1 p.
|
artikel
|
| 14 |
A recursive approach for enumerating minimal cutsets in a network
|
|
|
1996
|
36 |
3 |
p. 445-446
2 p.
|
artikel
|
| 15 |
A simple test chip to assess chip and package design in the case of plastic assembling
|
|
|
1996
|
36 |
3 |
p. 449-
1 p.
|
artikel
|
| 16 |
A structured testability approach for multi-chip modules based on BIST and boundary-scan
|
|
|
1996
|
36 |
3 |
p. 443-
1 p.
|
artikel
|
| 17 |
A system where the number of servers changes depending on the queue length
|
Yamashiro, Mitsuo
|
|
1996
|
36 |
3 |
p. 389-391
3 p.
|
artikel
|
| 18 |
Automated synthesis of pseudo-exhaustive test generator in VLSI BIST design
|
|
|
1996
|
36 |
3 |
p. 447-
1 p.
|
artikel
|
| 19 |
Availability of K-out-of-N:G systems with M failure modes
|
Moustafa, Magdi S.
|
|
1996
|
36 |
3 |
p. 385-388
4 p.
|
artikel
|
| 20 |
A vertical submicron SiC thin film transistor
|
|
|
1996
|
36 |
3 |
p. 453-454
2 p.
|
artikel
|
| 21 |
Bayes analysis for fault location in distributed systems
|
|
|
1996
|
36 |
3 |
p. 445-
1 p.
|
artikel
|
| 22 |
Benefit analysis of a two-unit standby system subject to jerks with installation time
|
Saini, Ashok
|
|
1996
|
36 |
3 |
p. 429-434
6 p.
|
artikel
|
| 23 |
BLUEs of location and scale parameters of laplace distribution based on type-II censored samples and associated inference
|
Balakrishnan, N.
|
|
1996
|
36 |
3 |
p. 371-374
4 p.
|
artikel
|
| 24 |
Boolean neural network realization of an adder-subtractor cell
|
Singh, H.
|
|
1996
|
36 |
3 |
p. 367-369
3 p.
|
artikel
|
| 25 |
Bounds for reliability of k-within two-dimensional consecutive-r-out-of-n failure systems
|
Makri, F.S.
|
|
1996
|
36 |
3 |
p. 341-345
5 p.
|
artikel
|
| 26 |
Calculation of node-pair reliability in large networks with unreliable nodes
|
|
|
1996
|
36 |
3 |
p. 446-
1 p.
|
artikel
|
| 27 |
Ceramic multicomponent modules: a new approach to miniaturization
|
|
|
1996
|
36 |
3 |
p. 451-
1 p.
|
artikel
|
| 28 |
Characterizations of the exponential distribution via mixing distributions
|
Gharib, M.
|
|
1996
|
36 |
3 |
p. 293-305
13 p.
|
artikel
|
| 29 |
Chip manufacturing: matching production plan with customer requirements
|
|
|
1996
|
36 |
3 |
p. 450-
1 p.
|
artikel
|
| 30 |
Comparison of type-I and type-II accelerated life tests for selecting the most reliable product
|
|
|
1996
|
36 |
3 |
p. 445-
1 p.
|
artikel
|
| 31 |
Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D)
|
|
|
1996
|
36 |
3 |
p. 441-
1 p.
|
artikel
|
| 32 |
Demountable TAB—a new path for TAB technology
|
|
|
1996
|
36 |
3 |
p. 447-
1 p.
|
artikel
|
| 33 |
Deposition of III-N thin films by molecular beam epitaxy
|
|
|
1996
|
36 |
3 |
p. 455-
1 p.
|
artikel
|
| 34 |
Development of an alternative wire bond test technique
|
|
|
1996
|
36 |
3 |
p. 441-
1 p.
|
artikel
|
| 35 |
Diagnosing scan chain faults
|
|
|
1996
|
36 |
3 |
p. 441-442
2 p.
|
artikel
|
| 36 |
Effect of inorganic binders on the properties of thick film copper conductor
|
|
|
1996
|
36 |
3 |
p. 454-
1 p.
|
artikel
|
| 37 |
Electrical packaging requirements for low-voltage ICs—3.3 V high-performance CMOS devices as a case study
|
|
|
1996
|
36 |
3 |
p. 449-
1 p.
|
artikel
|
| 38 |
Estimating human error probabilities from paired ratios
|
Park, Kyung S.
|
|
1996
|
36 |
3 |
p. 399-401
3 p.
|
artikel
|
| 39 |
Estimation in the 2-parameter exponential distribution with prior information
|
|
|
1996
|
36 |
3 |
p. 445-
1 p.
|
artikel
|
| 40 |
Estimation of Pr{X > Y} or Pr{X ⩽ Y}
|
|
|
1996
|
36 |
3 |
p. 445-
1 p.
|
artikel
|
| 41 |
Evaluation of probability mass function of flow in a communication network considering a multistate model of network links
|
Patra, S.
|
|
1996
|
36 |
3 |
p. 415-421
7 p.
|
artikel
|
| 42 |
Evaluation of the lifetime and failure probability for inter-poly oxides from RVS measurements
|
|
|
1996
|
36 |
3 |
p. 442-
1 p.
|
artikel
|
| 43 |
Failure distributions for local vs global and replicate vs standby redundancies
|
|
|
1996
|
36 |
3 |
p. 444-
1 p.
|
artikel
|
| 44 |
Fault analysis by touch. Quality control in PCB assembly
|
|
|
1996
|
36 |
3 |
p. 445-
1 p.
|
artikel
|
| 45 |
Flip chip on board connection technology: process characterization and reliability
|
|
|
1996
|
36 |
3 |
p. 449-450
2 p.
|
artikel
|
| 46 |
Fracture mechanics for thin-film adhesion
|
|
|
1996
|
36 |
3 |
p. 453-
1 p.
|
artikel
|
| 47 |
Fracture properties of molding compound materials for IC plastic packaging
|
|
|
1996
|
36 |
3 |
p. 442-
1 p.
|
artikel
|
| 48 |
Fuzzy-set approach to select maintenance strategies for multistate equipment
|
|
|
1996
|
36 |
3 |
p. 443-
1 p.
|
artikel
|
| 49 |
Gold-to-gold TAB ILB with a laser
|
|
|
1996
|
36 |
3 |
p. 454-
1 p.
|
artikel
|
| 50 |
High frequency characteristics of MESFETs
|
|
|
1996
|
36 |
3 |
p. 451-452
2 p.
|
artikel
|
| 51 |
High temperature operation of GaAs based FETs
|
|
|
1996
|
36 |
3 |
p. 441-
1 p.
|
artikel
|
| 52 |
Innovations in organics circuit packaging technology
|
|
|
1996
|
36 |
3 |
p. 450-
1 p.
|
artikel
|
| 53 |
Investigation of multilayered Ge/Si structures with varying thicknesses
|
|
|
1996
|
36 |
3 |
p. 452-
1 p.
|
artikel
|
| 54 |
Lead inductance of tape carrier package for high-speed LSI's
|
|
|
1996
|
36 |
3 |
p. 452-
1 p.
|
artikel
|
| 55 |
Load-capacity interference and the bathrub curve
|
|
|
1996
|
36 |
3 |
p. 444-445
2 p.
|
artikel
|
| 56 |
Locating the faulty component in a malfunctioning repetitive operation
|
|
|
1996
|
36 |
3 |
p. 443-
1 p.
|
artikel
|
| 57 |
Manufacturing ICs the neural way
|
|
|
1996
|
36 |
3 |
p. 450-
1 p.
|
artikel
|
| 58 |
Mass production of laser diodes by MBE
|
|
|
1996
|
36 |
3 |
p. 454-
1 p.
|
artikel
|
| 59 |
Maximum likelihood estimation of the Burr XII parameters with censored and uncensored data
|
Wang, F.K.
|
|
1996
|
36 |
3 |
p. 359-362
4 p.
|
artikel
|
| 60 |
Metal capping of MCM thin film features using a laser
|
|
|
1996
|
36 |
3 |
p. 454-
1 p.
|
artikel
|
| 61 |
Minimal IC pretest requirements for multichip modules
|
|
|
1996
|
36 |
3 |
p. 451-
1 p.
|
artikel
|
| 62 |
MOSFET degradation during substrate hot electron stress
|
|
|
1996
|
36 |
3 |
p. 453-
1 p.
|
artikel
|
| 63 |
On the transient behaviour of an r-out-of-n:G system
|
Gopalan, M.N.
|
|
1996
|
36 |
3 |
p. 409-413
5 p.
|
artikel
|
| 64 |
Optimal chip sizing for multi-chip modules
|
|
|
1996
|
36 |
3 |
p. 448-
1 p.
|
artikel
|
| 65 |
Optimal maintenance-policies for deteriorating systems under various maintenance strategies
|
|
|
1996
|
36 |
3 |
p. 446-
1 p.
|
artikel
|
| 66 |
Optimal replacement policies for systems with multiple standby components
|
|
|
1996
|
36 |
3 |
p. 446-
1 p.
|
artikel
|
| 67 |
Organic microelectronic packages: challenges for a PCB manufacturer
|
|
|
1996
|
36 |
3 |
p. 446-
1 p.
|
artikel
|
| 68 |
Packaging technologies for satellite equipment
|
|
|
1996
|
36 |
3 |
p. 450-451
2 p.
|
artikel
|
| 69 |
Performance and dependability analysis of fault-tolerant networks
|
Brenner, A.
|
|
1996
|
36 |
3 |
p. 307-321
15 p.
|
artikel
|
| 70 |
Performance of thin-film chip resistors
|
|
|
1996
|
36 |
3 |
p. 454-
1 p.
|
artikel
|
| 71 |
Plasma-grown oxides on silicon with extremely low interface state densities
|
|
|
1996
|
36 |
3 |
p. 453-
1 p.
|
artikel
|
| 72 |
Power-hierarchy of dependability-model types
|
|
|
1996
|
36 |
3 |
p. 444-
1 p.
|
artikel
|
| 73 |
Preencapsulation cleaning methods and control for microelectronics packaging
|
|
|
1996
|
36 |
3 |
p. 448-
1 p.
|
artikel
|
| 74 |
Probability of first passage analysis of a two-stage transfer-line production system with storage and rework
|
Gopalan, M.N.
|
|
1996
|
36 |
3 |
p. 403-407
5 p.
|
artikel
|
| 75 |
Recrystallization characteristics of polycrystalline silicon films amorphized by germanium ion implantation
|
|
|
1996
|
36 |
3 |
p. 455-
1 p.
|
artikel
|
| 76 |
Redundancy optimization in consideration of uncertainty
|
Pan, Zhijie
|
|
1996
|
36 |
3 |
p. 393-397
5 p.
|
artikel
|
| 77 |
Reliability and micro-structural properties of GaAs Schottky diodes for submillimeter-wave applications
|
|
|
1996
|
36 |
3 |
p. 442-443
2 p.
|
artikel
|
| 78 |
Reliability estimation and tolerance limits for Laplace distribution based on censored samples
|
Balakrishnan, N.
|
|
1996
|
36 |
3 |
p. 375-378
4 p.
|
artikel
|
| 79 |
Reliability evaluation of k-out-of-n redundant system with partially energized stand-by units
|
Sur, B.N.
|
|
1996
|
36 |
3 |
p. 379-383
5 p.
|
artikel
|
| 80 |
Reliability evaluation of multistage interconnection networks with multi-state elements
|
Tripathy, C.R.
|
|
1996
|
36 |
3 |
p. 423-428
6 p.
|
artikel
|
| 81 |
Reliability investigations of different tape metallizations for TAB-Outer lead bonding
|
|
|
1996
|
36 |
3 |
p. 448-
1 p.
|
artikel
|
| 82 |
Reliability modelling and performance evaluation of variable link-capacity networks
|
|
|
1996
|
36 |
3 |
p. 452-
1 p.
|
artikel
|
| 83 |
Reliability of majority voting based VLSI fault-tolerant circuits
|
|
|
1996
|
36 |
3 |
p. 443-444
2 p.
|
artikel
|
| 84 |
Resistivity curves for subsurface diffused layers in silicon
|
|
|
1996
|
36 |
3 |
p. 453-
1 p.
|
artikel
|
| 85 |
Review: likelihood method for fitting Weibull log-linear models to accelerated life-test data
|
|
|
1996
|
36 |
3 |
p. 441-
1 p.
|
artikel
|
| 86 |
Selection of IR detectors for a fast laser soldering process with simultaneous solder joint qualification
|
|
|
1996
|
36 |
3 |
p. 454-455
2 p.
|
artikel
|
| 87 |
Shrunken estimators for the scale parameter of classical Pareto distribution
|
Singh, D.C.
|
|
1996
|
36 |
3 |
p. 435-439
5 p.
|
artikel
|
| 88 |
Software-reliability growth model: primary-failures generate secondary-faults under imperfect debugging
|
|
|
1996
|
36 |
3 |
p. 446-
1 p.
|
artikel
|
| 89 |
Some estimators of finite population variance using information on two auxiliary variables
|
Singh, R.K.
|
|
1996
|
36 |
3 |
p. 347-351
5 p.
|
artikel
|
| 90 |
Some recent advances in silicon microtechnology and their dependence on processing technique
|
|
|
1996
|
36 |
3 |
p. 446-447
2 p.
|
artikel
|
| 91 |
TBGA package technology
|
|
|
1996
|
36 |
3 |
p. 449-
1 p.
|
artikel
|
| 92 |
Terminal reliability using binary decision diagrams
|
Singh, H.
|
|
1996
|
36 |
3 |
p. 363-365
3 p.
|
artikel
|
| 93 |
Testing for functional defects in embedded digitial-to-analogue converters using dynamic stimuli and transient response analysis
|
|
|
1996
|
36 |
3 |
p. 450-
1 p.
|
artikel
|
| 94 |
The benefits of bonding. Silicon on insulator for bipolar ICs
|
|
|
1996
|
36 |
3 |
p. 447-
1 p.
|
artikel
|
| 95 |
The effects of impurity bands on the electrical characteristics of metal-semiconductor ohmic contacts
|
|
|
1996
|
36 |
3 |
p. 452-453
2 p.
|
artikel
|
| 96 |
The importance of material selection for flip chip on board assemblies
|
|
|
1996
|
36 |
3 |
p. 447-
1 p.
|
artikel
|
| 97 |
The linear statistical d.c. model of GaAs MESFET using factor analysis
|
|
|
1996
|
36 |
3 |
p. 451-
1 p.
|
artikel
|
| 98 |
Thin film bonding using ion beam techniques—a review
|
|
|
1996
|
36 |
3 |
p. 455-
1 p.
|
artikel
|
| 99 |
Tutorial: failure-mechanisms models for conductive-filament formation
|
|
|
1996
|
36 |
3 |
p. 447-448
2 p.
|
artikel
|
| 100 |
Ultra-thin packaging versus the Known Good Die
|
|
|
1996
|
36 |
3 |
p. 449-
1 p.
|
artikel
|
| 101 |
Why no additive hazards models?
|
|
|
1996
|
36 |
3 |
p. 444-
1 p.
|
artikel
|
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