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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 47 of 101 found articles
| Title: |
Fracture properties of molding compound materials for IC plastic packaging |
| Author: | |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 36 (1996) nr. 3 pages 1 p. |
| Year: |
1996 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 47 of 101 found articles
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