| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Bayes method for assessing product-reliability during development testing
|
|
|
1994
|
34 |
12 |
p. 1961-1962
2 p.
|
artikel
|
| 2 |
Advanced assembly methods: multichip modules and flipchip technology
|
|
|
1994
|
34 |
12 |
p. 1968-
1 p.
|
artikel
|
| 3 |
Advances widen uses for chip monolithic ceramic capacitors
|
|
|
1994
|
34 |
12 |
p. 1953-
1 p.
|
artikel
|
| 4 |
A generalized algorithm for evaluating distributed-program reliability
|
|
|
1994
|
34 |
12 |
p. 1959-
1 p.
|
artikel
|
| 5 |
A heuristic task assignment algorithm to maximize reliability of a distributed system
|
|
|
1994
|
34 |
12 |
p. 1959-
1 p.
|
artikel
|
| 6 |
A high-level VLSI design for ultra-dense instruction set computer architectures
|
|
|
1994
|
34 |
12 |
p. 1970-
1 p.
|
artikel
|
| 7 |
A hybrid silicon carbide differential amplifier for 350°C operation
|
|
|
1994
|
34 |
12 |
p. 1969-
1 p.
|
artikel
|
| 8 |
A low cost manufacturing process for high density hybrid components based on multilayer polyimide—ceramic structures
|
|
|
1994
|
34 |
12 |
p. 1973-
1 p.
|
artikel
|
| 9 |
A method of adhesion strength test for thick film
|
|
|
1994
|
34 |
12 |
p. 1973-
1 p.
|
artikel
|
| 10 |
A microelectronic test structure and numerical algorithm for characterization of liquid immersion heat transfer
|
|
|
1994
|
34 |
12 |
p. 1967-1968
2 p.
|
artikel
|
| 11 |
A multichip package for high-speed logic die
|
|
|
1994
|
34 |
12 |
p. 1968-
1 p.
|
artikel
|
| 12 |
Analysis of resistive bridging fault detection in BiCMOS digital IC's
|
|
|
1994
|
34 |
12 |
p. 1952-1953
2 p.
|
artikel
|
| 13 |
Analysis of two stage sampling plain with imperfect inspection
|
|
|
1994
|
34 |
12 |
p. 1958-
1 p.
|
artikel
|
| 14 |
An ATM switch hardware technologies using multichip packaging
|
|
|
1994
|
34 |
12 |
p. 1966-1967
2 p.
|
artikel
|
| 15 |
A new algorithm for reliability evaluation of telecommunication networks with link-capacities
|
Qiu, Liu Yan
|
|
1994
|
34 |
12 |
p. 1943-1946
4 p.
|
artikel
|
| 16 |
A new method to compute reliability of repairable m-out-of-n systems by arbitrary distributions
|
Gurov, S.V.
|
|
1994
|
34 |
12 |
p. 1877-1889
13 p.
|
artikel
|
| 17 |
An extensible fault-tolerant network architecture
|
|
|
1994
|
34 |
12 |
p. 1970-
1 p.
|
artikel
|
| 18 |
Anomalies in interpreting a fault tree
|
|
|
1994
|
34 |
12 |
p. 1958-
1 p.
|
artikel
|
| 19 |
A pooling procedure for life-test data
|
|
|
1994
|
34 |
12 |
p. 1960-
1 p.
|
artikel
|
| 20 |
Application of reliability concepts in automatic identification
|
|
|
1994
|
34 |
12 |
p. 1958-
1 p.
|
artikel
|
| 21 |
A review of testing methods for mixed-signal ICs
|
|
|
1994
|
34 |
12 |
p. 1953-
1 p.
|
artikel
|
| 22 |
A sampling scheme for estimating the reliability of a series system
|
|
|
1994
|
34 |
12 |
p. 1961-
1 p.
|
artikel
|
| 23 |
ASIC device technology holds key to rapid progress of LSI technology
|
|
|
1994
|
34 |
12 |
p. 1970-
1 p.
|
artikel
|
| 24 |
ASIC technology makes remarkable strides
|
|
|
1994
|
34 |
12 |
p. 1969-1970
2 p.
|
artikel
|
| 25 |
A simplified graphical method for deriving system steady-state probability
|
|
|
1994
|
34 |
12 |
p. 1956-
1 p.
|
artikel
|
| 26 |
A sputter-etching target and rotational carousel for multilayer films
|
|
|
1994
|
34 |
12 |
p. 1965-
1 p.
|
artikel
|
| 27 |
A systematic evaluation of factors influencing TAB inner lead reliability
|
|
|
1994
|
34 |
12 |
p. 1950-
1 p.
|
artikel
|
| 28 |
A system for production use of high-level synthesis
|
|
|
1994
|
34 |
12 |
p. 1969-
1 p.
|
artikel
|
| 29 |
A unique approach to teaching electronic packaging
|
|
|
1994
|
34 |
12 |
p. 1962-1963
2 p.
|
artikel
|
| 30 |
Automated vision system for inspection of IC pads and bonds
|
|
|
1994
|
34 |
12 |
p. 1952-
1 p.
|
artikel
|
| 31 |
Automated visual inspection system for bonded IC wires
|
|
|
1994
|
34 |
12 |
p. 1953-
1 p.
|
artikel
|
| 32 |
Bayes credibility intervals for the left-truncated exponential distribution
|
Calabria, R.
|
|
1994
|
34 |
12 |
p. 1897-1907
11 p.
|
artikel
|
| 33 |
Behaviour analysis and performability of a co-operative motion system modelled by Petri Net
|
|
|
1994
|
34 |
12 |
p. 1955-
1 p.
|
artikel
|
| 34 |
Bulk feeding technology for small, rectangular chip components
|
|
|
1994
|
34 |
12 |
p. 1965-
1 p.
|
artikel
|
| 35 |
Capacitance of disk capacitors
|
|
|
1994
|
34 |
12 |
p. 1949-
1 p.
|
artikel
|
| 36 |
Card connectors adopt to wide variety of IC memory cards
|
|
|
1994
|
34 |
12 |
p. 1970-
1 p.
|
artikel
|
| 37 |
Characterization of gas transport through micromachined submicron channels in silicon
|
|
|
1994
|
34 |
12 |
p. 1971-
1 p.
|
artikel
|
| 38 |
Characterization of InGaAs-ALGaAs-GaAs heteroepitaxial structures by transmission electron microscopy and energy dispersive spectroscopy
|
|
|
1994
|
34 |
12 |
p. 1971-1972
2 p.
|
artikel
|
| 39 |
Communication requirements spur changes in small chip filters, ceramic resonators
|
|
|
1994
|
34 |
12 |
p. 1951-
1 p.
|
artikel
|
| 40 |
Comparison of methods for determining the capacitance of planar transmission lines with application to multichip module characterization
|
|
|
1994
|
34 |
12 |
p. 1966-
1 p.
|
artikel
|
| 41 |
Compatability of common MCM-D dielectric with scanning laser ablation via generation processes
|
|
|
1994
|
34 |
12 |
p. 1974-
1 p.
|
artikel
|
| 42 |
Component procurement and allocation for products assembled to forecast: risk-pooling effects
|
|
|
1994
|
34 |
12 |
p. 1954-
1 p.
|
artikel
|
| 43 |
Computation availability of crossbar systems in a non-uniform traffic environment
|
Atiquzzaman, M.
|
|
1994
|
34 |
12 |
p. 1931-1937
7 p.
|
artikel
|
| 44 |
Computerized continuous sampling plans with finite production
|
|
|
1994
|
34 |
12 |
p. 1956-
1 p.
|
artikel
|
| 45 |
Concurrent error detection and fault-tolerance in linear analog circuits using continuous checksums
|
|
|
1994
|
34 |
12 |
p. 1953-1954
2 p.
|
artikel
|
| 46 |
Consecutive-2-out-of-n:F systems with node and link failures
|
|
|
1994
|
34 |
12 |
p. 1955-
1 p.
|
artikel
|
| 47 |
Corrosion of thin film aluminum metallization: conformal coating materials
|
|
|
1994
|
34 |
12 |
p. 1950-
1 p.
|
artikel
|
| 48 |
Creativity and discipline—quality management in software
|
|
|
1994
|
34 |
12 |
p. 1963-
1 p.
|
artikel
|
| 49 |
Decision theory in maintenance strategy for a two-unit redundant standby system
|
|
|
1994
|
34 |
12 |
p. 1959-1960
2 p.
|
artikel
|
| 50 |
Deep-depletion-layer impact-ionization-induced gate-oxide breakdown in thin-oxide n-MOSFETs
|
|
|
1994
|
34 |
12 |
p. 1971-
1 p.
|
artikel
|
| 51 |
Demagnifying ion projection a promising alternative to optical and X-ray lithography
|
|
|
1994
|
34 |
12 |
p. 1974-1975
2 p.
|
artikel
|
| 52 |
Design and simulation of a test pattern for three-dimensional latch-up analysis
|
|
|
1994
|
34 |
12 |
p. 1960-
1 p.
|
artikel
|
| 53 |
Design of a self-testing and self-repairing structure for highly hierarchical ultra-large capacity memory chip
|
|
|
1994
|
34 |
12 |
p. 1965-
1 p.
|
artikel
|
| 54 |
Direct bonding of GaAs films on silicon circuits by epitaxial liftoff
|
|
|
1994
|
34 |
12 |
p. 1971-
1 p.
|
artikel
|
| 55 |
Discrete reliability-growth models based on a learning-curve property
|
|
|
1994
|
34 |
12 |
p. 1956-
1 p.
|
artikel
|
| 56 |
Eastern Europe in the global microelectronics marketplace
|
|
|
1994
|
34 |
12 |
p. 1963-
1 p.
|
artikel
|
| 57 |
Editorial
|
Reiche, Hans
|
|
1994
|
34 |
12 |
p. 1863-
1 p.
|
artikel
|
| 58 |
Effects of parylene coating on the thermal fatigue life of solder joints in ceramic packages
|
|
|
1994
|
34 |
12 |
p. 1948-
1 p.
|
artikel
|
| 59 |
Electrical characterization of oxide in MOS devices using low energy electron beam filling of traps
|
|
|
1994
|
34 |
12 |
p. 1975-
1 p.
|
artikel
|
| 60 |
Estimation and testing in an imperfect-inspection model
|
|
|
1994
|
34 |
12 |
p. 1957-
1 p.
|
artikel
|
| 61 |
Estimators of two-parameter Weibull distributions from incomplete data with residual lifetimes
|
|
|
1994
|
34 |
12 |
p. 1959-
1 p.
|
artikel
|
| 62 |
Evaluation and comparison of fault-tolerant software techniques
|
|
|
1994
|
34 |
12 |
p. 1955-1956
2 p.
|
artikel
|
| 63 |
Evolution of GaAs ICs containing ferroelectric capacitor
|
|
|
1994
|
34 |
12 |
p. 1952-
1 p.
|
artikel
|
| 64 |
Exponentiated Weibull family for analyzing bathtub failure-rate data
|
|
|
1994
|
34 |
12 |
p. 1959-
1 p.
|
artikel
|
| 65 |
Fabrication of an insulated metal substrate (IMS), having an insulating layer with a high dielectric constant
|
|
|
1994
|
34 |
12 |
p. 1966-
1 p.
|
artikel
|
| 66 |
Factors affecting the interconnection resistance and yield in multilayer polyimide—copper structures
|
|
|
1994
|
34 |
12 |
p. 1966-
1 p.
|
artikel
|
| 67 |
Failure analysis of power modules: a look at the packaging and reliability of large IGBT's
|
|
|
1994
|
34 |
12 |
p. 1951-
1 p.
|
artikel
|
| 68 |
Failure-mechanism models for creep and creep rupture
|
|
|
1994
|
34 |
12 |
p. 1949-
1 p.
|
artikel
|
| 69 |
Failure models for mechanical wear modes and mechanisms
|
|
|
1994
|
34 |
12 |
p. 1947-
1 p.
|
artikel
|
| 70 |
Finding the most vital edge with respect to K-terminal reliability in series-parallel networks
|
|
|
1994
|
34 |
12 |
p. 1957-
1 p.
|
artikel
|
| 71 |
Finite-difference time-domain analysis of pulse propagation in multichip module interconnects
|
|
|
1994
|
34 |
12 |
p. 1966-
1 p.
|
artikel
|
| 72 |
Flexible simulation of a complex semiconductor manufacturing line using a rule-based system
|
|
|
1994
|
34 |
12 |
p. 1963-1964
2 p.
|
artikel
|
| 73 |
Formation of SiO2 on contact surface and its effect on contact reliability
|
|
|
1994
|
34 |
12 |
p. 1954-
1 p.
|
artikel
|
| 74 |
Four Japanese microchip makers develop 256M-bit DRAMs
|
|
|
1994
|
34 |
12 |
p. 1969-
1 p.
|
artikel
|
| 75 |
Fuzzy consecutive-k-out-of-n:F system reliability
|
Cheng, Ching-Hsue
|
|
1994
|
34 |
12 |
p. 1909-1922
14 p.
|
artikel
|
| 76 |
Fuzzy reliability of repairable systems in the possibility context
|
Utkin, Lev V.
|
|
1994
|
34 |
12 |
p. 1865-1876
12 p.
|
artikel
|
| 77 |
Generic reliability figures of merit design tools for surface mount solder attachments
|
|
|
1994
|
34 |
12 |
p. 1953-
1 p.
|
artikel
|
| 78 |
High-speed VLSI interconnect modelling based on s-parameter measurements
|
|
|
1994
|
34 |
12 |
p. 1964-
1 p.
|
artikel
|
| 79 |
I DDQ testing makes a comeback
|
|
|
1994
|
34 |
12 |
p. 1952-
1 p.
|
artikel
|
| 80 |
Implantation damage and its effect on channelling
|
|
|
1994
|
34 |
12 |
p. 1974-
1 p.
|
artikel
|
| 81 |
Impurity profile extraction from semiconductor chips of cellular construction
|
|
|
1994
|
34 |
12 |
p. 1949-
1 p.
|
artikel
|
| 82 |
Infrared thermography maintains PCB reliability
|
|
|
1994
|
34 |
12 |
p. 1951-
1 p.
|
artikel
|
| 83 |
Integrated circuit, hybrid, and multichip module package design guidelines A focus on reliability
|
G.W.A.D.,
|
|
1994
|
34 |
12 |
p. 1978-1979
2 p.
|
artikel
|
| 84 |
Integrated circuit production yield assurance based on yield analysis
|
|
|
1994
|
34 |
12 |
p. 1950-1951
2 p.
|
artikel
|
| 85 |
Integrating reliability into microelectronics manufacturing
|
G.W.A.D.,
|
|
1994
|
34 |
12 |
p. 1979-1980
2 p.
|
artikel
|
| 86 |
Ion bombardment influence on the Cr Auger autoionization structure
|
|
|
1994
|
34 |
12 |
p. 1975-
1 p.
|
artikel
|
| 87 |
Japanese parts makers see ISO9000 certification as growth stimulus
|
|
|
1994
|
34 |
12 |
p. 1948-
1 p.
|
artikel
|
| 88 |
Large capacitance electric double layer capacitor using activated carbon-carbon composite
|
|
|
1994
|
34 |
12 |
p. 1951-
1 p.
|
artikel
|
| 89 |
Large-scale 0–1 fuzzy goal programming and its application to reliability optimization problem
|
|
|
1994
|
34 |
12 |
p. 1954-1955
2 p.
|
artikel
|
| 90 |
Lasting quality
|
|
|
1994
|
34 |
12 |
p. 1947-
1 p.
|
artikel
|
| 91 |
Lowering manufacturing defects analysis costs
|
|
|
1994
|
34 |
12 |
p. 1950-
1 p.
|
artikel
|
| 92 |
Maintenance minimization for competitive advantage A life cycle approach for product manufacturers and end users
|
G.W.A.D.,
|
|
1994
|
34 |
12 |
p. 1977-1978
2 p.
|
artikel
|
| 93 |
Manufacturers continue shrinking dimensions of chip parts
|
|
|
1994
|
34 |
12 |
p. 1963-
1 p.
|
artikel
|
| 94 |
MARVLE: a VLSI chip for data compression using tree-based codes
|
|
|
1994
|
34 |
12 |
p. 1969-
1 p.
|
artikel
|
| 95 |
Microcurrent, ultra-miniature switches offer reliable contact
|
|
|
1994
|
34 |
12 |
p. 1950-
1 p.
|
artikel
|
| 96 |
Model based maintenance for MANs
|
|
|
1994
|
34 |
12 |
p. 1947-
1 p.
|
artikel
|
| 97 |
Models for the Si-SiO2 interface degradation at low injected electron fluences
|
|
|
1994
|
34 |
12 |
p. 1972-
1 p.
|
artikel
|
| 98 |
Module frequency estimation and noise budget limitations/trade-offs in multichip modules as a function of CMOS chips integration
|
|
|
1994
|
34 |
12 |
p. 1958-1959
2 p.
|
artikel
|
| 99 |
Multimetal DTAB packages for a 125-MHz computer
|
|
|
1994
|
34 |
12 |
p. 1964-
1 p.
|
artikel
|
| 100 |
NASA evaluates automated inspection systems
|
|
|
1994
|
34 |
12 |
p. 1959-
1 p.
|
artikel
|
| 101 |
New humidity sensors offer reliable performance
|
|
|
1994
|
34 |
12 |
p. 1956-
1 p.
|
artikel
|
| 102 |
New mode crack of LSI package in the solder reflow process
|
|
|
1994
|
34 |
12 |
p. 1968-
1 p.
|
artikel
|
| 103 |
On-line hazard aversion: a Bayes approach
|
|
|
1994
|
34 |
12 |
p. 1957-
1 p.
|
artikel
|
| 104 |
On the modelling of digital circuits for the test pattern generation for device input faults
|
Dokouzyannis, Stavros P.
|
|
1994
|
34 |
12 |
p. 1923-1929
7 p.
|
artikel
|
| 105 |
Optimal cost-effective design of triple-modular-redundancy with-spares systems
|
|
|
1994
|
34 |
12 |
p. 1960-
1 p.
|
artikel
|
| 106 |
Optimization of average-run-length properties of control charts using recurrent events
|
|
|
1994
|
34 |
12 |
p. 1960-1961
2 p.
|
artikel
|
| 107 |
Organizational learning across critical linkages: the case of captive ASIC design and manufacturing
|
|
|
1994
|
34 |
12 |
p. 1964-
1 p.
|
artikel
|
| 108 |
Packages reflect diverse needs, technologies among device users
|
|
|
1994
|
34 |
12 |
p. 1964-
1 p.
|
artikel
|
| 109 |
Packaging a 150-W bipolar ECL microprocessor
|
|
|
1994
|
34 |
12 |
p. 1968-
1 p.
|
artikel
|
| 110 |
Parallel-concurrent fault simulation
|
|
|
1994
|
34 |
12 |
p. 1955-
1 p.
|
artikel
|
| 111 |
Parallel processing of fault trees on a locally distributed multiple-processor network
|
|
|
1994
|
34 |
12 |
p. 1956-1957
2 p.
|
artikel
|
| 112 |
Passivation schemes for copper-polymer thin-film interconnections used in multichip modules
|
|
|
1994
|
34 |
12 |
p. 1973-
1 p.
|
artikel
|
| 113 |
Performance analysis of multilayer interconnections for megabit static random access memory chip
|
|
|
1994
|
34 |
12 |
p. 1952-
1 p.
|
artikel
|
| 114 |
Performance-reliability—models and quality management
|
|
|
1994
|
34 |
12 |
p. 1948-
1 p.
|
artikel
|
| 115 |
Photothermal formation of copper conductors on multichip module substrates using a Nd: YAG laser
|
|
|
1994
|
34 |
12 |
p. 1974-
1 p.
|
artikel
|
| 116 |
Practical scheduling and line optimization technology for ASIC manufacturing lines
|
|
|
1994
|
34 |
12 |
p. 1964-
1 p.
|
artikel
|
| 117 |
Precision comparison of surface temperature measurement techniques for GaAs IC's
|
|
|
1994
|
34 |
12 |
p. 1962-
1 p.
|
artikel
|
| 118 |
Printed wiring boards with silver through-holes help lower costs
|
|
|
1994
|
34 |
12 |
p. 1950-
1 p.
|
artikel
|
| 119 |
Process integration, architecture and simulation of a GHz-BiCMOS ULSI technology
|
|
|
1994
|
34 |
12 |
p. 1967-
1 p.
|
artikel
|
| 120 |
Quality and reliability of technical systems theory - practice - management
|
G.W.A.D.,
|
|
1994
|
34 |
12 |
p. 1981-1982
2 p.
|
artikel
|
| 121 |
Rapid estimation for parameterized components in high-level synthesis
|
|
|
1994
|
34 |
12 |
p. 1954-
1 p.
|
artikel
|
| 122 |
Reactive ion milling—thinning of compound semiconductors
|
|
|
1994
|
34 |
12 |
p. 1975-
1 p.
|
artikel
|
| 123 |
Relative figures of merit for chip-to-MCM substrate interconnection methods
|
|
|
1994
|
34 |
12 |
p. 1965-1966
2 p.
|
artikel
|
| 124 |
Relaxation effects in high-voltage barium titanate nonlinear ceramic disk capacitors
|
|
|
1994
|
34 |
12 |
p. 1949-1950
2 p.
|
artikel
|
| 125 |
Reliability analysis of a Markovian deteriorating system
|
Jain, Sudha
|
|
1994
|
34 |
12 |
p. 1939-1941
3 p.
|
artikel
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Reliability and availability analysis of cold standby system with repair and multiple non-critical and critical errors
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1994
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34 |
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6 p.
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| 127 |
Reliability and design of 2-dimensional consecutive k-out-of-n systems
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1994
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34 |
12 |
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1 p.
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| 128 |
Reliability estimation using doubly-censored field data
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1994
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34 |
12 |
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1 p.
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| 129 |
Reliability evaluation of a limited-flow network in terms of minimal cutsets
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1994
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34 |
12 |
p. 1962-
1 p.
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artikel
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| 130 |
Reliability growth of fault-tolerant software
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1994
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34 |
12 |
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1 p.
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| 131 |
Reliability of a general consecutive-k-out-n:F system
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1994
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34 |
12 |
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1 p.
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artikel
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| 132 |
Reliability of checkpointed real-time systems using time redundancy
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1994
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34 |
12 |
p. 1962-
1 p.
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artikel
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| 133 |
Reliability of multistage production systems controlled by automated visual inspection
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1994
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34 |
12 |
p. 1960-
1 p.
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artikel
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| 134 |
Reliability of surface-mounted anisotropically conductive adhesive joints
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1994
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34 |
12 |
p. 1951-
1 p.
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artikel
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| 135 |
Reliability of three-state device systems with simultaneous failures
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1994
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34 |
12 |
p. 1961-
1 p.
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artikel
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| 136 |
Replacement policy for a partially observable Markov descision process model using fuzzy data
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1994
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34 |
12 |
p. 1958-
1 p.
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artikel
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| 137 |
Resistance adjustment with short-pulse Nd: YAG laser for RuO2-based thick-film resistors buried in polyimide film
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1994
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34 |
12 |
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1 p.
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| 138 |
Rotating crucible electron beam evaporation technique for the deposition of multicomponent oxide films
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1994
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34 |
12 |
p. 1975-
1 p.
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artikel
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| 139 |
Silicon-implanted SiO2 for nonvolatile memory applications
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1994
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34 |
12 |
p. 1971-
1 p.
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artikel
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| 140 |
SIMS depth profiling of implanted layers in silicon under N2 + ion bombardment
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1994
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34 |
12 |
p. 1973-
1 p.
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| 141 |
Simulation of crosstalk in high-speed multilayer off-chip interconnections
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1994
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34 |
12 |
p. 1969-
1 p.
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| 142 |
Soldering system innovations
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1994
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34 |
12 |
p. 1949-
1 p.
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artikel
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| 143 |
Solder joint reliability of a thin small outline package (TSOP)
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1994
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34 |
12 |
p. 1952-
1 p.
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artikel
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| 144 |
Statistical modelling in manufacturing: adapting a diagnostic tool to real-time applications
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1994
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34 |
12 |
p. 1957-
1 p.
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artikel
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| 145 |
Statistics of solder joint alignment for optoelectronic components
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1994
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34 |
12 |
p. 1952-
1 p.
|
artikel
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| 146 |
Strategic alliances for microelectronics development
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1994
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34 |
12 |
p. 1963-
1 p.
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artikel
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| 147 |
Suppression of interfacial boron accumulation and defect density in molecular beam epitaxial silicon
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1994
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34 |
12 |
p. 1973-
1 p.
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artikel
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| 148 |
Surface mounting of very fine pitch components: a new challenge
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1994
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34 |
12 |
p. 1964-
1 p.
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artikel
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| 149 |
Surface texturing of multilayer Ag-Cu films by sputter-etching
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1994
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34 |
12 |
p. 1971-
1 p.
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artikel
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| 150 |
Systems adopt advanced technology for testing IC devices
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1994
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34 |
12 |
p. 1950-
1 p.
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artikel
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| 151 |
Technological and economical aspects of mega-chip development
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1994
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34 |
12 |
p. 1963-
1 p.
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artikel
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| 152 |
Testing machines enhance yield, throughput in mobilecom production
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1994
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34 |
12 |
p. 1968-
1 p.
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artikel
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| 153 |
The application of laser process technology to thin film packaging
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1994
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34 |
12 |
p. 1973-
1 p.
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artikel
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| 154 |
The cost of product liability for small vs large firms
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1994
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34 |
12 |
p. 1958-
1 p.
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artikel
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| 155 |
The effect of memory-management policies on system reliability
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1994
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34 |
12 |
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2 p.
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| 156 |
The effect of resistor geometry on current noise
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1994
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34 |
12 |
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2 p.
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| 157 |
The evolving role of defects and contamination in semiconductor manufacturing
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1994
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34 |
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1 p.
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| 158 |
The midrange and high temperature dependence of vacuum deposited NiCr thin film resistors
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1994
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34 |
12 |
p. 1972-
1 p.
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artikel
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| 159 |
The partitioning of linear registers for testing applications
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1994
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34 |
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1 p.
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| 160 |
The preliminary draft of a proposed restatement (third) of Torts: products liability
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1994
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34 |
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p. 1948-
1 p.
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| 161 |
Thermal oxidation of silicon and residual fixed charge
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1994
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34 |
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1 p.
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| 162 |
The Siemens high-level synthesis system CALLAS
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1994
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34 |
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p. 1965-
1 p.
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artikel
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| 163 |
Thin oxide grown on heavily channel-implanted substrate by using a low temperature wafer loading and N2pre-annealing process
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1994
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34 |
12 |
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1 p.
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| 164 |
Throughput optimized architectural synthesis
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1994
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34 |
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1 p.
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| 165 |
Time lag and permeation in multilayer polymer coatings
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1994
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34 |
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1 p.
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| 166 |
Torsional stiffness and fatigue study of surface-mounted compliant leaded systems
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1994
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34 |
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2 p.
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| 167 |
Transformations and resynthesis for testability of RT-level control-data path specifications
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1994
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34 |
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1 p.
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| 168 |
VLSI architectures for discrete wavelet transforms
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1994
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34 |
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p. 1970-
1 p.
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artikel
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| 169 |
VLSI design of an M-path decoder IC suitable for bidirectional decoding of convolutional codes
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1994
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34 |
12 |
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2 p.
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artikel
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| 170 |
Zero-defect sputter deposition metallization method for high volume manufacturing of grafted multilayer thin film modules
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1994
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34 |
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1 p.
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artikel
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