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                             165 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A Bayes classifier when the class distributions come from a common multivariate normal distribution 1992
 32 12 p. 1787-
1 p.
 artikel
2 Acceleration test method of IC card 1992
 32 12 p. 1783-
1 p.
 artikel
3 Accounting for bandstructure effects in the hydrodynamic model: a first-order approach for silicon device simulation 1992
 32 12 p. 1796-1797
2 p.
 artikel
4 A comparison of the optical projection lithography simulators in SAMPLE and PROLITH 1992
 32 12 p. 1795-
1 p.
 artikel
5 Advanced ultrapure wafer systems with low dissolved oxygen for native oxide free wafer processing 1992
 32 12 p. 1794-
1 p.
 artikel
6 A failure analysis for LSIs using FIB technology 1992
 32 12 p. 1785-
1 p.
 artikel
7 A feasibility study for the fabrication of planar silicon multichip modules using electron beam lithography for precise location and interconnection of chips 1992
 32 12 p. 1799-
1 p.
 artikel
8 A general characterization and simulation method for deposition and etching technology 1992
 32 12 p. 1795-
1 p.
 artikel
9 A generic cell controller for the automated VLSI manufacturing facility 1992
 32 12 p. 1792-
1 p.
 artikel
10 A G|M|M system with M|M switch and orientation time for the repair facility Sarma, Yadavalli V.S.
 1992
 32 12 p. 1663-1666
4 p.
 artikel
11 A heuristic approach to optimal assignment of components to a parallel-series network 1992
 32 12 p. 1781-1782
2 p.
 artikel
12 A linearly dependent service rate for the queue: M/M/1/N with general balk function, reflecting barrier, reneging and an additional server for longer queues Abou El-Ata, M.O.
 1992
 32 12 p. 1693-1698
6 p.
 artikel
13 Aluminium recrystallization of transistor due to repeated pulses and the countermeasure 1992
 32 12 p. 1783-
1 p.
 artikel
14 A multilevel epoxy substrate for flip-chip hybrid multichip module applications 1992
 32 12 p. 1798-1799
2 p.
 artikel
15 Analogue and mixed-signal IC design 1992
 32 12 p. 1794-
1 p.
 artikel
16 Analysis of monitoring policies Gopalan, M.N.
 1992
 32 12 p. 1681-1686
6 p.
 artikel
17 An electric double-layer capacitor with high capacitance and low resistance 1992
 32 12 p. 1784-1785
2 p.
 artikel
18 An equipment model for polysilicon LPC VD 1992
 32 12 p. 1797-
1 p.
 artikel
19 A point-by-point multiple sweep numerical algorithm for dopant profiling based on C-V data 1992
 32 12 p. 1786-
1 p.
 artikel
20 Application of statistical analysis to determine the priority for improving LSI technology 1992
 32 12 p. 1790-
1 p.
 artikel
21 Applying statistics to find the causes of variability in aluminum evaporation: a case study 1992
 32 12 p. 1797-
1 p.
 artikel
22 A quantitative technique to analyze materials trade-off for SEM “E” 1992
 32 12 p. 1796-
1 p.
 artikel
23 A reliability model for connector contacts 1992
 32 12 p. 1782-
1 p.
 artikel
24 A review of the skin effect as applied to thin film interconnections 1992
 32 12 p. 1799-
1 p.
 artikel
25 ASIC testing upgraded 1992
 32 12 p. 1796-
1 p.
 artikel
26 Assembling and troubleshooting microcomputers Second edition Popentiu, Florin
 1992
 32 12 p. 1777-
1 p.
 artikel
27 A standardized method for CMOS unit process development 1992
 32 12 p. 1784-
1 p.
 artikel
28 A study of a method for evaluating small size samples—judgement of small numbers of test data taking into account variability 1992
 32 12 p. 1785-
1 p.
 artikel
29 A study of defects induced in GaAs by plasma etching 1992
 32 12 p. 1798-
1 p.
 artikel
30 A study of ESD-induced defects in high-voltage nMOS and pMOS transistors 1992
 32 12 p. 1784-
1 p.
 artikel
31 A survey of reliability-prediction procedures for microelectronic devices 1992
 32 12 p. 1784-
1 p.
 artikel
32 Asynchronous reliability growth for multi-device in same type 1992
 32 12 p. 1786-
1 p.
 artikel
33 A two-unit priority standby system subject to random shocks and Releigh failure-time distribution Gupta, Rakesh
 1992
 32 12 p. 1713-1723
11 p.
 artikel
34 A two-unit standby system with imperfect switch, preventive maintenance and correlated failures and repairs Goel, L.R.
 1992
 32 12 p. 1687-1691
5 p.
 artikel
35 Availability, MTTF and cost analysis of a three-state parallel redundant multi-component system under critical human failures Elias, S.S.
 1992
 32 12 p. 1741-1761
21 p.
 artikel
36 Availability of a parallel system with preventive maintenance and common-cause failures 1992
 32 12 p. 1787-
1 p.
 artikel
37 Availability of systems with partially observable failures 1992
 32 12 p. 1787-
1 p.
 artikel
38 Availability of the crystallization system in the sugar industry under common-cause failure 1992
 32 12 p. 1781-
1 p.
 artikel
39 A VLSI placement method using Tabu search 1992
 32 12 p. 1791-
1 p.
 artikel
40 Bayes estimation of hazard and acceleration in accelerated testing 1992
 32 12 p. 1789-
1 p.
 artikel
41 Binary and phase shifting mask design for optical lithography 1992
 32 12 p. 1795-
1 p.
 artikel
42 Board testers merge in-circuit and functional test 1992
 32 12 p. 1796-
1 p.
 artikel
43 Breakdown characteristics of emitter-base and collector-base junctions of silicon bipolar junction transistors 1992
 32 12 p. 1782-
1 p.
 artikel
44 Burn-in: still a hot topic 1992
 32 12 p. 1781-
1 p.
 artikel
45 Capacitors adopt new technologies compatible with product trends 1992
 32 12 p. 1782-
1 p.
 artikel
46 Comparative evaluation of optical waveguides as alternative interconnections for high performance packaging 1992
 32 12 p. 1793-1794
2 p.
 artikel
47 Comparative study of submicron BiCMOS technologies 1992
 32 12 p. 1792-
1 p.
 artikel
48 Concept of accelerated life test and implementation—a study on evaluation for solder joint fatigue of automotive electronic components 1992
 32 12 p. 1782-1783
2 p.
 artikel
49 Connectors for IC memory cards developed for higher reliability 1992
 32 12 p. 1785-
1 p.
 artikel
50 Cost analysis of a two-unit repairable system subject to on-line preventive maintenance and/or repair Gopalan, M.N.
 1992
 32 12 p. 1675-1679
5 p.
 artikel
51 Cost optimization of maintenance scheduling for a system with assured reliability 1992
 32 12 p. 1788-
1 p.
 artikel
52 Counting the number of minimum cuts in undirected multigraphs 1992
 32 12 p. 1788-
1 p.
 artikel
53 Development of the high speed temperature cycle test 1992
 32 12 p. 1792-
1 p.
 artikel
54 Discussion of failures and their causes in electronic devices (belong to MTTF system) 1992
 32 12 p. 1785-
1 p.
 artikel
55 DRAMs hold sway in semiconductor memory fields 1992
 32 12 p. 1796-
1 p.
 artikel
56 E-beam test system with higher performance by improving signal source 1992
 32 12 p. 1799-
1 p.
 artikel
57 Electrical design technology for low dielectric constant multilayer ceramic substrate 1992
 32 12 p. 1793-
1 p.
 artikel
58 Electric testers lead in market growth electric measuring instruments 1992
 32 12 p. 1781-
1 p.
 artikel
59 Electronic equipment packaging technology Gavrilescu, Dana
 1992
 32 12 p. 1778-
1 p.
 artikel
60 Estimating the reliability of electrical connectors 1992
 32 12 p. 1782-
1 p.
 artikel
61 Estimation of network reliability using graph evolution models 1992
 32 12 p. 1789-
1 p.
 artikel
62 Estimators for type-II censored (log) normal samples 1992
 32 12 p. 1789-
1 p.
 artikel
63 Exact fiducial bounds for the reliability of series systems with components having exponential time to failure distributions El-Mawaziny, Ahmed H.
 1992
 32 12 p. 1667-1673
7 p.
 artikel
64 Examination of the voltage screening method in power MOSFET 1992
 32 12 p. 1783-
1 p.
 artikel
65 Exposure technology suits semiconductor mass-production 1992
 32 12 p. 1796-
1 p.
 artikel
66 Failure analysis of electronic devices and materials 1992
 32 12 p. 1799-
1 p.
 artikel
67 Failure mechanism for excessive deformation 1992
 32 12 p. 1790-
1 p.
 artikel
68 Fault diagnosis of reconfigurable multipipelines using boundary scans 1992
 32 12 p. 1788-
1 p.
 artikel
69 Fault-tolerance considerations for redundant binary-tree dynamic random-access-memory (RAM) chips 1992
 32 12 p. 1791-
1 p.
 artikel
70 Formation of shallow p + n junctions by implanting BF2 ions into thin cobalt films on silicon substrates 1992
 32 12 p. 1800-
1 p.
 artikel
71 Goodness-of-fit tests for the power-law process 1992
 32 12 p. 1787-
1 p.
 artikel
72 Hazard-rate tolerance method for an opportunistic-replacement policy 1992
 32 12 p. 1785-1786
2 p.
 artikel
73 High-level ASIC design tools 1992
 32 12 p. 1795-
1 p.
 artikel
74 Hybrid technology opens new development paths 1992
 32 12 p. 1799-
1 p.
 artikel
75 ICs going on a 3-V diet 1992
 32 12 p. 1796-
1 p.
 artikel
76 Influence of series resistances and interface coupling on the transconductance of fully-depleted silicon-on-insulator MOSFETs 1992
 32 12 p. 1783-
1 p.
 artikel
77 In situ monitoring of epitaxial film thickness by IEMI 1992
 32 12 p. 1798-
1 p.
 artikel
78 Integrated circuits for the S560 undersea transmission system 1992
 32 12 p. 1789-
1 p.
 artikel
79 Interval estimation of avilability of a series system 1992
 32 12 p. 1788-
1 p.
 artikel
80 Investigation of reliability improvements on die bonding and wire bonding process of IC 1992
 32 12 p. 1783-
1 p.
 artikel
81 Ion beam milling effect on surface properties of HgCdTe 1992
 32 12 p. 1799-
1 p.
 artikel
82 IR microscopic observation of plastic coated TAB inner lead bonds degrading during thermal cycling 1992
 32 12 p. 1784-
1 p.
 artikel
83 Linewidth measurements struggle with submicron processes 1992
 32 12 p. 1792-
1 p.
 artikel
84 Low-frequency noise as a tool for characterization of nearband impurities in silicon 1992
 32 12 p. 1797-
1 p.
 artikel
85 LSI current leakage spots detecting system 1992
 32 12 p. 1784-
1 p.
 artikel
86 LSI fabrication technology enters giga-bit age 1992
 32 12 p. 1792-
1 p.
 artikel
87 Making ohmic contacts to AIIIBV semiconductor devices: the role of interfacial reactions in OHMIC contact formation 1992
 32 12 p. 1797-
1 p.
 artikel
88 Market mixed, applications expand for hybrid ICs 1992
 32 12 p. 1799-
1 p.
 artikel
89 Material failure mechanisms and damage models 1992
 32 12 p. 1790-
1 p.
 artikel
90 Microcarrier for LSI chip used in the HITAC M-880 processor group 1992
 32 12 p. 1794-
1 p.
 artikel
91 Microprocessor-based quality testing of devices containing gases 1992
 32 12 p. 1784-
1 p.
 artikel
92 Minimal paths and cuts of networks exposed to common-cause failures 1992
 32 12 p. 1787-1788
2 p.
 artikel
93 Modeling of multilevel structures: a general method for analyzing stress evolution during processing 1992
 32 12 p. 1793-
1 p.
 artikel
94 Modelling by Bayes empirical Bayes and data analysis 1992
 32 12 p. 1786-
1 p.
 artikel
95 Modelling of band tails and their effects in minority carrier transport in heavily doped silicon 1992
 32 12 p. 1797-
1 p.
 artikel
96 Modified K-S, A-D and C-vM tests for the Pareto distribution with unknown location and scale parameters 1992
 32 12 p. 1787-
1 p.
 artikel
97 MoSi2 layer formation by ion implantation through metal technique 1992
 32 12 p. 1800-
1 p.
 artikel
98 New analytical polycrystalline-silicon thin-film transistor model for computer aided design and parameter extraction 1992
 32 12 p. 1798-
1 p.
 artikel
99 New packaging of a chip on a board by a unique printing method 1992
 32 12 p. 1793-
1 p.
 artikel
100 Note on disjoint products algorithms 1992
 32 12 p. 1788-
1 p.
 artikel
101 On a stochastic model of a non-Markovian time-dependent queueing system with general intertransition time distribution Sharma, S.D.
 1992
 32 12 p. 1657-1661
5 p.
 artikel
102 On computing reliability-measures of Boolean circuits 1992
 32 12 p. 1788-
1 p.
 artikel
103 On the relationship between yield and cycle time in semiconductor wafer fabrication 1992
 32 12 p. 1785-
1 p.
 artikel
104 On the role of fluorine in BF2 implanted silicon 1992
 32 12 p. 1799-1800
2 p.
 artikel
105 Optimal design of life testing for ULSI circuit manufacturing 1992
 32 12 p. 1790-
1 p.
 artikel
106 Optimal designs of (k, n − k + 1)-out-of-n:F systems (subject to 2 failure modes) 1992
 32 12 p. 1789-
1 p.
 artikel
107 Optimum simple step-stress accelerated life-tests with competing causes of failure 1992
 32 12 p. 1790-
1 p.
 artikel
108 Oxide precipitate-related luminescence in silicon 1992
 32 12 p. 1797-
1 p.
 artikel
109 Packaging of GaAs signal processors on multichip modules 1992
 32 12 p. 1794-
1 p.
 artikel
110 Particle deposition and removal in wet cleaning processes for ULSI manufacturing 1992
 32 12 p. 1794-1795
2 p.
 artikel
111 Polyamic alkyl esters: versatile polyimide precursors for improved dielectric coatings 1992
 32 12 p. 1794-
1 p.
 artikel
112 Power amplifier for ultra high frequency using conventional silicon NMOS IC technology 1992
 32 12 p. 1796-
1 p.
 artikel
113 Prediction intervals for future failures in the exponential distribution under hybrid censoring 1992
 32 12 p. 1787-
1 p.
 artikel
114 Prediction of product yield distributions from wafer parametric measurements of CMOS circuits 1992
 32 12 p. 1783-
1 p.
 artikel
115 Problems of semiconductor wafer geometry characterization 1992
 32 12 p. 1784-
1 p.
 artikel
116 Progress in devices produces distinctive wares 1992
 32 12 p. 1792-
1 p.
 artikel
117 Progress in gate array technology widens applications 1992
 32 12 p. 1796-
1 p.
 artikel
118 Quadratic statistics for the goodness-of-fit test of the inverse Gaussian distribution 1992
 32 12 p. 1787-
1 p.
 artikel
119 QUISC3: a distributed processing silicon compiler 1992
 32 12 p. 1790-
1 p.
 artikel
120 Reliability assessment based on accelerated degradation: a case study 1992
 32 12 p. 1789-
1 p.
 artikel
121 Reliability assurance of terminal system by use of terminal system simulation test (terminal-SST) facilities 1992
 32 12 p. 1786-
1 p.
 artikel
122 Reliability evaluation of bonding wires in power transistor modules under power cycling test 1992
 32 12 p. 1784-
1 p.
 artikel
123 Reliability of a k-out-of-n warm-standby system 1992
 32 12 p. 1785-
1 p.
 artikel
124 Research refines fuzzy logic technology, clarified artificial intelligence use 1992
 32 12 p. 1781-
1 p.
 artikel
125 Resistance computations for multilayer packaging structures by applying the boundary element method 1992
 32 12 p. 1794-
1 p.
 artikel
126 Sample sizes for estimating the Weibull hazard function from censored samples 1992
 32 12 p. 1786-
1 p.
 artikel
127 Self-pruning binary tree architectures for improved interconnection fault tolerance 1992
 32 12 p. 1791-
1 p.
 artikel
128 Simple enumeration of minimal cutsets separating two vertices in a class of undirected planar graphs 1992
 32 12 p. 1787-
1 p.
 artikel
129 Society of reliability engineers bulletin Reiche, Hans
 1992
 32 12 p. 1779-
1 p.
 artikel
130 Software reliability handbook Popentiu, Fl.
 1992
 32 12 p. 1775-1776
2 p.
 artikel
131 Software reliability measurement and assessment based on nonhomogeneous Poisson process models: A survey Yamada, Shigeru
 1992
 32 12 p. 1763-1773
11 p.
 artikel
132 State-of-the-art multichip modules for avionics 1992
 32 12 p. 1791-
1 p.
 artikel
133 Statistical bin limits—an approach to wafer disposition in IC fabrication 1992
 32 12 p. 1795-
1 p.
 artikel
134 Stochastic analysis of standby systems with common-cause failures and human errors Dhillon, Balbir S.
 1992
 32 12 p. 1699-1712
14 p.
 artikel
135 Suppressing effect of the moisture absorption in the semiconductor SMDs by the use of a dry-cabinet 1992
 32 12 p. 1784-
1 p.
 artikel
136 System failure-frequency analysis using a differential operator 1992
 32 12 p. 1788-
1 p.
 artikel
137 System-level modelling in VHDL 1992
 32 12 p. 1790-
1 p.
 artikel
138 Systems formulation of a theory of diagnosis from first principles 1992
 32 12 p. 1785-
1 p.
 artikel
139 Tantalum electrolytic capacitors evolve with chip technology 1992
 32 12 p. 1782-
1 p.
 artikel
140 Technology constraints in the VLSI implementation of digital mobile radio terminals 1992
 32 12 p. 1789-
1 p.
 artikel
141 Technology independent ASIC design methodology 1992
 32 12 p. 1795-
1 p.
 artikel
142 Terminal-pair reliability of tree-type computer communication networks 1992
 32 12 p. 1786-
1 p.
 artikel
143 Test coupons as an aid to process control of the PCB manufacturing and assembly processes 1992
 32 12 p. 1792-1793
2 p.
 artikel
144 Test dominates MCM assembly 1992
 32 12 p. 1795-
1 p.
 artikel
145 Test program ensures IC reliability 1992
 32 12 p. 1782-
1 p.
 artikel
146 The application of exploratory data analysis techniques to reliability data 1992
 32 12 p. 1786-
1 p.
 artikel
147 The design of second-order bit sliced infinite impulse response digital filter chips using CIRCAD II 1992
 32 12 p. 1795-1796
2 p.
 artikel
148 The measure of effect in an expert system for automatic generation of fault trees 1992
 32 12 p. 1785-
1 p.
 artikel
149 Theory and measurement of quantization effects on Si-SiO2 interface trap modelling 1992
 32 12 p. 1798-
1 p.
 artikel
150 The transistor modeling problem again Ratschek, H.
 1992
 32 12 p. 1725-1740
16 p.
 artikel
151 Thickness determination of thin SiO2 on silicon 1992
 32 12 p. 1798-
1 p.
 artikel
152 Title section, volume, contents and author index, volume 32, 1992 1992
 32 12 p. i-xiv
nvt p.
 artikel
153 TRACE—traceability and reliability assuring computerized environment 1992
 32 12 p. 1783-
1 p.
 artikel
154 Trade-offs in cycle time management: hot lots 1992
 32 12 p. 1788-
1 p.
 artikel
155 Trends and outlook for micromachining and micromechatronics 1992
 32 12 p. 1792-
1 p.
 artikel
156 Trends in reliability, miniature designs push control relay market toward ¥200 billion level 1992
 32 12 p. 1782-
1 p.
 artikel
157 Trends spur chip parts production, technology gains 1992
 32 12 p. 1792-
1 p.
 artikel
158 Two-dimensional model of impurity diffusion in polysilicon-silicon structures 1992
 32 12 p. 1797-
1 p.
 artikel
159 Unified apparent bandgap narrowing in n- and p-type silicon 1992
 32 12 p. 1797-
1 p.
 artikel
160 Using a test site for the rapid introduction of 32-kb bipolar RAM 1992
 32 12 p. 1790-
1 p.
 artikel
161 Using yield models to accelerate learning curve progress 1992
 32 12 p. 1781-
1 p.
 artikel
162 VLSI architectural design of SDH products 1992
 32 12 p. 1791-
1 p.
 artikel
163 VLSI implementation of error correcting codes 1992
 32 12 p. 1796-
1 p.
 artikel
164 VLSI technology requirements for an ATM variable bit rate video codec 1992
 32 12 p. 1789-
1 p.
 artikel
165 Voting mechanisms in distributed systems 1992
 32 12 p. 1790-1791
2 p.
 artikel
                             165 gevonden resultaten
 
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