Digital Library
Close Browse articles from a journal
 
Search for with title:
ABCDEFGHIJKLMNOPQRSTUVWXYZ

     Journal description
       All volumes of the corresponding journal
         All issues of the corresponding volume
                                       All articles of the corresponding issues
 
                             165 results found
no title author magazine year volume issue page(s) type
1 A Bayes classifier when the class distributions come from a common multivariate normal distribution 1992
 32 12 p. 1787-
1 p.
 article
2 Acceleration test method of IC card 1992
 32 12 p. 1783-
1 p.
 article
3 Accounting for bandstructure effects in the hydrodynamic model: a first-order approach for silicon device simulation 1992
 32 12 p. 1796-1797
2 p.
 article
4 A comparison of the optical projection lithography simulators in SAMPLE and PROLITH 1992
 32 12 p. 1795-
1 p.
 article
5 Advanced ultrapure wafer systems with low dissolved oxygen for native oxide free wafer processing 1992
 32 12 p. 1794-
1 p.
 article
6 A failure analysis for LSIs using FIB technology 1992
 32 12 p. 1785-
1 p.
 article
7 A feasibility study for the fabrication of planar silicon multichip modules using electron beam lithography for precise location and interconnection of chips 1992
 32 12 p. 1799-
1 p.
 article
8 A general characterization and simulation method for deposition and etching technology 1992
 32 12 p. 1795-
1 p.
 article
9 A generic cell controller for the automated VLSI manufacturing facility 1992
 32 12 p. 1792-
1 p.
 article
10 A G|M|M system with M|M switch and orientation time for the repair facility Sarma, Yadavalli V.S.
 1992
 32 12 p. 1663-1666
4 p.
 article
11 A heuristic approach to optimal assignment of components to a parallel-series network 1992
 32 12 p. 1781-1782
2 p.
 article
12 A linearly dependent service rate for the queue: M/M/1/N with general balk function, reflecting barrier, reneging and an additional server for longer queues Abou El-Ata, M.O.
 1992
 32 12 p. 1693-1698
6 p.
 article
13 Aluminium recrystallization of transistor due to repeated pulses and the countermeasure 1992
 32 12 p. 1783-
1 p.
 article
14 A multilevel epoxy substrate for flip-chip hybrid multichip module applications 1992
 32 12 p. 1798-1799
2 p.
 article
15 Analogue and mixed-signal IC design 1992
 32 12 p. 1794-
1 p.
 article
16 Analysis of monitoring policies Gopalan, M.N.
 1992
 32 12 p. 1681-1686
6 p.
 article
17 An electric double-layer capacitor with high capacitance and low resistance 1992
 32 12 p. 1784-1785
2 p.
 article
18 An equipment model for polysilicon LPC VD 1992
 32 12 p. 1797-
1 p.
 article
19 A point-by-point multiple sweep numerical algorithm for dopant profiling based on C-V data 1992
 32 12 p. 1786-
1 p.
 article
20 Application of statistical analysis to determine the priority for improving LSI technology 1992
 32 12 p. 1790-
1 p.
 article
21 Applying statistics to find the causes of variability in aluminum evaporation: a case study 1992
 32 12 p. 1797-
1 p.
 article
22 A quantitative technique to analyze materials trade-off for SEM “E” 1992
 32 12 p. 1796-
1 p.
 article
23 A reliability model for connector contacts 1992
 32 12 p. 1782-
1 p.
 article
24 A review of the skin effect as applied to thin film interconnections 1992
 32 12 p. 1799-
1 p.
 article
25 ASIC testing upgraded 1992
 32 12 p. 1796-
1 p.
 article
26 Assembling and troubleshooting microcomputers Second edition Popentiu, Florin
 1992
 32 12 p. 1777-
1 p.
 article
27 A standardized method for CMOS unit process development 1992
 32 12 p. 1784-
1 p.
 article
28 A study of a method for evaluating small size samples—judgement of small numbers of test data taking into account variability 1992
 32 12 p. 1785-
1 p.
 article
29 A study of defects induced in GaAs by plasma etching 1992
 32 12 p. 1798-
1 p.
 article
30 A study of ESD-induced defects in high-voltage nMOS and pMOS transistors 1992
 32 12 p. 1784-
1 p.
 article
31 A survey of reliability-prediction procedures for microelectronic devices 1992
 32 12 p. 1784-
1 p.
 article
32 Asynchronous reliability growth for multi-device in same type 1992
 32 12 p. 1786-
1 p.
 article
33 A two-unit priority standby system subject to random shocks and Releigh failure-time distribution Gupta, Rakesh
 1992
 32 12 p. 1713-1723
11 p.
 article
34 A two-unit standby system with imperfect switch, preventive maintenance and correlated failures and repairs Goel, L.R.
 1992
 32 12 p. 1687-1691
5 p.
 article
35 Availability, MTTF and cost analysis of a three-state parallel redundant multi-component system under critical human failures Elias, S.S.
 1992
 32 12 p. 1741-1761
21 p.
 article
36 Availability of a parallel system with preventive maintenance and common-cause failures 1992
 32 12 p. 1787-
1 p.
 article
37 Availability of systems with partially observable failures 1992
 32 12 p. 1787-
1 p.
 article
38 Availability of the crystallization system in the sugar industry under common-cause failure 1992
 32 12 p. 1781-
1 p.
 article
39 A VLSI placement method using Tabu search 1992
 32 12 p. 1791-
1 p.
 article
40 Bayes estimation of hazard and acceleration in accelerated testing 1992
 32 12 p. 1789-
1 p.
 article
41 Binary and phase shifting mask design for optical lithography 1992
 32 12 p. 1795-
1 p.
 article
42 Board testers merge in-circuit and functional test 1992
 32 12 p. 1796-
1 p.
 article
43 Breakdown characteristics of emitter-base and collector-base junctions of silicon bipolar junction transistors 1992
 32 12 p. 1782-
1 p.
 article
44 Burn-in: still a hot topic 1992
 32 12 p. 1781-
1 p.
 article
45 Capacitors adopt new technologies compatible with product trends 1992
 32 12 p. 1782-
1 p.
 article
46 Comparative evaluation of optical waveguides as alternative interconnections for high performance packaging 1992
 32 12 p. 1793-1794
2 p.
 article
47 Comparative study of submicron BiCMOS technologies 1992
 32 12 p. 1792-
1 p.
 article
48 Concept of accelerated life test and implementation—a study on evaluation for solder joint fatigue of automotive electronic components 1992
 32 12 p. 1782-1783
2 p.
 article
49 Connectors for IC memory cards developed for higher reliability 1992
 32 12 p. 1785-
1 p.
 article
50 Cost analysis of a two-unit repairable system subject to on-line preventive maintenance and/or repair Gopalan, M.N.
 1992
 32 12 p. 1675-1679
5 p.
 article
51 Cost optimization of maintenance scheduling for a system with assured reliability 1992
 32 12 p. 1788-
1 p.
 article
52 Counting the number of minimum cuts in undirected multigraphs 1992
 32 12 p. 1788-
1 p.
 article
53 Development of the high speed temperature cycle test 1992
 32 12 p. 1792-
1 p.
 article
54 Discussion of failures and their causes in electronic devices (belong to MTTF system) 1992
 32 12 p. 1785-
1 p.
 article
55 DRAMs hold sway in semiconductor memory fields 1992
 32 12 p. 1796-
1 p.
 article
56 E-beam test system with higher performance by improving signal source 1992
 32 12 p. 1799-
1 p.
 article
57 Electrical design technology for low dielectric constant multilayer ceramic substrate 1992
 32 12 p. 1793-
1 p.
 article
58 Electric testers lead in market growth electric measuring instruments 1992
 32 12 p. 1781-
1 p.
 article
59 Electronic equipment packaging technology Gavrilescu, Dana
 1992
 32 12 p. 1778-
1 p.
 article
60 Estimating the reliability of electrical connectors 1992
 32 12 p. 1782-
1 p.
 article
61 Estimation of network reliability using graph evolution models 1992
 32 12 p. 1789-
1 p.
 article
62 Estimators for type-II censored (log) normal samples 1992
 32 12 p. 1789-
1 p.
 article
63 Exact fiducial bounds for the reliability of series systems with components having exponential time to failure distributions El-Mawaziny, Ahmed H.
 1992
 32 12 p. 1667-1673
7 p.
 article
64 Examination of the voltage screening method in power MOSFET 1992
 32 12 p. 1783-
1 p.
 article
65 Exposure technology suits semiconductor mass-production 1992
 32 12 p. 1796-
1 p.
 article
66 Failure analysis of electronic devices and materials 1992
 32 12 p. 1799-
1 p.
 article
67 Failure mechanism for excessive deformation 1992
 32 12 p. 1790-
1 p.
 article
68 Fault diagnosis of reconfigurable multipipelines using boundary scans 1992
 32 12 p. 1788-
1 p.
 article
69 Fault-tolerance considerations for redundant binary-tree dynamic random-access-memory (RAM) chips 1992
 32 12 p. 1791-
1 p.
 article
70 Formation of shallow p + n junctions by implanting BF2 ions into thin cobalt films on silicon substrates 1992
 32 12 p. 1800-
1 p.
 article
71 Goodness-of-fit tests for the power-law process 1992
 32 12 p. 1787-
1 p.
 article
72 Hazard-rate tolerance method for an opportunistic-replacement policy 1992
 32 12 p. 1785-1786
2 p.
 article
73 High-level ASIC design tools 1992
 32 12 p. 1795-
1 p.
 article
74 Hybrid technology opens new development paths 1992
 32 12 p. 1799-
1 p.
 article
75 ICs going on a 3-V diet 1992
 32 12 p. 1796-
1 p.
 article
76 Influence of series resistances and interface coupling on the transconductance of fully-depleted silicon-on-insulator MOSFETs 1992
 32 12 p. 1783-
1 p.
 article
77 In situ monitoring of epitaxial film thickness by IEMI 1992
 32 12 p. 1798-
1 p.
 article
78 Integrated circuits for the S560 undersea transmission system 1992
 32 12 p. 1789-
1 p.
 article
79 Interval estimation of avilability of a series system 1992
 32 12 p. 1788-
1 p.
 article
80 Investigation of reliability improvements on die bonding and wire bonding process of IC 1992
 32 12 p. 1783-
1 p.
 article
81 Ion beam milling effect on surface properties of HgCdTe 1992
 32 12 p. 1799-
1 p.
 article
82 IR microscopic observation of plastic coated TAB inner lead bonds degrading during thermal cycling 1992
 32 12 p. 1784-
1 p.
 article
83 Linewidth measurements struggle with submicron processes 1992
 32 12 p. 1792-
1 p.
 article
84 Low-frequency noise as a tool for characterization of nearband impurities in silicon 1992
 32 12 p. 1797-
1 p.
 article
85 LSI current leakage spots detecting system 1992
 32 12 p. 1784-
1 p.
 article
86 LSI fabrication technology enters giga-bit age 1992
 32 12 p. 1792-
1 p.
 article
87 Making ohmic contacts to AIIIBV semiconductor devices: the role of interfacial reactions in OHMIC contact formation 1992
 32 12 p. 1797-
1 p.
 article
88 Market mixed, applications expand for hybrid ICs 1992
 32 12 p. 1799-
1 p.
 article
89 Material failure mechanisms and damage models 1992
 32 12 p. 1790-
1 p.
 article
90 Microcarrier for LSI chip used in the HITAC M-880 processor group 1992
 32 12 p. 1794-
1 p.
 article
91 Microprocessor-based quality testing of devices containing gases 1992
 32 12 p. 1784-
1 p.
 article
92 Minimal paths and cuts of networks exposed to common-cause failures 1992
 32 12 p. 1787-1788
2 p.
 article
93 Modeling of multilevel structures: a general method for analyzing stress evolution during processing 1992
 32 12 p. 1793-
1 p.
 article
94 Modelling by Bayes empirical Bayes and data analysis 1992
 32 12 p. 1786-
1 p.
 article
95 Modelling of band tails and their effects in minority carrier transport in heavily doped silicon 1992
 32 12 p. 1797-
1 p.
 article
96 Modified K-S, A-D and C-vM tests for the Pareto distribution with unknown location and scale parameters 1992
 32 12 p. 1787-
1 p.
 article
97 MoSi2 layer formation by ion implantation through metal technique 1992
 32 12 p. 1800-
1 p.
 article
98 New analytical polycrystalline-silicon thin-film transistor model for computer aided design and parameter extraction 1992
 32 12 p. 1798-
1 p.
 article
99 New packaging of a chip on a board by a unique printing method 1992
 32 12 p. 1793-
1 p.
 article
100 Note on disjoint products algorithms 1992
 32 12 p. 1788-
1 p.
 article
101 On a stochastic model of a non-Markovian time-dependent queueing system with general intertransition time distribution Sharma, S.D.
 1992
 32 12 p. 1657-1661
5 p.
 article
102 On computing reliability-measures of Boolean circuits 1992
 32 12 p. 1788-
1 p.
 article
103 On the relationship between yield and cycle time in semiconductor wafer fabrication 1992
 32 12 p. 1785-
1 p.
 article
104 On the role of fluorine in BF2 implanted silicon 1992
 32 12 p. 1799-1800
2 p.
 article
105 Optimal design of life testing for ULSI circuit manufacturing 1992
 32 12 p. 1790-
1 p.
 article
106 Optimal designs of (k, n − k + 1)-out-of-n:F systems (subject to 2 failure modes) 1992
 32 12 p. 1789-
1 p.
 article
107 Optimum simple step-stress accelerated life-tests with competing causes of failure 1992
 32 12 p. 1790-
1 p.
 article
108 Oxide precipitate-related luminescence in silicon 1992
 32 12 p. 1797-
1 p.
 article
109 Packaging of GaAs signal processors on multichip modules 1992
 32 12 p. 1794-
1 p.
 article
110 Particle deposition and removal in wet cleaning processes for ULSI manufacturing 1992
 32 12 p. 1794-1795
2 p.
 article
111 Polyamic alkyl esters: versatile polyimide precursors for improved dielectric coatings 1992
 32 12 p. 1794-
1 p.
 article
112 Power amplifier for ultra high frequency using conventional silicon NMOS IC technology 1992
 32 12 p. 1796-
1 p.
 article
113 Prediction intervals for future failures in the exponential distribution under hybrid censoring 1992
 32 12 p. 1787-
1 p.
 article
114 Prediction of product yield distributions from wafer parametric measurements of CMOS circuits 1992
 32 12 p. 1783-
1 p.
 article
115 Problems of semiconductor wafer geometry characterization 1992
 32 12 p. 1784-
1 p.
 article
116 Progress in devices produces distinctive wares 1992
 32 12 p. 1792-
1 p.
 article
117 Progress in gate array technology widens applications 1992
 32 12 p. 1796-
1 p.
 article
118 Quadratic statistics for the goodness-of-fit test of the inverse Gaussian distribution 1992
 32 12 p. 1787-
1 p.
 article
119 QUISC3: a distributed processing silicon compiler 1992
 32 12 p. 1790-
1 p.
 article
120 Reliability assessment based on accelerated degradation: a case study 1992
 32 12 p. 1789-
1 p.
 article
121 Reliability assurance of terminal system by use of terminal system simulation test (terminal-SST) facilities 1992
 32 12 p. 1786-
1 p.
 article
122 Reliability evaluation of bonding wires in power transistor modules under power cycling test 1992
 32 12 p. 1784-
1 p.
 article
123 Reliability of a k-out-of-n warm-standby system 1992
 32 12 p. 1785-
1 p.
 article
124 Research refines fuzzy logic technology, clarified artificial intelligence use 1992
 32 12 p. 1781-
1 p.
 article
125 Resistance computations for multilayer packaging structures by applying the boundary element method 1992
 32 12 p. 1794-
1 p.
 article
126 Sample sizes for estimating the Weibull hazard function from censored samples 1992
 32 12 p. 1786-
1 p.
 article
127 Self-pruning binary tree architectures for improved interconnection fault tolerance 1992
 32 12 p. 1791-
1 p.
 article
128 Simple enumeration of minimal cutsets separating two vertices in a class of undirected planar graphs 1992
 32 12 p. 1787-
1 p.
 article
129 Society of reliability engineers bulletin Reiche, Hans
 1992
 32 12 p. 1779-
1 p.
 article
130 Software reliability handbook Popentiu, Fl.
 1992
 32 12 p. 1775-1776
2 p.
 article
131 Software reliability measurement and assessment based on nonhomogeneous Poisson process models: A survey Yamada, Shigeru
 1992
 32 12 p. 1763-1773
11 p.
 article
132 State-of-the-art multichip modules for avionics 1992
 32 12 p. 1791-
1 p.
 article
133 Statistical bin limits—an approach to wafer disposition in IC fabrication 1992
 32 12 p. 1795-
1 p.
 article
134 Stochastic analysis of standby systems with common-cause failures and human errors Dhillon, Balbir S.
 1992
 32 12 p. 1699-1712
14 p.
 article
135 Suppressing effect of the moisture absorption in the semiconductor SMDs by the use of a dry-cabinet 1992
 32 12 p. 1784-
1 p.
 article
136 System failure-frequency analysis using a differential operator 1992
 32 12 p. 1788-
1 p.
 article
137 System-level modelling in VHDL 1992
 32 12 p. 1790-
1 p.
 article
138 Systems formulation of a theory of diagnosis from first principles 1992
 32 12 p. 1785-
1 p.
 article
139 Tantalum electrolytic capacitors evolve with chip technology 1992
 32 12 p. 1782-
1 p.
 article
140 Technology constraints in the VLSI implementation of digital mobile radio terminals 1992
 32 12 p. 1789-
1 p.
 article
141 Technology independent ASIC design methodology 1992
 32 12 p. 1795-
1 p.
 article
142 Terminal-pair reliability of tree-type computer communication networks 1992
 32 12 p. 1786-
1 p.
 article
143 Test coupons as an aid to process control of the PCB manufacturing and assembly processes 1992
 32 12 p. 1792-1793
2 p.
 article
144 Test dominates MCM assembly 1992
 32 12 p. 1795-
1 p.
 article
145 Test program ensures IC reliability 1992
 32 12 p. 1782-
1 p.
 article
146 The application of exploratory data analysis techniques to reliability data 1992
 32 12 p. 1786-
1 p.
 article
147 The design of second-order bit sliced infinite impulse response digital filter chips using CIRCAD II 1992
 32 12 p. 1795-1796
2 p.
 article
148 The measure of effect in an expert system for automatic generation of fault trees 1992
 32 12 p. 1785-
1 p.
 article
149 Theory and measurement of quantization effects on Si-SiO2 interface trap modelling 1992
 32 12 p. 1798-
1 p.
 article
150 The transistor modeling problem again Ratschek, H.
 1992
 32 12 p. 1725-1740
16 p.
 article
151 Thickness determination of thin SiO2 on silicon 1992
 32 12 p. 1798-
1 p.
 article
152 Title section, volume, contents and author index, volume 32, 1992 1992
 32 12 p. i-xiv
nvt p.
 article
153 TRACE—traceability and reliability assuring computerized environment 1992
 32 12 p. 1783-
1 p.
 article
154 Trade-offs in cycle time management: hot lots 1992
 32 12 p. 1788-
1 p.
 article
155 Trends and outlook for micromachining and micromechatronics 1992
 32 12 p. 1792-
1 p.
 article
156 Trends in reliability, miniature designs push control relay market toward ¥200 billion level 1992
 32 12 p. 1782-
1 p.
 article
157 Trends spur chip parts production, technology gains 1992
 32 12 p. 1792-
1 p.
 article
158 Two-dimensional model of impurity diffusion in polysilicon-silicon structures 1992
 32 12 p. 1797-
1 p.
 article
159 Unified apparent bandgap narrowing in n- and p-type silicon 1992
 32 12 p. 1797-
1 p.
 article
160 Using a test site for the rapid introduction of 32-kb bipolar RAM 1992
 32 12 p. 1790-
1 p.
 article
161 Using yield models to accelerate learning curve progress 1992
 32 12 p. 1781-
1 p.
 article
162 VLSI architectural design of SDH products 1992
 32 12 p. 1791-
1 p.
 article
163 VLSI implementation of error correcting codes 1992
 32 12 p. 1796-
1 p.
 article
164 VLSI technology requirements for an ATM variable bit rate video codec 1992
 32 12 p. 1789-
1 p.
 article
165 Voting mechanisms in distributed systems 1992
 32 12 p. 1790-1791
2 p.
 article
                             165 results found
 
 Koninklijke Bibliotheek - National Library of the Netherlands