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                             183 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A CAD coupled laser beam test system for digital circuit failure analysis 1992
32 1-2 p. 300-301
2 p.
artikel
2 A case study of ethernet anomalies in a distributed computing environment 1992
32 1-2 p. 289-
1 p.
artikel
3 A census of tandem system availability between 1985 and 1990 1992
32 1-2 p. 283-
1 p.
artikel
4 A class of shrinkage estimators for the scale parameter of the exponential distribution 1992
32 1-2 p. 290-
1 p.
artikel
5 A confidence interval for the availability ratio for systems with weibull operating time and lognormal repair time Masters, B.N.
1992
32 1-2 p. 89-99
11 p.
artikel
6 A- consecutive-k-out-of-n: G system: the mirror image of a consecutive-k-out-of-n: F system 1992
32 1-2 p. 292-
1 p.
artikel
7 Ada's fundamental language structures build reliable systems 1992
32 1-2 p. 283-
1 p.
artikel
8 Ag-Pd thick film conductor for AIN ceramics 1992
32 1-2 p. 298-
1 p.
artikel
9 A look at optoelectronic integrated circuits 1992
32 1-2 p. 292-
1 p.
artikel
10 A model for moisture induced corrosion failures in microelectronic packages 1992
32 1-2 p. 284-
1 p.
artikel
11 A model of charge transport in thermal SiO2 implanted with Si 1992
32 1-2 p. 301-
1 p.
artikel
12 A model of 1/f noise in polysilicon resistors 1992
32 1-2 p. 299-
1 p.
artikel
13 Analyzing the mechanical strength of SMT attached solder joints 1992
32 1-2 p. 285-
1 p.
artikel
14 An approximation analysis for the availability of a parallel redundant system with general distributions Yanagi, Shigeru
1992
32 1-2 p. 143-157
15 p.
artikel
15 An efficient algorithm to solve inter-programming problems arising in system-reliability design 1992
32 1-2 p. 292-
1 p.
artikel
16 A new intelligent one-chip microcomputer: the application-specific microcomputer 1992
32 1-2 p. 295-296
2 p.
artikel
17 A new recursive algorithm for the reliability evaluation of a distributed program Chen, Den-Jyi
1992
32 1-2 p. 25-33
9 p.
artikel
18 An investigation of pnp polysilicon emitter transistors 1992
32 1-2 p. 297-
1 p.
artikel
19 A note on recursive estimator of the density function which is not necessarily continuous El-Fahham, M.M.
1992
32 1-2 p. 79-87
9 p.
artikel
20 A novel Lossy and dispersive interconnect model for integrated circuit simulation 1992
32 1-2 p. 296-
1 p.
artikel
21 Application of DIN ISO 9000 through 9004 to the practice of nondestructive testing 1992
32 1-2 p. 283-
1 p.
artikel
22 A proportional hazards approach to correlate SiO2—breakdown voltage and time distributions 1992
32 1-2 p. 288-
1 p.
artikel
23 A review of the properties of aluminium alloy films used during silicon device fabrication 1992
32 1-2 p. 300-
1 p.
artikel
24 A simple expression for band gap narrowing (BGN) in heavily doped Si, Ge, GaAs and GexSi1−x strained layers 1992
32 1-2 p. 297-
1 p.
artikel
25 A simple model for life cycle cost vs maintainability function Govil, K.K.
1992
32 1-2 p. 269-270
2 p.
artikel
26 A submicron electron-beam tester for VLSI circuits beyond the 4-Mb DRAM 1992
32 1-2 p. 301-
1 p.
artikel
27 A unified performance reliability analysis of a system with a cumulative down time constraint Nicola, Victor
1992
32 1-2 p. 49-65
17 p.
artikel
28 Automated analysis of phased-mission reliability 1992
32 1-2 p. 291-
1 p.
artikel
29 Automated apparatus for long-term testing of electrical brushes 1992
32 1-2 p. 285-286
2 p.
artikel
30 Automatic soldering technology accommodates computer needs 1992
32 1-2 p. 295-
1 p.
artikel
31 A VLSI design for an efficient multiprocessor cache memory 1992
32 1-2 p. 296-
1 p.
artikel
32 A Weibull model to characterize lifetimes of aluminum alloy electrical wire connections 1992
32 1-2 p. 290-
1 p.
artikel
33 Bayes credibility estimation of an exponential parameter for random censoring and incomplete information 1992
32 1-2 p. 286-287
2 p.
artikel
34 Bayes estimates under asymmetric loss 1992
32 1-2 p. 290-
1 p.
artikel
35 Bayes predictive analysis of a fundamental software-reliability model 1992
32 1-2 p. 289-
1 p.
artikel
36 Benzocyclobutene interlayer dielectrics for thin film multichip modules 1992
32 1-2 p. 298-299
2 p.
artikel
37 Calculation of the Binomial survivor function 1992
32 1-2 p. 287-
1 p.
artikel
38 Calculation of the Poisson cumulative distribution function 1992
32 1-2 p. 289-
1 p.
artikel
39 Calendar of international conferences, symposia, lectures and meetings of interest 1992
32 1-2 p. 277-280
4 p.
artikel
40 Can a noninvasive reliability prediction of electronic boards be accurate? Rawicz, Andrew H.
1992
32 1-2 p. 223-232
10 p.
artikel
41 Characterization of the Pearson family of distributions 1992
32 1-2 p. 291-
1 p.
artikel
42 Chip tantalum capacitors take center stage among SMDs 1992
32 1-2 p. 296-
1 p.
artikel
43 Chip technology now available for aluminum electro-lytic capacitors 1992
32 1-2 p. 286-
1 p.
artikel
44 Clustered defects in IC fabrication: impact on process control charts 1992
32 1-2 p. 293-294
2 p.
artikel
45 Combining analog simulation techniques optimizes designs 1992
32 1-2 p. 293-
1 p.
artikel
46 Comment on: an efficient non-recursive algorithm for computing the reliability of k-out-of-n systems 1992
32 1-2 p. 291-
1 p.
artikel
47 Communication and transportation network reliability using routing models 1992
32 1-2 p. 288-
1 p.
artikel
48 Comparison of Bayesian nonparametric estimates of the reliability with rival estimates Papadopoulos, Alex S.
1992
32 1-2 p. 233-240
8 p.
artikel
49 Comparison of phosphorus, arsenic and boron implants into bulk silicon and SOS 1992
32 1-2 p. 301-
1 p.
artikel
50 Cost-benefit analysis of a 2-unit priority-standby system with patience-time for repair 1992
32 1-2 p. 290-
1 p.
artikel
51 Cost-benefit analysis of single server n-unit imperfect switch system with delayed repair Gopalan, M.N.
1992
32 1-2 p. 5-9
5 p.
artikel
52 Design a digital synchronizer with a low metastable-failure rate 1992
32 1-2 p. 296-
1 p.
artikel
53 Design guidelines for polymer thick-film technology 1992
32 1-2 p. 300-
1 p.
artikel
54 Designs meet needs of high-speed, high-density systems 1992
32 1-2 p. 293-
1 p.
artikel
55 Detection of multiple input bridging and stuck-on faults in CMOS logic circuits using current monitoring 1992
32 1-2 p. 287-
1 p.
artikel
56 Diffusion of ion implanted phosphorus in silicon in inert ambient 1992
32 1-2 p. 300-
1 p.
artikel
57 Drain engineering of hot-carrier-resistant MOSFETs using concave silicon surfaces for deep submicron VLSI technology 1992
32 1-2 p. 298-
1 p.
artikel
58 Dynamic behaviour of SMT chip capacitors during solder reflow 1992
32 1-2 p. 286-
1 p.
artikel
59 Editorial Board 1992
32 1-2 p. IFC-
1 p.
artikel
60 Efficient modeling parameter extraction for dual Pearson approach to simulation of implanted impurity profiles in silicon 1992
32 1-2 p. 297-298
2 p.
artikel
61 Electrical inhomogeneity in alloyed AuGe-Ni contact formed on GaAs 1992
32 1-2 p. 298-
1 p.
artikel
62 Electronic system packaging: the search for manufacturing the optimum in a sea of constraints 1992
32 1-2 p. 292-
1 p.
artikel
63 Electro-optic sampling of high-speed devices and integrated circuits 1992
32 1-2 p. 286-
1 p.
artikel
64 Empirically based analysis of failures in software systems 1992
32 1-2 p. 288-
1 p.
artikel
65 Enhancement of flip-chip fatigue life by encapsulation 1992
32 1-2 p. 284-
1 p.
artikel
66 Error log analysis: statistical modeling and heuristic trend analysis 1992
32 1-2 p. 287-
1 p.
artikel
67 Evaluating fault trees (AND and OR gates only) with repeated events 1992
32 1-2 p. 289-
1 p.
artikel
68 Evaluation and design of an ultra-reliable distributed architecture for fault tolerance 1992
32 1-2 p. 289-
1 p.
artikel
69 Evaluation of fuzzy reliability of a non-series parallel network Chowdhury, Sumandra Ghosh
1992
32 1-2 p. 1-4
4 p.
artikel
70 Event-tree analysis by fuzzy probability 1992
32 1-2 p. 291-
1 p.
artikel
71 Experimental evaluation of the fault tolerance of an atomic multicast system 1992
32 1-2 p. 291-
1 p.
artikel
72 Extended behavioral decomposition for estimating ultrahigh reliability 1992
32 1-2 p. 283-
1 p.
artikel
73 Extrapolation of high-voltage stress measurements to lowvoltage operation for thin silicon-oxide films 1992
32 1-2 p. 299-
1 p.
artikel
74 Fabrication of high density multichip modules 1992
32 1-2 p. 293-
1 p.
artikel
75 Fault-tolerant programs and their reliability 1992
32 1-2 p. 288-289
2 p.
artikel
76 Fault-trees for a voting circuit; synthesis and joint analysis Schneeweiss, Winfrid G.
1992
32 1-2 p. 35-47
13 p.
artikel
77 Fitting maintenance cost vs maintainability data to a standard curve Govil, K.K.
1992
32 1-2 p. 267-268
2 p.
artikel
78 Flexible picosecond probing of integrated circuits with chopped electron beams 1992
32 1-2 p. 294-
1 p.
artikel
79 1/f noise in ceramic superconductors and granular resistors 1992
32 1-2 p. 299-
1 p.
artikel
80 Focused ion beam technology 1992
32 1-2 p. 300-
1 p.
artikel
81 Formation of voids in silicone RTV dispersion under beam-leaded silicon integrated circuits 1992
32 1-2 p. 284-285
2 p.
artikel
82 Fundamentals of manipulator calibration G.W.A.D.,
1992
32 1-2 p. 275-276
2 p.
artikel
83 Hierarchical Bayesian approach to reliability estimation under competing risk Badarinathi, Ravija
1992
32 1-2 p. 249-258
10 p.
artikel
84 Hierarchical Bayesian reliability analysis using Erlang families of priors and hyperpriors Bhattacharya, Samir K.
1992
32 1-2 p. 241-247
7 p.
artikel
85 High-speed GaAs/AIGaAs optoelectronic devices for computer applications 1992
32 1-2 p. 296-
1 p.
artikel
86 High temperature millisecond annealing of arsenic implanted silicon 1992
32 1-2 p. 301-302
2 p.
artikel
87 High thermal conductivity aluminum nitride ceramic substrates and packages 1992
32 1-2 p. 294-
1 p.
artikel
88 Hi-Q chip model ceramic capacitors handle high frequencies 1992
32 1-2 p. 286-
1 p.
artikel
89 Hybrid ICs find market, adopt new technology 1992
32 1-2 p. 300-
1 p.
artikel
90 IC tester industry gears up for large-memory DRAMs 1992
32 1-2 p. 292-
1 p.
artikel
91 Impact ionization in silicon: a review and update 1992
32 1-2 p. 301-
1 p.
artikel
92 Impact of network failures on the performance degradation of a class of cluster-based multiprocessors 1992
32 1-2 p. 285-
1 p.
artikel
93 Implementing fault-tolerance via modular redundancy with comparison 1992
32 1-2 p. 287-288
2 p.
artikel
94 In-line statistical process control and feedback for VLSI integrated circuit manufacturing 1992
32 1-2 p. 294-295
2 p.
artikel
95 Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfaces 1992
32 1-2 p. 284-
1 p.
artikel
96 Introduction and certification of a quality assurance system 1992
32 1-2 p. 291-
1 p.
artikel
97 Investigation of arsenic-implanted silicon by optical reflectometry 1992
32 1-2 p. 301-
1 p.
artikel
98 Laptop PCs propel progress in half-pitch connectors 1992
32 1-2 p. 285-
1 p.
artikel
99 Large-scale GaAs ICs challenge bipolar ICs in speed, power, cost 1992
32 1-2 p. 296-
1 p.
artikel
100 Laser trimming of thick film metal resistors on aluminum nitride substrates 1992
32 1-2 p. 299-
1 p.
artikel
101 LED array modules by new technology microbump bonding method 1992
32 1-2 p. 294-
1 p.
artikel
102 Light simulation of molecular beam epitaxy 1992
32 1-2 p. 301-
1 p.
artikel
103 Makers expect ASICs to reverse computer slump 1992
32 1-2 p. 292-
1 p.
artikel
104 Mass production back-grinding/wafer-thinning technology for GaAs devices 1992
32 1-2 p. 295-
1 p.
artikel
105 Measurement of the standoff height between a flip-mounted IC chip and its substrate 1992
32 1-2 p. 293-
1 p.
artikel
106 Modelling of epitaxial growth rate of silicon by vapour phase epitaxy 1992
32 1-2 p. 298-
1 p.
artikel
107 Monte Carlo analysis of semiconductor devices: the DAMOCLES program 1992
32 1-2 p. 284-
1 p.
artikel
108 Multichip modules for advanced applications 1992
32 1-2 p. 294-
1 p.
artikel
109 Multilayer ceramic packaging alternatives 1992
32 1-2 p. 295-
1 p.
artikel
110 New development of thin plastic package with high terminal counts 1992
32 1-2 p. 295-
1 p.
artikel
111 Nonparametric confidence bounds, using censored data on the mean residual life 1992
32 1-2 p. 287-
1 p.
artikel
112 Ohmic contact electromigration Scorzoni, Andrea
1992
32 1-2 p. 167-174
8 p.
artikel
113 On comparison of estimators in a generalized life model Dey, Dipak K.
1992
32 1-2 p. 207-221
15 p.
artikel
114 On optimizing yield reliability and area overhead in large memory arrays Noore, A.
1992
32 1-2 p. 67-77
11 p.
artikel
115 On the analysis of accelerated life-testing experiments 1992
32 1-2 p. 291-
1 p.
artikel
116 On the possibility of internal gettering in commercially available silicon wafers 1992
32 1-2 p. 295-
1 p.
artikel
117 On the robustness of LDD and nMOS transistors subjected to measurement of drain breakdown voltage 1992
32 1-2 p. 286-
1 p.
artikel
118 Optically controlled current-voltage characteristics of ion-implanted MESFETs 1992
32 1-2 p. 301-
1 p.
artikel
119 Optimal allocation and control problems for software-testing resources 1992
32 1-2 p. 288-
1 p.
artikel
120 Optimal design of k-out-of-n redundant systems Pham, Hoang
1992
32 1-2 p. 119-126
8 p.
artikel
121 Optimal maintainability allocation using the geometric programming method Govil, K.K.
1992
32 1-2 p. 265-266
2 p.
artikel
122 Optimum reliability investment in the electronics industry Sultan, Torky I.
1992
32 1-2 p. 159-166
8 p.
artikel
123 Optimum software release policy with random life-cycle 1992
32 1-2 p. 289-
1 p.
artikel
124 Origin of gas impurities in sputtering plasmas during thin film deposition 1992
32 1-2 p. 299-
1 p.
artikel
125 Parallel Petri net path searching on a local area network—Object oriented Pascal implementation Anneberg, L.
1992
32 1-2 p. 199-206
8 p.
artikel
126 Passive chip components follow high-density trends 1992
32 1-2 p. 293-
1 p.
artikel
127 Picosecond noninvasive optical detection of internal electrical signals in flip-chip-mounted silicon integrated circuits 1992
32 1-2 p. 296-
1 p.
artikel
128 Picosecond photoemission probing of integrated circuits: capabilities, limitations, and applications 1992
32 1-2 p. 284-
1 p.
artikel
129 Point defect generation and arsenic diffusion in silicon in inert ambient 1992
32 1-2 p. 297-
1 p.
artikel
130 Point defect populations in amorphous and crystalline silicon 1992
32 1-2 p. 298-
1 p.
artikel
131 Potential and problems of high-temperature electronics and CMOS integrated circuits (25–250°C)—an overview 1992
32 1-2 p. 292-
1 p.
artikel
132 Practical experimental designs applied to haloing (Measling) on Teflon circuit boards 1992
32 1-2 p. 284-
1 p.
artikel
133 Predicting and eliminating built-in test false alarms 1992
32 1-2 p. 288-
1 p.
artikel
134 Principles of wet chemical processing in ULSI microfabrication 1992
32 1-2 p. 293-
1 p.
artikel
135 Printed wiring board inner layer contamination study 1992
32 1-2 p. 285-
1 p.
artikel
136 Product audit: quality assurance of quality assurance 1992
32 1-2 p. 283-
1 p.
artikel
137 Publications, notices, calls for papers, Etc. 1992
32 1-2 p. 281-
1 p.
artikel
138 Redundancy optimization of k-out-of-n systems with common-cause failures 1992
32 1-2 p. 290-
1 p.
artikel
139 Redundant-system demonstrated-reliability approximation using piece-part failure rates 1992
32 1-2 p. 285-
1 p.
artikel
140 Reliability analysis of a human operator under different levels of stress Chung, Who Kee
1992
32 1-2 p. 127-131
5 p.
artikel
141 Reliability analysis of two-unit warm standby system with partial failure mode and inspection time Pandey, D.K.
1992
32 1-2 p. 17-19
3 p.
artikel
142 Reliability demonstration testing for software 1992
32 1-2 p. 290-
1 p.
artikel
143 Reliability of modified designs: a Bayes analysis of an accelerated test of electronic assemblies 1992
32 1-2 p. 287-
1 p.
artikel
144 Reliability optimization in generalized stochastic-flow networks 1992
32 1-2 p. 287-
1 p.
artikel
145 Resistor networks increasing overall mounting density 1992
32 1-2 p. 299-
1 p.
artikel
146 Rules and criteria for when to stop testing a piece of software Petrova, E.
1992
32 1-2 p. 101-117
17 p.
artikel
147 Selecting, under type-II censoring, Weibull populations that are more reliable 1992
32 1-2 p. 287-
1 p.
artikel
148 Self-annealing in ion-implanted Si and GaAs 1992
32 1-2 p. 301-
1 p.
artikel
149 Silicon micromechanics: sensors and actuators on a chip 1992
32 1-2 p. 292-
1 p.
artikel
150 Simulated fault injection: a methodology to evaluate fault tolerant microprocessor architectures 1992
32 1-2 p. 290-
1 p.
artikel
151 Simulation and design of Lossy transmission lines in a thin-film multichip package 1992
32 1-2 p. 300-
1 p.
artikel
152 Simulation of electromigration behaviour in Al metallization of integrated circuits Scherge, M.
1992
32 1-2 p. 21-24
4 p.
artikel
153 Solder joint reliability of fine pitch surface mount technology assemblies 1992
32 1-2 p. 285-
1 p.
artikel
154 Stochastic modelling of a two-stage transfer-line production system with end buffer and random demand Gopalan, M.N.
1992
32 1-2 p. 11-15
5 p.
artikel
155 Submicron-gate-length GaAs MESFETs 1992
32 1-2 p. 296-
1 p.
artikel
156 Supply formats change with chip use trends 1992
32 1-2 p. 292-293
2 p.
artikel
157 Synchronization techniques for distributed systems: An overview Jeffrey Mee, W.
1992
32 1-2 p. 175-197
23 p.
artikel
158 System availability monitoring 1992
32 1-2 p. 288-
1 p.
artikel
159 Technical trends in optical connector development 1992
32 1-2 p. 296-
1 p.
artikel
160 Technology prevents reflow soldering defects linked to miniaturization 1992
32 1-2 p. 295-
1 p.
artikel
161 Temperature cycling effects between Sn/Pb solder and thick film Pd/Ag conductor metallization 1992
32 1-2 p. 299-
1 p.
artikel
162 Test generation for VLSI chips with embedded memories 1992
32 1-2 p. 294-
1 p.
artikel
163 Testing printed board assemblies in SMD technology 1992
32 1-2 p. 284-
1 p.
artikel
164 Testing whether one distribution is more IFR than another Wei, Xianhua
1992
32 1-2 p. 271-273
3 p.
artikel
165 Test planning as a basis for process control 1992
32 1-2 p. 290-
1 p.
artikel
166 The anisotropic model for simulation of a multilayer structure dry etching 1992
32 1-2 p. 293-
1 p.
artikel
167 The case for full convection reflow 1992
32 1-2 p. 294-
1 p.
artikel
168 The combined effects of strain and heavy doping on the indirect band gap of Si and GexSi1−x alloys 1992
32 1-2 p. 297-
1 p.
artikel
169 The development of ultra-high-frequency VLSI device test systems 1992
32 1-2 p. 293-
1 p.
artikel
170 The effectiveness of adding standby redundancy at system and component levels 1992
32 1-2 p. 288-
1 p.
artikel
171 The effect of statically and dynamically replicated components on system reliability 1992
32 1-2 p. 291-292
2 p.
artikel
172 The effects of localized hot-carrier-induced charge in VLSI switching circuits 1992
32 1-2 p. 297-
1 p.
artikel
173 The effects of variables sampling on component reliability 1992
32 1-2 p. 290-
1 p.
artikel
174 The mean time-to-failure of some special series-parallel arrays 1992
32 1-2 p. 292-
1 p.
artikel
175 The modeling of multi-layer structures and the impact of emitter-base coupling on the determination of base recombination parameters 1992
32 1-2 p. 298-
1 p.
artikel
176 Thermal breakdown in GaAs MES diodes 1992
32 1-2 p. 286-
1 p.
artikel
177 Thermal fatigue life of Pb-Sn alloy interconnections 1992
32 1-2 p. 285-
1 p.
artikel
178 The zero-truncated negative binomial distribution as a failure model from the Bayesian approach Kyriakoussis, A.
1992
32 1-2 p. 259-264
6 p.
artikel
179 Thick film resistors for AIN ceramics 1992
32 1-2 p. 300-
1 p.
artikel
180 Ultra high reliable spacecraft computer system design considerations Rayapati, Venkatapathi Naidu
1992
32 1-2 p. 133-142
10 p.
artikel
181 Ultra-thin dielectrics for semiconductor applications—growth and characteristics 1992
32 1-2 p. 298-
1 p.
artikel
182 Vacuum mechatronics and self-contained manufacturing for microelectronics processing 1992
32 1-2 p. 294-
1 p.
artikel
183 VXI packaging and power issues heat up 1992
32 1-2 p. 294-
1 p.
artikel
                             183 gevonden resultaten
 
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