| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Bayes approach to simultaneous evaluation of similar assemblies
|
|
|
1990
|
30 |
6 |
p. 1202-
1 p.
|
artikel
|
| 2 |
A critical evaluation of RGA testing
|
|
|
1990
|
30 |
6 |
p. 1205-
1 p.
|
artikel
|
| 3 |
A damage integral approach to thermal fatigue of solder joints
|
|
|
1990
|
30 |
6 |
p. 1200-
1 p.
|
artikel
|
| 4 |
AES sputter depth profiling of Cr/Ni multilayers using Ar+, O2 + and N2 + ions
|
|
|
1990
|
30 |
6 |
p. 1209-
1 p.
|
artikel
|
| 5 |
A method to test whether a system is near failure
|
Nakashima, Kyoichi
|
|
1990
|
30 |
6 |
p. 1049-1054
6 p.
|
artikel
|
| 6 |
A model for system reliability with common-cause failures
|
|
|
1990
|
30 |
6 |
p. 1202-
1 p.
|
artikel
|
| 7 |
An algorithmic approach to increased reliability through standby redundancy
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 8 |
Analysis of the development of large area surface topography during ion etching
|
|
|
1990
|
30 |
6 |
p. 1210-
1 p.
|
artikel
|
| 9 |
An analytical model for the MISIS structure in SOI MOS devices
|
|
|
1990
|
30 |
6 |
p. 1207-
1 p.
|
artikel
|
| 10 |
An efficient algorithm for drilling printed circuit boards
|
|
|
1990
|
30 |
6 |
p. 1201-
1 p.
|
artikel
|
| 11 |
A new empirical distribution for the uncertainty analysis of the top event of a fault tree
|
Kulkarni, Rajaram N.
|
|
1990
|
30 |
6 |
p. 1055-1059
5 p.
|
artikel
|
| 12 |
A new estimation approach based on periodic inspection
|
|
|
1990
|
30 |
6 |
p. 1202-
1 p.
|
artikel
|
| 13 |
A new mathematical model for semiconductor-on-insulator structures
|
|
|
1990
|
30 |
6 |
p. 1207-
1 p.
|
artikel
|
| 14 |
A new multichip module using a copper polyimide multilayer substrate
|
|
|
1990
|
30 |
6 |
p. 1206-
1 p.
|
artikel
|
| 15 |
An explicit closed-form formula for profit-maximizing k-out-of-n systems subject to two kinds of failures
|
Sah, Raaj K.
|
|
1990
|
30 |
6 |
p. 1123-1130
8 p.
|
artikel
|
| 16 |
An irreversible resistance transition in polycrystalline silicon thin film resistors
|
|
|
1990
|
30 |
6 |
p. 1208-
1 p.
|
artikel
|
| 17 |
An S-shaped software reliability growth model with two types of errors
|
Kareer, Nishi
|
|
1990
|
30 |
6 |
p. 1085-1090
6 p.
|
artikel
|
| 18 |
A practical end-of-life model for semiconductor devices
|
|
|
1990
|
30 |
6 |
p. 1200-
1 p.
|
artikel
|
| 19 |
A spreadsheet heuristic approach for the stocking and retention of slow-moving, obsolescent items
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 20 |
A tutorial on fault tolerance issues with applications in distributed systems
|
Walker, Dennis
|
|
1990
|
30 |
6 |
p. 1029-1037
9 p.
|
artikel
|
| 21 |
A unified approach to the development of an exceedingly efficient algorithm for digital filter design
|
Arora, R.K.
|
|
1990
|
30 |
6 |
p. 1075-1079
5 p.
|
artikel
|
| 22 |
Availability evaluation of flow networks with varying throughput-demand and deferred repair
|
|
|
1990
|
30 |
6 |
p. 1202-
1 p.
|
artikel
|
| 23 |
Barrier layer multilayer ceramic capacitor processing: effects of termination and plating process parameters
|
|
|
1990
|
30 |
6 |
p. 1200-
1 p.
|
artikel
|
| 24 |
Bounds evaluation of coefficients in the reliability polynomial
|
Camarda, Pietro
|
|
1990
|
30 |
6 |
p. 1099-1110
12 p.
|
artikel
|
| 25 |
Bounds on the reliability of binary coherent systems
|
|
|
1990
|
30 |
6 |
p. 1204-
1 p.
|
artikel
|
| 26 |
Comment on: queueing model of a bi-level Markov service-system and its solution using recursion
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 27 |
Comparative compliance of representative lead designs for surface-mounted components
|
|
|
1990
|
30 |
6 |
p. 1206-
1 p.
|
artikel
|
| 28 |
Comparative thermal performances of various substrate materials in a simple packaging application: actual versus predicted
|
|
|
1990
|
30 |
6 |
p. 1205-
1 p.
|
artikel
|
| 29 |
Computer communication networks—A study in the Indian context
|
Arora, R.K.
|
|
1990
|
30 |
6 |
p. 1081-1084
4 p.
|
artikel
|
| 30 |
Cost analysis of a two-dissimilar unit cold standby redundant system with administrative delay and no priority in repair
|
Elias, S.S.
|
|
1990
|
30 |
6 |
p. 1155-1177
23 p.
|
artikel
|
| 31 |
Creep-fatigue interactions in solders
|
|
|
1990
|
30 |
6 |
p. 1200-
1 p.
|
artikel
|
| 32 |
Design and cost analysis of a refining system in the sugar industry
|
Kumar, Dinesh
|
|
1990
|
30 |
6 |
p. 1025-1028
4 p.
|
artikel
|
| 33 |
Designing for reliable operation of urea synthesis in the fertilizer industry
|
Singh, Jai
|
|
1990
|
30 |
6 |
p. 1021-1024
4 p.
|
artikel
|
| 34 |
Development of a coated wire bonding technology
|
|
|
1990
|
30 |
6 |
p. 1206-
1 p.
|
artikel
|
| 35 |
Does ultrasonic cleaning damage components?
|
|
|
1990
|
30 |
6 |
p. 1205-
1 p.
|
artikel
|
| 36 |
Dynamic characterization of surface-mount component leads for solder joint inspection
|
|
|
1990
|
30 |
6 |
p. 1200-
1 p.
|
artikel
|
| 37 |
Dynamic redundancy allocation using Monte-Carlo optimization
|
Ramachandran, V.
|
|
1990
|
30 |
6 |
p. 1131-1136
6 p.
|
artikel
|
| 38 |
Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling
|
|
|
1990
|
30 |
6 |
p. 1201-
1 p.
|
artikel
|
| 39 |
Effect of strain rate on fatigue of low-tin lead-base solder
|
|
|
1990
|
30 |
6 |
p. 1201-
1 p.
|
artikel
|
| 40 |
Effects of redundancy management on reliability modeling
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 41 |
Effects of tip clearance and fin density on the performance of heat sinks for VLSI packages
|
|
|
1990
|
30 |
6 |
p. 1206-
1 p.
|
artikel
|
| 42 |
Electrical characterization of silicon surface after reactive ion etching of silicon dioxide by CHF3
|
Tong, K.Y.
|
|
1990
|
30 |
6 |
p. 1111-1116
6 p.
|
artikel
|
| 43 |
Electric measuring equipment output to reach ¥700 billion
|
|
|
1990
|
30 |
6 |
p. 1204-
1 p.
|
artikel
|
| 44 |
Electrostatic discharge (ESD) sensitivity of thin-film hybrid passive components
|
|
|
1990
|
30 |
6 |
p. 1208-1209
2 p.
|
artikel
|
| 45 |
Evaluation of the corrosion and reliability aspects of printed circuit boards flow soldered using “no clean” fluxes
|
|
|
1990
|
30 |
6 |
p. 1200-1201
2 p.
|
artikel
|
| 46 |
Fitting a multivariate failure time distribution
|
|
|
1990
|
30 |
6 |
p. 1202-
1 p.
|
artikel
|
| 47 |
Gate arrays ride ASIC popularity to greater demand
|
|
|
1990
|
30 |
6 |
p. 1206-1207
2 p.
|
artikel
|
| 48 |
Generalized reliability results for 1-out-of-n:G repairable systems
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 49 |
High heat flux cooling for silicon hybrid multichip packaging
|
|
|
1990
|
30 |
6 |
p. 1209-
1 p.
|
artikel
|
| 50 |
High performance polymers for packaging and interconnections in microelectronics
|
|
|
1990
|
30 |
6 |
p. 1206-
1 p.
|
artikel
|
| 51 |
High-performance power package for power-integrated circuit devices
|
|
|
1990
|
30 |
6 |
p. 1205-
1 p.
|
artikel
|
| 52 |
Influence of heat-treatment temperature and aluminum thickness on hillocks formation in thin aluminum films
|
|
|
1990
|
30 |
6 |
p. 1208-
1 p.
|
artikel
|
| 53 |
4888550 Intelligent multiprobe tip
|
Reid, LeeR
|
|
1990
|
30 |
6 |
p. iii-
1 p.
|
artikel
|
| 54 |
4885126 Interconnection mechanisms for electronic components
|
Polonio, JohnD
|
|
1990
|
30 |
6 |
p. ii-
1 p.
|
artikel
|
| 55 |
Investigation of mechanical stresses of plasma deposited silicon dioxide films
|
|
|
1990
|
30 |
6 |
p. 1208-
1 p.
|
artikel
|
| 56 |
θjc characterization of chip packages—justification, limitations, and future
|
|
|
1990
|
30 |
6 |
p. 1205-
1 p.
|
artikel
|
| 57 |
Laser induced damage in thin Ti and TiN films
|
|
|
1990
|
30 |
6 |
p. 1210-
1 p.
|
artikel
|
| 58 |
Lifetime distribution of circular consecutive-k-out-of-n:F systems with exchangeable lifetimes
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 59 |
4887267 Logic integrated circuit capable of simplifying a test
|
Kanuma, Akir
|
|
1990
|
30 |
6 |
p. ii-iii
nvt p.
|
artikel
|
| 60 |
Low cycle fatigue of surface-mounted chip-carrier/printed wiring board joints
|
|
|
1990
|
30 |
6 |
p. 1199-1200
2 p.
|
artikel
|
| 61 |
Low temperature plasma nitridation of thin thermal SiO2 and a silicon surface with native oxide
|
|
|
1990
|
30 |
6 |
p. 1207-
1 p.
|
artikel
|
| 62 |
4884027 Manual microcircuit die test system
|
Holderfield, DaronC
|
|
1990
|
30 |
6 |
p. i-ii
nvt p.
|
artikel
|
| 63 |
Mechanical behaviours of 60/40 tin-lead solder lap joints
|
|
|
1990
|
30 |
6 |
p. 1201-
1 p.
|
artikel
|
| 64 |
4882673 Method and apparatus for testing an integrated circuit including a microprocessor and an instruction cache
|
Witt, DavidB
|
|
1990
|
30 |
6 |
p. i-
1 p.
|
artikel
|
| 65 |
4884122 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
|
Eichelberger, CharlesW
|
|
1990
|
30 |
6 |
p. ii-
1 p.
|
artikel
|
| 66 |
4882298 Method for encapsulating microelectronic semiconductor and thin film devices
|
Moeller, Werner
|
|
1990
|
30 |
6 |
p. i-
1 p.
|
artikel
|
| 67 |
Microfabrication processes for high-Tc superconducting films
|
|
|
1990
|
30 |
6 |
p. 1209-1210
2 p.
|
artikel
|
| 68 |
MIL-STD-1772 and the future of military hybrids
|
|
|
1990
|
30 |
6 |
p. 1208-
1 p.
|
artikel
|
| 69 |
Molded hybrid IC packages
|
|
|
1990
|
30 |
6 |
p. 1209-
1 p.
|
artikel
|
| 70 |
MTBF of a complex binary coherent system
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 71 |
Multichip assembly with flipped integrated circuits
|
|
|
1990
|
30 |
6 |
p. 1205-
1 p.
|
artikel
|
| 72 |
Multichip modules: next-generation packages
|
|
|
1990
|
30 |
6 |
p. 1204-
1 p.
|
artikel
|
| 73 |
Multichip packaging technology with laser-patterned interconnects
|
|
|
1990
|
30 |
6 |
p. 1210-
1 p.
|
artikel
|
| 74 |
Multistate consecutively-connected systems
|
|
|
1990
|
30 |
6 |
p. 1202-
1 p.
|
artikel
|
| 75 |
New reliable methods of measuring temperature distribution on printed boards during operation
|
|
|
1990
|
30 |
6 |
p. 1201-
1 p.
|
artikel
|
| 76 |
Nonlinear transport phenomena in semiconductor devices
|
|
|
1990
|
30 |
6 |
p. 1207-
1 p.
|
artikel
|
| 77 |
Note by the editor-in-chief
|
Dummer, G.W.A.
|
|
1990
|
30 |
6 |
p. 1019-
1 p.
|
artikel
|
| 78 |
On common-cause failures—Bibliography
|
Dhillon, B.S.
|
|
1990
|
30 |
6 |
p. 1179-1195
17 p.
|
artikel
|
| 79 |
On delay fault testing in combinational circuits
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 80 |
On locating part bins in a constrained layout area for an automated assembly process
|
|
|
1990
|
30 |
6 |
p. 1205-
1 p.
|
artikel
|
| 81 |
On/off cycling under multiple stresses
|
|
|
1990
|
30 |
6 |
p. 1199-
1 p.
|
artikel
|
| 82 |
On the electrical resistivity and chemical etching of TiSi2 thin films sputtered from a composite target
|
Nahar, R.K.
|
|
1990
|
30 |
6 |
p. 1071-1074
4 p.
|
artikel
|
| 83 |
On the first failure time of two-unit systems in two environments
|
He, Qiming
|
|
1990
|
30 |
6 |
p. 1095-1097
3 p.
|
artikel
|
| 84 |
On the selection of gamma vs exponential distribution and adaptive estimation of the parameters
|
Singh, S.K.
|
|
1990
|
30 |
6 |
p. 1061-1064
4 p.
|
artikel
|
| 85 |
Optimal allocation for a repairable system
|
Cao, Jinhua
|
|
1990
|
30 |
6 |
p. 1091-1093
3 p.
|
artikel
|
| 86 |
Optimal fault margin in a computer system
|
Nakagawa, T.
|
|
1990
|
30 |
6 |
p. 1117-1121
5 p.
|
artikel
|
| 87 |
Optimal relayed mobile communication systems
|
|
|
1990
|
30 |
6 |
p. 1207-
1 p.
|
artikel
|
| 88 |
Optimal replacement policies for k-out-of-N systems
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 89 |
Plated copper on ceramic substrates for power hybrid circuits
|
|
|
1990
|
30 |
6 |
p. 1209-
1 p.
|
artikel
|
| 90 |
Products liability: component part manufacturer's liability for design and warning defects
|
|
|
1990
|
30 |
6 |
p. 1199-
1 p.
|
artikel
|
| 91 |
Prolog representation of reliability networks and evaluation of system reliability
|
Ramachandran, V.
|
|
1990
|
30 |
6 |
p. 1137-1143
7 p.
|
artikel
|
| 92 |
Quantification of thermal contact conductance in electronic packages
|
|
|
1990
|
30 |
6 |
p. 1205-
1 p.
|
artikel
|
| 93 |
Recursive solution technique in a multi-server bi-level queueing system with server breakdowns
|
|
|
1990
|
30 |
6 |
p. 1203-1204
2 p.
|
artikel
|
| 94 |
Relayed communication via parallel redundancy
|
|
|
1990
|
30 |
6 |
p. 1204-
1 p.
|
artikel
|
| 95 |
Reliability analysis of a system with a mixture of warm and cold standby
|
Gupta, Rakesh
|
|
1990
|
30 |
6 |
p. 1039-1042
4 p.
|
artikel
|
| 96 |
Reliability figures of merit for surface-soldered leadless chip carriers compared to leaded packages
|
|
|
1990
|
30 |
6 |
p. 1200-
1 p.
|
artikel
|
| 97 |
Rework and repair of printed wiring assemblies
|
|
|
1990
|
30 |
6 |
p. 1199-
1 p.
|
artikel
|
| 98 |
RF-sputtering of catalytic PtRh thin film on ceramic substrate
|
|
|
1990
|
30 |
6 |
p. 1208-
1 p.
|
artikel
|
| 99 |
Robustness of sequential gamma life testing procedures
|
Sharma, K.K.
|
|
1990
|
30 |
6 |
p. 1145-1153
9 p.
|
artikel
|
| 100 |
Semiconductor interlevel shorts caused by hillock formation in Al-Cu metallization
|
|
|
1990
|
30 |
6 |
p. 1201-1202
2 p.
|
artikel
|
| 101 |
4885721 Semiconductor memory device with redundant memory cells
|
Katanosaka, Naok
|
|
1990
|
30 |
6 |
p. ii-
1 p.
|
artikel
|
| 102 |
4888715 Semiconductor test system
|
Tada, Tetsu
|
|
1990
|
30 |
6 |
p. iii-
1 p.
|
artikel
|
| 103 |
Semiconductor vendors paying closer attention to ASIC
|
|
|
1990
|
30 |
6 |
p. 1204-
1 p.
|
artikel
|
| 104 |
Shrinkage estimation of threshold parameter of the exponential distribution
|
|
|
1990
|
30 |
6 |
p. 1202-
1 p.
|
artikel
|
| 105 |
Single-unit system with corrective maintenance at random checks governed by probabilities in a geometric progression
|
Goel, G.D.
|
|
1990
|
30 |
6 |
p. 1065-1069
5 p.
|
artikel
|
| 106 |
Society of reliability engineers bulletin
|
Reiche, Hans
|
|
1990
|
30 |
6 |
p. 1197-
1 p.
|
artikel
|
| 107 |
Some tests for comparing reliability growth/deterioration rates of repairable systems
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 108 |
Space groups of Ge/Si superlattices grown along the [110], [111], [112], [120], and [114] directions
|
|
|
1990
|
30 |
6 |
p. 1207-
1 p.
|
artikel
|
| 109 |
Study and preparation of high-Tc superconducting (HTSC) thin films for electronic applications
|
|
|
1990
|
30 |
6 |
p. 1208-
1 p.
|
artikel
|
| 110 |
Surface state characterization at the oxide-silicon and nitroxide-silicon interfaces
|
|
|
1990
|
30 |
6 |
p. 1207-
1 p.
|
artikel
|
| 111 |
Switch failure in a two duplex unit standby system
|
Singh, S.K.
|
|
1990
|
30 |
6 |
p. 1043-1048
6 p.
|
artikel
|
| 112 |
4888772 Testing circuit for random access memory device
|
Tanigawa, Takaho
|
|
1990
|
30 |
6 |
p. iii-
1 p.
|
artikel
|
| 113 |
4883428 Test socket incorporating circuit elements
|
Tonooka, Takashi
|
|
1990
|
30 |
6 |
p. i-
1 p.
|
artikel
|
| 114 |
The bathtub and flat earth society
|
|
|
1990
|
30 |
6 |
p. 1203-
1 p.
|
artikel
|
| 115 |
The effects of ultrasonic cleaning on device degradation
|
|
|
1990
|
30 |
6 |
p. 1206-
1 p.
|
artikel
|
| 116 |
Thermal stress analysis of a multichip package design
|
|
|
1990
|
30 |
6 |
p. 1204-
1 p.
|
artikel
|
| 117 |
Thermal studies on finned LSI packages using forced convection
|
|
|
1990
|
30 |
6 |
p. 1204-
1 p.
|
artikel
|
| 118 |
Thermomechanical fatigue of solder joints: a new comprehensive test method
|
|
|
1990
|
30 |
6 |
p. 1201-
1 p.
|
artikel
|
| 119 |
Title section, volume contents and author index, volume 30, 1990
|
|
|
1990
|
30 |
6 |
p. I-X
nvt p.
|
artikel
|
| 120 |
Treatment of catastrophic events in availability assessment
|
|
|
1990
|
30 |
6 |
p. 1202-
1 p.
|
artikel
|
| 121 |
Volatile species from conductive die attach adhesives
|
|
|
1990
|
30 |
6 |
p. 1205-
1 p.
|
artikel
|
| 122 |
XPS study of chemical bonding at polyimide interfaces with metal and semiconductor overlayers
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1990
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30 |
6 |
p. 1207-
1 p.
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artikel
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Tijdschrift beschrijving