| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A complex system having four types of components with pre-emptive repeat priority repairs
|
Singh, I.P.
|
|
1989
|
29 |
6 |
p. 959-962
4 p.
|
artikel
|
| 2 |
A creep-rupture model for two-phase eutectic solders
|
|
|
1989
|
29 |
6 |
p. 1094-
1 p.
|
artikel
|
| 3 |
Advanced electron-beam lithography for 0.5 μm to 0.25 μm device fabrication
|
|
|
1989
|
29 |
6 |
p. 1103-
1 p.
|
artikel
|
| 4 |
Advances in wire bonding technology for high lead count, high-density devices
|
|
|
1989
|
29 |
6 |
p. 1100-
1 p.
|
artikel
|
| 5 |
A European program on wafer scale integration
|
|
|
1989
|
29 |
6 |
p. 1100-
1 p.
|
artikel
|
| 6 |
Aluminum collector electrodes formed by the plasma spraying method for electric double-layer capacitors
|
|
|
1989
|
29 |
6 |
p. 1095-
1 p.
|
artikel
|
| 7 |
Aluminum corrosion at pad bond in the humidity tests
|
|
|
1989
|
29 |
6 |
p. 1094-
1 p.
|
artikel
|
| 8 |
A new R & M measure and its estimation
|
|
|
1989
|
29 |
6 |
p. 1096-
1 p.
|
artikel
|
| 9 |
A new technique in the global reliability of cyclic communications network
|
Sjogren, Jon A.
|
|
1989
|
29 |
6 |
p. 1069-1086
18 p.
|
artikel
|
| 10 |
A note on convergence problems in numerical techniques for accelerated life-testing analysis
|
|
|
1989
|
29 |
6 |
p. 1099-
1 p.
|
artikel
|
| 11 |
4813732 Apparatus and method for automated wafer handling
|
Klem, DavidC
|
|
1989
|
29 |
6 |
p. i-
1 p.
|
artikel
|
| 12 |
A practical implementation of the factoring theorem for network reliability
|
|
|
1989
|
29 |
6 |
p. 1098-
1 p.
|
artikel
|
| 13 |
A reliability analysis of the electrostatic discharge sensitivity of CMOS devices
|
Barry, D.M.
|
|
1989
|
29 |
6 |
p. 1051-1060
10 p.
|
artikel
|
| 14 |
A review of thick film glaze resistors
|
|
|
1989
|
29 |
6 |
p. 1103-
1 p.
|
artikel
|
| 15 |
A simple model for fatigue life
|
|
|
1989
|
29 |
6 |
p. 1098-
1 p.
|
artikel
|
| 16 |
Assessing throughput and reliability in communication and computer networks
|
|
|
1989
|
29 |
6 |
p. 1097-
1 p.
|
artikel
|
| 17 |
A type-II censored, log test-time based, component-testing procedure for a parallel system
|
|
|
1989
|
29 |
6 |
p. 1093-1094
2 p.
|
artikel
|
| 18 |
Automated inspection of circular parts
|
|
|
1989
|
29 |
6 |
p. 1095-
1 p.
|
artikel
|
| 19 |
Automated inspection of general shapes
|
|
|
1989
|
29 |
6 |
p. 1102-
1 p.
|
artikel
|
| 20 |
Avoiding low temperature thermal donors in CMOS
|
|
|
1989
|
29 |
6 |
p. 1102-
1 p.
|
artikel
|
| 21 |
Bayes estimation of the parameters and reliability function of the 3-parameter Weibull distribution
|
|
|
1989
|
29 |
6 |
p. 1096-
1 p.
|
artikel
|
| 22 |
Bayesian approach to life testing and reliability estimation under competing exponential failure distributions
|
Papadopoulos, Alex S.
|
|
1989
|
29 |
6 |
p. 1039-1050
12 p.
|
artikel
|
| 23 |
Bayesian shrinkage estimation of reliability from a censored sample from a finite range failure time model
|
Pandey, M.
|
|
1989
|
29 |
6 |
p. 955-958
4 p.
|
artikel
|
| 24 |
Careless pump maintenance will cost you
|
|
|
1989
|
29 |
6 |
p. 1094-
1 p.
|
artikel
|
| 25 |
4821142 Ceramic multilayer circuit board and semiconductor module
|
Ushifusa, Nobuyuki
|
|
1989
|
29 |
6 |
p. iii-
1 p.
|
artikel
|
| 26 |
Characterizations of gamma and negative binomial distributions
|
|
|
1989
|
29 |
6 |
p. 1096-
1 p.
|
artikel
|
| 27 |
Charge trapping and detrapping phenomena in thin oxidenitride-oxide stacked films
|
|
|
1989
|
29 |
6 |
p. 1102-
1 p.
|
artikel
|
| 28 |
Chemical beam epitaxy
|
|
|
1989
|
29 |
6 |
p. 1103-
1 p.
|
artikel
|
| 29 |
4816756 Circuit and method for statically testing rotating rectifiers in brushless alternators
|
Fox, DavidA
|
|
1989
|
29 |
6 |
p. ii-
1 p.
|
artikel
|
| 30 |
Comparing HAST results of differently pretreated plastic encapsulated integrated circuits
|
Fokkens, K.
|
|
1989
|
29 |
6 |
p. 1003-1009
7 p.
|
artikel
|
| 31 |
Comparison of two dissimilar unit reliability models with three types of repair facilities
|
Mokaddis, G.S.
|
|
1989
|
29 |
6 |
p. 925-945
21 p.
|
artikel
|
| 32 |
Dependence of activation energy on subband splitting and magnetic field in silicon inversion layers
|
|
|
1989
|
29 |
6 |
p. 1102-
1 p.
|
artikel
|
| 33 |
Design rules for microstrip capacitance
|
|
|
1989
|
29 |
6 |
p. 1101-
1 p.
|
artikel
|
| 34 |
Design trade-offs between organic polymer-on-metal PWB's and ceramic thick-film PWB's for high-density operation using leadless ceramic chip carriers
|
|
|
1989
|
29 |
6 |
p. 1101-
1 p.
|
artikel
|
| 35 |
Determination of the mobility profile in silicon-on-sapphire material using the “fat” FET principle
|
|
|
1989
|
29 |
6 |
p. 1102-
1 p.
|
artikel
|
| 36 |
Development and reliability evaluation of high reliability IC memory card
|
|
|
1989
|
29 |
6 |
p. 1095-
1 p.
|
artikel
|
| 37 |
Development of highly reliable surface mount packages
|
|
|
1989
|
29 |
6 |
p. 1094-
1 p.
|
artikel
|
| 38 |
Development of performance functions for communication/computer systems and its application to dynamic performance analysis
|
Sumita, Ushio
|
|
1989
|
29 |
6 |
p. 973-991
19 p.
|
artikel
|
| 39 |
Electronic production standards update. Part 1
|
|
|
1989
|
29 |
6 |
p. 1093-
1 p.
|
artikel
|
| 40 |
Electron mobility in In0.53Ga0.47As
|
|
|
1989
|
29 |
6 |
p. 1102-
1 p.
|
artikel
|
| 41 |
Essential concepts of computer architecture for programmers and computer users
|
G.W.A.D.,
|
|
1989
|
29 |
6 |
p. 1088-
1 p.
|
artikel
|
| 42 |
Estimation of system reliability for independent series components with Weibull life distributions
|
|
|
1989
|
29 |
6 |
p. 1096-
1 p.
|
artikel
|
| 43 |
Etch silicon dioxide with high selectivity and low polymer formation
|
|
|
1989
|
29 |
6 |
p. 1101-
1 p.
|
artikel
|
| 44 |
Fabrication of multi-layer LSI using laser beam
|
|
|
1989
|
29 |
6 |
p. 1103-
1 p.
|
artikel
|
| 45 |
Failure analysis of glass sealed thermistor for sensor and development of its evaluation method
|
|
|
1989
|
29 |
6 |
p. 1094-
1 p.
|
artikel
|
| 46 |
Failure rate of a cold- or hot-spared component with a log-normal lifetime
|
|
|
1989
|
29 |
6 |
p. 1099-
1 p.
|
artikel
|
| 47 |
Gallium arsenide. A new generation of integrated circuits
|
|
|
1989
|
29 |
6 |
p. 1101-
1 p.
|
artikel
|
| 48 |
High-level languages and their compilers
|
G.W.A.D.,
|
|
1989
|
29 |
6 |
p. 1089-1090
2 p.
|
artikel
|
| 49 |
High-throughput, high-resolution electron beam lithography
|
|
|
1989
|
29 |
6 |
p. 1104-
1 p.
|
artikel
|
| 50 |
Hot spot effects in hybrid circuits
|
|
|
1989
|
29 |
6 |
p. 1103-
1 p.
|
artikel
|
| 51 |
How thick are your thin films?
|
|
|
1989
|
29 |
6 |
p. 1103-
1 p.
|
artikel
|
| 52 |
How to automate analog IC designs
|
|
|
1989
|
29 |
6 |
p. 1101-
1 p.
|
artikel
|
| 53 |
How to test mixed-signal ICs
|
|
|
1989
|
29 |
6 |
p. 1094-
1 p.
|
artikel
|
| 54 |
Improved quality of continuous flow manufacturing through the combination of statistical process control and conventional computer process control
|
|
|
1989
|
29 |
6 |
p. 1095-1096
2 p.
|
artikel
|
| 55 |
Improvement of adhesion of copper on polyimide by reactive ion-beam etching
|
|
|
1989
|
29 |
6 |
p. 1103-
1 p.
|
artikel
|
| 56 |
Influence of silicon-sapphire interface defects on SOS MESFET behaviour
|
|
|
1989
|
29 |
6 |
p. 1102-
1 p.
|
artikel
|
| 57 |
Integer monolayer metallic superlattices
|
|
|
1989
|
29 |
6 |
p. 1102-
1 p.
|
artikel
|
| 58 |
Ion transport through protective polymeric coatings exposed to an aqueous phase
|
|
|
1989
|
29 |
6 |
p. 1093-
1 p.
|
artikel
|
| 59 |
k-out-of-m system availability with minimum-cost allocation of spares
|
|
|
1989
|
29 |
6 |
p. 1099-
1 p.
|
artikel
|
| 60 |
Lateral pin diodes for silicon-on-insulator monolithic microwave integrated circuits
|
|
|
1989
|
29 |
6 |
p. 1101-1102
2 p.
|
artikel
|
| 61 |
Matching vacuum pumps to processes
|
|
|
1989
|
29 |
6 |
p. 1101-
1 p.
|
artikel
|
| 62 |
Materials and processes for microstructure fabrication
|
|
|
1989
|
29 |
6 |
p. 1100-
1 p.
|
artikel
|
| 63 |
Mechanism of package cracking in plastic encapsulated surface mount package during reflow soldering and corrective action
|
|
|
1989
|
29 |
6 |
p. 1093-
1 p.
|
artikel
|
| 64 |
4816753 Method for reliability testing of integrated circuits
|
Palkuti, LeslieJ
|
|
1989
|
29 |
6 |
p. ii-
1 p.
|
artikel
|
| 65 |
4824800 Method of fabricating semiconductor devices
|
Takano, Hirozo
|
|
1989
|
29 |
6 |
p. iv-
1 p.
|
artikel
|
| 66 |
4817093 Method of partitioning, testing and diagnosing a VLSI multichip package and associated structure
|
Jacobs, ScottL
|
|
1989
|
29 |
6 |
p. ii-iii
nvt p.
|
artikel
|
| 67 |
4821271 Methods and circuits for checking integrated circuit chips having programmable outputs
|
Kini, MVittal
|
|
1989
|
29 |
6 |
p. iii-iv
nvt p.
|
artikel
|
| 68 |
Microprocessor architecture and design for GaAs technology
|
|
|
1989
|
29 |
6 |
p. 1101-
1 p.
|
artikel
|
| 69 |
Minimizing the total sample size when multiple 1-shot systems are compared against a common baseline
|
|
|
1989
|
29 |
6 |
p. 1097-
1 p.
|
artikel
|
| 70 |
200 mm silicon wafer future trends: flatter and cleaner
|
|
|
1989
|
29 |
6 |
p. 1099-1100
2 p.
|
artikel
|
| 71 |
Moment estimators for the 3-parameter Weibull distribution
|
|
|
1989
|
29 |
6 |
p. 1096-
1 p.
|
artikel
|
| 72 |
Nanolithography with a high-resolution STEM
|
|
|
1989
|
29 |
6 |
p. 1100-1101
2 p.
|
artikel
|
| 73 |
Nanostructure technology
|
|
|
1989
|
29 |
6 |
p. 1099-
1 p.
|
artikel
|
| 74 |
Network reliability with are failures and repairs
|
|
|
1989
|
29 |
6 |
p. 1098-
1 p.
|
artikel
|
| 75 |
New method calculates failure rates
|
|
|
1989
|
29 |
6 |
p. 1098-
1 p.
|
artikel
|
| 76 |
On computing MTBF for a k-out-of-n:G repairable system
|
|
|
1989
|
29 |
6 |
p. 1098-
1 p.
|
artikel
|
| 77 |
On measures of vulnerability of interconnection networks
|
Choi, M.
|
|
1989
|
29 |
6 |
p. 1011-1020
10 p.
|
artikel
|
| 78 |
On the nonequilibrium carrier density equations for highly doped devices and heterostructures
|
|
|
1989
|
29 |
6 |
p. 1102-
1 p.
|
artikel
|
| 79 |
Optimal “series-parallel” networks of 3-state devices
|
|
|
1989
|
29 |
6 |
p. 1097-1098
2 p.
|
artikel
|
| 80 |
Optimal wear-limit replacement with wear-dependent failures
|
|
|
1989
|
29 |
6 |
p. 1094-
1 p.
|
artikel
|
| 81 |
Optimization of spare provisioning for a periodically operated system
|
|
|
1989
|
29 |
6 |
p. 1098-1099
2 p.
|
artikel
|
| 82 |
Performance limits of electrical interconnections to a high-speed chip
|
|
|
1989
|
29 |
6 |
p. 1101-
1 p.
|
artikel
|
| 83 |
Performances and solutions of redundancy allocation using SUMT and SLUMT techniques
|
Cǎtuneanu, V.M.
|
|
1989
|
29 |
6 |
p. 919-924
6 p.
|
artikel
|
| 84 |
Physical design of circuit boards for testability and maintainability
|
|
|
1989
|
29 |
6 |
p. 1094-
1 p.
|
artikel
|
| 85 |
Probabilistic behavior and reliability analysis for a multi-robot system by applying Petri net and Markov renewal process theory
|
Jin, Qun
|
|
1989
|
29 |
6 |
p. 993-1001
9 p.
|
artikel
|
| 86 |
Products liability: A technical and ethical challenge
|
Jacobs, Richard M.
|
|
1989
|
29 |
6 |
p. 915-918
4 p.
|
artikel
|
| 87 |
Publications, notices, calls for papers, etc.
|
|
|
1989
|
29 |
6 |
p. 901-911
11 p.
|
artikel
|
| 88 |
Quality and innovation
|
|
|
1989
|
29 |
6 |
p. 1093-
1 p.
|
artikel
|
| 89 |
Quality control and inspection. Knowledge-based quality control system
|
|
|
1989
|
29 |
6 |
p. 1099-
1 p.
|
artikel
|
| 90 |
Queueing model of a bi-level Markov service system and its solution using recursion
|
|
|
1989
|
29 |
6 |
p. 1096-1097
2 p.
|
artikel
|
| 91 |
Reactive ion etching of semiconductor materials and of dielectric and metal layers
|
|
|
1989
|
29 |
6 |
p. 1104-
1 p.
|
artikel
|
| 92 |
4816757 Reconfigurable integrated circuit for enhanced testing in a manufacturing environment
|
Hutchins, Charles
|
|
1989
|
29 |
6 |
p. ii-
1 p.
|
artikel
|
| 93 |
Reliability analysis using Weibull lifetime data and expert opinion
|
|
|
1989
|
29 |
6 |
p. 1098-
1 p.
|
artikel
|
| 94 |
Reliability-constrained dimensioning of transmission resources in packet-switched networks
|
|
|
1989
|
29 |
6 |
p. 1097-
1 p.
|
artikel
|
| 95 |
Reliability evaluation in power-system transmission planning: practical considerations
|
|
|
1989
|
29 |
6 |
p. 1098-
1 p.
|
artikel
|
| 96 |
Reliability of an m-out of-n system when component failure induces higher failure rates in survivors
|
|
|
1989
|
29 |
6 |
p. 1097-
1 p.
|
artikel
|
| 97 |
Reliability study of a two-unit cold standby redundant system with two types of failure and preventive maintenance
|
Mahmoud, M.A.W.
|
|
1989
|
29 |
6 |
p. 1061-1068
8 p.
|
artikel
|
| 98 |
Reliability theory and applications
|
Min Xie,
|
|
1989
|
29 |
6 |
p. 1087-
1 p.
|
artikel
|
| 99 |
4817850 Repairable flip-chip bumping
|
Wiener-Avnear, Elieze
|
|
1989
|
29 |
6 |
p. iii-
1 p.
|
artikel
|
| 100 |
Replacement schedule under consideration of the change of preventive maintenance time
|
|
|
1989
|
29 |
6 |
p. 1099-
1 p.
|
artikel
|
| 101 |
Replacement vs repair of failed components for a system with a random lifetime
|
|
|
1989
|
29 |
6 |
p. 1094-
1 p.
|
artikel
|
| 102 |
Resolution limits for electron-beam lithography
|
|
|
1989
|
29 |
6 |
p. 1103-
1 p.
|
artikel
|
| 103 |
Schemes of dynamic redundancy for fault tolerance in random access memories
|
|
|
1989
|
29 |
6 |
p. 1098-
1 p.
|
artikel
|
| 104 |
Selection of a checkpoint interval in a critical-task environment
|
|
|
1989
|
29 |
6 |
p. 1096-
1 p.
|
artikel
|
| 105 |
4825439 Semiconductor logic integrated circuit device having first and second operation modes for testing
|
Sakashita, Kazuhio
|
|
1989
|
29 |
6 |
p. iv-
1 p.
|
artikel
|
| 106 |
4821238 Semiconductor memory device having test pattern generating circuit
|
Tatematsu, Takeo
|
|
1989
|
29 |
6 |
p. iii-
1 p.
|
artikel
|
| 107 |
Sequential imperfect preventive maintenance policies
|
|
|
1989
|
29 |
6 |
p. 1097-
1 p.
|
artikel
|
| 108 |
Shrinkage estimation of scale parameter of the extreme-value distribution
|
|
|
1989
|
29 |
6 |
p. 1097-
1 p.
|
artikel
|
| 109 |
Shrinkage testimators for the scale parameter of an exponential distribution at single and two stage
|
Pandey, B.N.
|
|
1989
|
29 |
6 |
p. 947-954
8 p.
|
artikel
|
| 110 |
Silicon trench etching made easy
|
|
|
1989
|
29 |
6 |
p. 1101-
1 p.
|
artikel
|
| 111 |
4814283 Simple automated discretionary bonding of multiple parallel elements
|
Temple, VictorA.K.
|
|
1989
|
29 |
6 |
p. i-
1 p.
|
artikel
|
| 112 |
Society of reliability engineers newsletter
|
|
|
1989
|
29 |
6 |
p. 913-
1 p.
|
artikel
|
| 113 |
Solderability degradation models for fusible tin alloy coatings on copper substrates
|
|
|
1989
|
29 |
6 |
p. 1104-
1 p.
|
artikel
|
| 114 |
Some reliability problems of surface-mounted devices
|
|
|
1989
|
29 |
6 |
p. 1094-1095
2 p.
|
artikel
|
| 115 |
Some studies on antimony implanted silicon
|
Virdi, G.S.
|
|
1989
|
29 |
6 |
p. 963-964
2 p.
|
artikel
|
| 116 |
Speeding IC design verification
|
|
|
1989
|
29 |
6 |
p. 1100-
1 p.
|
artikel
|
| 117 |
Standardizing test data formats
|
|
|
1989
|
29 |
6 |
p. 1096-
1 p.
|
artikel
|
| 118 |
Study of soldering heat test method for plastic encapsulated surface mount packages
|
|
|
1989
|
29 |
6 |
p. 1095-
1 p.
|
artikel
|
| 119 |
4814639 Super integration circuit device having a plurality of IC-chip equivalent regions formed on a single semiconductor substrate
|
Saito, Tomotaka
|
|
1989
|
29 |
6 |
p. ii-
1 p.
|
artikel
|
| 120 |
Surface patterning of GaAs by CCl2F2 reactive ion etching
|
|
|
1989
|
29 |
6 |
p. 1104-
1 p.
|
artikel
|
| 121 |
System manufacturer's quality improving activity for resistor fixed
|
|
|
1989
|
29 |
6 |
p. 1093-
1 p.
|
artikel
|
| 122 |
Systems with exponential life using components with HNBUE lives
|
|
|
1989
|
29 |
6 |
p. 1097-
1 p.
|
artikel
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| 123 |
Testing boards with the VXlbus
|
|
|
1989
|
29 |
6 |
p. 1102-
1 p.
|
artikel
|
| 124 |
Testing whether failure rate changes its trend
|
|
|
1989
|
29 |
6 |
p. 1093-
1 p.
|
artikel
|
| 125 |
The evaluation of statistical process control methods by simulation
|
|
|
1989
|
29 |
6 |
p. 1095-
1 p.
|
artikel
|
| 126 |
The influence for MTTR of maintenance engineers and maintenance support organization (case study of makers' maintenance practice on industrial computer systems)
|
|
|
1989
|
29 |
6 |
p. 1096-
1 p.
|
artikel
|
| 127 |
The latest features of heat shock testing equipment and thermal effects on semiconductors
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|
|
1989
|
29 |
6 |
p. 1095-
1 p.
|
artikel
|
| 128 |
The long-term stability of some integrated circuit resistors
|
Dimba, A.A.
|
|
1989
|
29 |
6 |
p. 1035-1038
4 p.
|
artikel
|
| 129 |
Thermal stress in semiconductor encapsulating materials
|
|
|
1989
|
29 |
6 |
p. 1100-
1 p.
|
artikel
|
| 130 |
The silicon PCB
|
|
|
1989
|
29 |
6 |
p. 1100-
1 p.
|
artikel
|
| 131 |
The world of silicon: it's dog eat dog
|
|
|
1989
|
29 |
6 |
p. 1100-
1 p.
|
artikel
|
| 132 |
Thick-film circuit layout using the magic layout editor
|
|
|
1989
|
29 |
6 |
p. 1103-
1 p.
|
artikel
|
| 133 |
Threshold voltage characteristics of ion-implanted depletion MOSFETs
|
|
|
1989
|
29 |
6 |
p. 1103-1104
2 p.
|
artikel
|
| 134 |
Title section, volume contents and author index, volume 29, 1989
|
|
|
1989
|
29 |
6 |
p. I-X
nvt p.
|
artikel
|
| 135 |
Transient-fault analysis for retry techniques
|
|
|
1989
|
29 |
6 |
p. 1096-
1 p.
|
artikel
|
| 136 |
Trends in lithography
|
|
|
1989
|
29 |
6 |
p. 1100-
1 p.
|
artikel
|
| 137 |
Turning point identification and Bayesian forecasting of a volatile time series
|
|
|
1989
|
29 |
6 |
p. 1099-
1 p.
|
artikel
|
| 138 |
Two properties of mixtures of exponential distributions
|
|
|
1989
|
29 |
6 |
p. 1096-
1 p.
|
artikel
|
| 139 |
Ultra large scale integrated microelectronics
|
G.W.A.D.,
|
|
1989
|
29 |
6 |
p. 1090-1091
2 p.
|
artikel
|
| 140 |
Universal decoding for random design of screening experiments
|
Dyachkov, A.G.
|
|
1989
|
29 |
6 |
p. 965-971
7 p.
|
artikel
|
| 141 |
Variance importance of system components by Monte Carlo
|
|
|
1989
|
29 |
6 |
p. 1097-
1 p.
|
artikel
|
| 142 |
Very large scale integrated CMOS buffer design
|
Venkatapathi Naidu, Rayapati
|
|
1989
|
29 |
6 |
p. 1021-1033
13 p.
|
artikel
|
| 143 |
VLSI testing and testability considerations: an overview
|
|
|
1989
|
29 |
6 |
p. 1095-
1 p.
|
artikel
|
| 144 |
Watch your vacuums and RF by PC to make your process repeatable
|
|
|
1989
|
29 |
6 |
p. 1101-
1 p.
|
artikel
|
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