| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Boolean algebra method for reliability calculations
|
|
|
1984
|
24 |
4 |
p. 809-
1 p.
|
artikel
|
| 2 |
A complex three-unit system
|
Sarma, Y.V.S.
|
|
1984
|
24 |
4 |
p. 661-662
2 p.
|
artikel
|
| 3 |
A data-base for IC mask making
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 4 |
A distribution-free upper confidence bound for PR (Y < X): an application to stress-strength models
|
|
|
1984
|
24 |
4 |
p. 810-811
2 p.
|
artikel
|
| 5 |
A generalization of Freund's model for a repairable paired component based on a bivariate Geiger Muller (G.M.) counter
|
Biswas, Suddhendu
|
|
1984
|
24 |
4 |
p. 671-675
5 p.
|
artikel
|
| 6 |
A graphical method for optimal reliability allocation
|
|
|
1984
|
24 |
4 |
p. 810-
1 p.
|
artikel
|
| 7 |
A k-out-of-N:G redundant system with cold standby units and common-cause failures
|
Chung, Who Kee
|
|
1984
|
24 |
4 |
p. 691-695
5 p.
|
artikel
|
| 8 |
A low-leakage VLSI CMOS/SOS process with thin epilayers
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 9 |
Aluminum wire for thermosonic ball bonding in semiconductor devices
|
|
|
1984
|
24 |
4 |
p. 813-
1 p.
|
artikel
|
| 10 |
A modified Kolmogorov-Smirnov test for Weibull distributions with unknown location and scale parameters
|
|
|
1984
|
24 |
4 |
p. 809-
1 p.
|
artikel
|
| 11 |
Amorphous BN films produced in a double-plasma reactor for semiconductor applications
|
|
|
1984
|
24 |
4 |
p. 820-
1 p.
|
artikel
|
| 12 |
Amorphous metallic alloys in semiconductor contact metallizations
|
|
|
1984
|
24 |
4 |
p. 817-
1 p.
|
artikel
|
| 13 |
A multicomponent two-unit cold standby system with three modes
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 14 |
A multi-standby multi-failure mode system with repair and replacement policy
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 15 |
A multistate system with two repair distributions
|
|
|
1984
|
24 |
4 |
p. 810-
1 p.
|
artikel
|
| 16 |
An AES, SAM and RHEED study of InP (110) subjected to ion bombardment and annealing treatments
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 17 |
Analysis of a two-engine aeroplane model with two types of failure and preventive maintenance
|
Goel, L.R.
|
|
1984
|
24 |
4 |
p. 663-666
4 p.
|
artikel
|
| 18 |
Analysis of a two-unit parallel redundancy with an imperfect switch
|
|
|
1984
|
24 |
4 |
p. 809-
1 p.
|
artikel
|
| 19 |
Analysis of leakage currents in CMOS/SOS devices
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 20 |
Analysis of surface mount thermal and thermal stress performance
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 21 |
An analytical method for determining intrinsic drain/source resistance of lightly doped drain (LDD) devices
|
|
|
1984
|
24 |
4 |
p. 819-
1 p.
|
artikel
|
| 22 |
A new chip carrier for high performance applications: integrated decoupling capacitor chip carrier (IDCCC)
|
|
|
1984
|
24 |
4 |
p. 812-
1 p.
|
artikel
|
| 23 |
A new frequency independent attenuator in distributed multilayer thin film microsystem
|
|
|
1984
|
24 |
4 |
p. 820-
1 p.
|
artikel
|
| 24 |
A new ion dose uniformity measurement technique
|
|
|
1984
|
24 |
4 |
p. 825-
1 p.
|
artikel
|
| 25 |
An ion milled coplanar SOS technology
|
|
|
1984
|
24 |
4 |
p. 813-
1 p.
|
artikel
|
| 26 |
A normal approximation to distributions of likelihood ratio statistics in life testing, reliability and multivariate analysis of variance
|
Singh, N.
|
|
1984
|
24 |
4 |
p. 697-706
10 p.
|
artikel
|
| 27 |
A normalized analytical solution for the capacitance associated with uniformly doped semiconductors at equilibrium
|
|
|
1984
|
24 |
4 |
p. 818-
1 p.
|
artikel
|
| 28 |
A novel electroless technique for copper metallization of alumina substrates
|
|
|
1984
|
24 |
4 |
p. 821-
1 p.
|
artikel
|
| 29 |
Applications of excimer lasers in microelectronics
|
|
|
1984
|
24 |
4 |
p. 825-
1 p.
|
artikel
|
| 30 |
A process-compatible electron beam direct write system
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 31 |
A process for two-layer gold IC metallization
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 32 |
A pruned tree approach to reliability computation
|
|
|
1984
|
24 |
4 |
p. 810-
1 p.
|
artikel
|
| 33 |
A re-examination of practical performance limits of scaled n-channel and p-channel MOS devices for VLSI
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 34 |
A simple method of photomask yield optimization by defect inspection
|
Gupta, S.N.
|
|
1984
|
24 |
4 |
p. 625-627
3 p.
|
artikel
|
| 35 |
A single unit multicomponent system subject to various types of failures
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 36 |
Aspects of European and Japanese quality management
|
|
|
1984
|
24 |
4 |
p. 805-
1 p.
|
artikel
|
| 37 |
A strategy for rule verification shrinks LSI layouts
|
|
|
1984
|
24 |
4 |
p. 812-
1 p.
|
artikel
|
| 38 |
A study of grown-in impurities in silicon by deep-level transient spectroscopy
|
|
|
1984
|
24 |
4 |
p. 818-
1 p.
|
artikel
|
| 39 |
Automated measurement system for the investigation of surface state distribution
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 40 |
Availability analysis of transit systems
|
Dhillon, Balbir S.
|
|
1984
|
24 |
4 |
p. 761-768
8 p.
|
artikel
|
| 41 |
Band structure, impurity levels and Stark effects in superlattices
|
|
|
1984
|
24 |
4 |
p. 818-
1 p.
|
artikel
|
| 42 |
Beam-recrystallized silicon-on-insulator films: can devices live with grain boundaries?
|
|
|
1984
|
24 |
4 |
p. 824-
1 p.
|
artikel
|
| 43 |
Behind the “bathtub”-curve a new model and its consequences
|
|
|
1984
|
24 |
4 |
p. 810-
1 p.
|
artikel
|
| 44 |
Bipolar silicon power is crucial to communications systems
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 45 |
Calculations of systems unreliability by algebraic manipulation of failure event
|
Hasanuddin Ahmad, S.
|
|
1984
|
24 |
4 |
p. 793-799
7 p.
|
artikel
|
| 46 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1984
|
24 |
4 |
p. 599-603
5 p.
|
artikel
|
| 47 |
Carrier lifetime in (Al, Ga)As epilayers and double heterostructure lasers grown with metal-organic vapour-phase epitaxy and liquid-phase epitaxy
|
|
|
1984
|
24 |
4 |
p. 817-
1 p.
|
artikel
|
| 48 |
Characteristics and analysis of instability induced by secondary slow trapping in scaled CMOS devices
|
|
|
1984
|
24 |
4 |
p. 817-
1 p.
|
artikel
|
| 49 |
Characterization of ion implanted silicon—applications for IC process control
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 50 |
Characterization of Se implanted layers for GaAs FETS
|
|
|
1984
|
24 |
4 |
p. 824-
1 p.
|
artikel
|
| 51 |
CHMOS improves system efficiency
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 52 |
Clustering VAX superminicomputers into large multiprocessor systems
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 53 |
C-MOS process reduces chip size as much as a third
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 54 |
CMOS regenerative logic circuits
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 55 |
Conference Report The IEEE reliability and maintainability symposium 1984
|
Jacobs, Richard M.
|
|
1984
|
24 |
4 |
p. 613-616
4 p.
|
artikel
|
| 56 |
Cost based reliability growth apportionment
|
|
|
1984
|
24 |
4 |
p. 809-
1 p.
|
artikel
|
| 57 |
Cost-benefit analysis of a one-server two-unit system subject to two types of failure
|
|
|
1984
|
24 |
4 |
p. 809-810
2 p.
|
artikel
|
| 58 |
Cost-benefit analysis of a 1-server n-unit system subject to general repair and inspection
|
|
|
1984
|
24 |
4 |
p. 810-
1 p.
|
artikel
|
| 59 |
Cost-effective reliable software engineering and development
|
Reddi, Arumalla V.
|
|
1984
|
24 |
4 |
p. 677-682
6 p.
|
artikel
|
| 60 |
Current methods for silicon wafer characterization
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 61 |
Debugging station is easily reconfigured for emulation tasks
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 62 |
Defect analysis system speeds test and repair of redundant memories
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 63 |
Defect-free silicon sought by Pentagon for VHSIC program
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 64 |
Deposition equipment
|
|
|
1984
|
24 |
4 |
p. 813-
1 p.
|
artikel
|
| 65 |
Designing solder paste materials to attach surface mounted devices
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 66 |
Design of a high performance DIP-like pin array package for logic devices
|
|
|
1984
|
24 |
4 |
p. 813-814
2 p.
|
artikel
|
| 67 |
Design of an accurate production E-beam system
|
|
|
1984
|
24 |
4 |
p. 822-823
2 p.
|
artikel
|
| 68 |
Design of testable logic circuits
|
G.W.A.D.,
|
|
1984
|
24 |
4 |
p. 801-
1 p.
|
artikel
|
| 69 |
Design parameters of four-terminal distributed thin film integrated band-reject filter
|
|
|
1984
|
24 |
4 |
p. 820-
1 p.
|
artikel
|
| 70 |
Detroit unveils sophisticated electronics
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 71 |
Development of a reliability strategy for new IC component family and process
|
|
|
1984
|
24 |
4 |
p. 805-
1 p.
|
artikel
|
| 72 |
Die bonding and package sealing materials
|
|
|
1984
|
24 |
4 |
p. 814-815
2 p.
|
artikel
|
| 73 |
Diffusion, ion implantation and annealing
|
|
|
1984
|
24 |
4 |
p. 824-
1 p.
|
artikel
|
| 74 |
Direct attachment of leadless chip carriers to organic matrix printed wiring boards
|
|
|
1984
|
24 |
4 |
p. 812-
1 p.
|
artikel
|
| 75 |
Direct-write electron beam system
|
|
|
1984
|
24 |
4 |
p. 822-
1 p.
|
artikel
|
| 76 |
E-beam system metrology
|
|
|
1984
|
24 |
4 |
p. 822-
1 p.
|
artikel
|
| 77 |
EBIC and LBIC techniques for characterization of reverse biased power devices
|
|
|
1984
|
24 |
4 |
p. 824-
1 p.
|
artikel
|
| 78 |
Economics of multiple site testing of PCBs
|
|
|
1984
|
24 |
4 |
p. 807-
1 p.
|
artikel
|
| 79 |
Editorial
|
G.W.A.D.,
|
|
1984
|
24 |
4 |
p. 607-612
6 p.
|
artikel
|
| 80 |
EE-PROM adds on-chip flexibility
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 81 |
Effect of HCl and Cl2 on Pd inlay coupons and Pd connector contacts
|
|
|
1984
|
24 |
4 |
p. 806-807
2 p.
|
artikel
|
| 82 |
Effect of pad capacitance on the notch frequency of the MOS distributed RC (MOS-RC) notch network
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 83 |
Effects of accelerated temperature testing on the low-frequency noise of planar NPN transistors
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 84 |
Electrical characterization of insulator-semiconductor interface states
|
|
|
1984
|
24 |
4 |
p. 817-
1 p.
|
artikel
|
| 85 |
Electrical characterization of ion-implanted silicon-on-sapphire
|
|
|
1984
|
24 |
4 |
p. 825-
1 p.
|
artikel
|
| 86 |
Electrical design of a high speed computer packaging system
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 87 |
Electrical properties of gallium arsenide ingots
|
|
|
1984
|
24 |
4 |
p. 818-
1 p.
|
artikel
|
| 88 |
Electron-beam recrystallized polysilicon on silicon dioxide
|
|
|
1984
|
24 |
4 |
p. 825-
1 p.
|
artikel
|
| 89 |
Electronic structure calculations of V2 + O2 complexes in silicon
|
|
|
1984
|
24 |
4 |
p. 818-
1 p.
|
artikel
|
| 90 |
EL systems: high throughput electron beam lithography tools
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 91 |
Enumeration of all 2-trees in a graph through petri nets
|
|
|
1984
|
24 |
4 |
p. 807-
1 p.
|
artikel
|
| 92 |
Etching systems
|
|
|
1984
|
24 |
4 |
p. 813-
1 p.
|
artikel
|
| 93 |
Fabrication of damage free micropatterns in silicon
|
Gupta, R.P.
|
|
1984
|
24 |
4 |
p. 623-624
2 p.
|
artikel
|
| 94 |
Facing the headaches of early failures: a state-of-the-art review of burn-in decisions
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 95 |
Failure physics of integrated circuits—a review
|
|
|
1984
|
24 |
4 |
p. 807-
1 p.
|
artikel
|
| 96 |
Fatigue life of leadless chip carrier solder joints during power cycling
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 97 |
Fault tree analysis method of a system having components of multiple failure modes
|
|
|
1984
|
24 |
4 |
p. 809-
1 p.
|
artikel
|
| 98 |
Focused ion beams in microelectronic fabrication
|
|
|
1984
|
24 |
4 |
p. 824-
1 p.
|
artikel
|
| 99 |
Full-wafer memory for colour displays has 1.5-Mb capacity
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 100 |
Generalised availability measures for a multi-unit repairable system with standby failure
|
Kapur, P.K.
|
|
1984
|
24 |
4 |
p. 637-646
10 p.
|
artikel
|
| 101 |
Gold on palladium connector contacts
|
|
|
1984
|
24 |
4 |
p. 807-
1 p.
|
artikel
|
| 102 |
Government systems incorporate GaAs monolithics
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 103 |
Grain-boundary scattering and surface plasmon attenuation in noble metal films
|
|
|
1984
|
24 |
4 |
p. 821-
1 p.
|
artikel
|
| 104 |
Gunn-effect oscillators have historically had superior spectral purity compared to other solid-state microwave sources
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 105 |
High performance thick film gold conductors
|
|
|
1984
|
24 |
4 |
p. 821-
1 p.
|
artikel
|
| 106 |
High pinout IC packaging and the density advantage of surface mounting
|
|
|
1984
|
24 |
4 |
p. 812-
1 p.
|
artikel
|
| 107 |
High slew rate CMOS operational amplifier employing internal transistor compensation
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 108 |
High-speed reactive ion etching of silicon by the application of a confined DC bias
|
|
|
1984
|
24 |
4 |
p. 825-
1 p.
|
artikel
|
| 109 |
High-speed testing equipment essential to AMRAAM development program success
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 110 |
High technology: the key to growth
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 111 |
High thermal conduction package technology for flip chip devices
|
|
|
1984
|
24 |
4 |
p. 812-813
2 p.
|
artikel
|
| 112 |
High throughput variable shaped electron beam lithography
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 113 |
Hole and electron mobilities in heavily doped silicon: comparison of theory and experiment
|
|
|
1984
|
24 |
4 |
p. 819-
1 p.
|
artikel
|
| 114 |
IC wafer fab economics and lithography equipment selection: the inextricable link
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 115 |
Improved electrical performance required for future MOS packaging
|
|
|
1984
|
24 |
4 |
p. 812-
1 p.
|
artikel
|
| 116 |
Improving the reverse recovery of power MOSFET integral diodes by electron irradiation
|
|
|
1984
|
24 |
4 |
p. 823-824
2 p.
|
artikel
|
| 117 |
Influence of anneal temperature on the mobile ion concentration in MOS structures
|
|
|
1984
|
24 |
4 |
p. 817-
1 p.
|
artikel
|
| 118 |
Inspection frequency and availability of emergency equipment
|
Anders, George J.
|
|
1984
|
24 |
4 |
p. 683-690
8 p.
|
artikel
|
| 119 |
Inspection, measuring, and testing equipment
|
|
|
1984
|
24 |
4 |
p. 807-
1 p.
|
artikel
|
| 120 |
Insulation displacement connector reliability
|
|
|
1984
|
24 |
4 |
p. 807-
1 p.
|
artikel
|
| 121 |
Integrated non-uniform thin-film micro-systems of circular geometry
|
Ahmed, Kamal U.
|
|
1984
|
24 |
4 |
p. 667-669
3 p.
|
artikel
|
| 122 |
Investigation of information loss mechanisms in EPROMs
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 123 |
Ion implantation and rapid annealing of 125mm wafers
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 124 |
Laser induced backside damage gettering
|
|
|
1984
|
24 |
4 |
p. 825-
1 p.
|
artikel
|
| 125 |
LEED evaluation of three models of the Si(100) surface
|
|
|
1984
|
24 |
4 |
p. 819-
1 p.
|
artikel
|
| 126 |
Lifetime and drift velocity analysis for electromigration in sputtered Al films, multilayers and alloys
|
|
|
1984
|
24 |
4 |
p. 820-
1 p.
|
artikel
|
| 127 |
Low temperature processed MOSFET's using laser recrystallized polycrystalline silicon films
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 128 |
Magnetron-enhanced plasma etching of silicon and silicon dioxide
|
|
|
1984
|
24 |
4 |
p. 822-
1 p.
|
artikel
|
| 129 |
Maintainability and availability calculations for series, parallel and r-out-of-n configurations
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 130 |
Manifestations of deep levels point defects in GaAs
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 131 |
Modelling of integrated circuit defect sensitivities
|
|
|
1984
|
24 |
4 |
p. 807-
1 p.
|
artikel
|
| 132 |
Modification to the reduction technique of Thomas Case for obtaining a simplified reliability expression
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 133 |
Molecular beam epitaxy for research and production
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 134 |
More than a decade of the non-saturating autoclave as a highly accelerated stress technique for evaluating the reliability of nonhermetic microelectronic components
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 135 |
M.S.C. centralized maintenance for transmission networks
|
|
|
1984
|
24 |
4 |
p. 810-
1 p.
|
artikel
|
| 136 |
Multi-standby system with repair and replacement policy
|
|
|
1984
|
24 |
4 |
p. 809-
1 p.
|
artikel
|
| 137 |
NASA eyes crystal processing in space
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 138 |
Network quality tester
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 139 |
New stencil screen developments for thick film printing
|
|
|
1984
|
24 |
4 |
p. 821-
1 p.
|
artikel
|
| 140 |
Novel IC metallization test structures for drop-in process monitors
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 141 |
Nucleation and growth of thin films: recent progress
|
|
|
1984
|
24 |
4 |
p. 822-
1 p.
|
artikel
|
| 142 |
On a two-unit standby redundant system with two types of failures and preventive maintenance
|
|
|
1984
|
24 |
4 |
p. 810-
1 p.
|
artikel
|
| 143 |
One method for interval estimation of Weibull shape parameter
|
Brkich, D.M.
|
|
1984
|
24 |
4 |
p. 659-660
2 p.
|
artikel
|
| 144 |
On optimal maintenance of a series system
|
|
|
1984
|
24 |
4 |
p. 807-808
2 p.
|
artikel
|
| 145 |
On power line carrier communication (PLC)
|
Sherif, Yosef S.
|
|
1984
|
24 |
4 |
p. 781-791
11 p.
|
artikel
|
| 146 |
On standby redundant system with repair, post repair and preventive maintenance
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 147 |
Optimal allocation of cost to detectors in a two-unit series system
|
Kumar, Ashok
|
|
1984
|
24 |
4 |
p. 633-636
4 p.
|
artikel
|
| 148 |
Optimal scheduling of multiple preventive maintenance activities
|
|
|
1984
|
24 |
4 |
p. 810-
1 p.
|
artikel
|
| 149 |
Optimum component switching for systems that operate and idle
|
Pirie, K.
|
|
1984
|
24 |
4 |
p. 769-780
12 p.
|
artikel
|
| 150 |
Parallel processing interactively simulates complex VSLI logic
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 151 |
Parametric test system update
|
|
|
1984
|
24 |
4 |
p. 812-
1 p.
|
artikel
|
| 152 |
Performance-related dependability evaluation of supercomputer systems
|
Arlat, J.
|
|
1984
|
24 |
4 |
p. 717-742
26 p.
|
artikel
|
| 153 |
Photoionization of impurity atoms in semiconductors in the presence of an applied electric field
|
|
|
1984
|
24 |
4 |
p. 819-
1 p.
|
artikel
|
| 154 |
Pinhole array capacitor for oxide integrity analysis
|
|
|
1984
|
24 |
4 |
p. 818-
1 p.
|
artikel
|
| 155 |
Precision fineness of grind measurement—techniques and instrumentation—for thick film pastes
|
|
|
1984
|
24 |
4 |
p. 820-
1 p.
|
artikel
|
| 156 |
Precision voltage references outgrow temperature-stabilizing ovens
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 157 |
Principles of laser scanning for defect and contamination detection in microfabrication
|
|
|
1984
|
24 |
4 |
p. 825-
1 p.
|
artikel
|
| 158 |
Printed board assembly cleanliness—standards, practice and reliability considerations
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 159 |
Printed-circuit-board assembly picks up on automation
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 160 |
Production of hybrid circuits and quality assurance
|
|
|
1984
|
24 |
4 |
p. 821-
1 p.
|
artikel
|
| 161 |
Protocols and network-control chips: a symbiotic relationship
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 162 |
Publications, notices, calls for papers, etc.
|
|
|
1984
|
24 |
4 |
p. 605-
1 p.
|
artikel
|
| 163 |
Quality assurance system and reliability testing of LSI circuits
|
|
|
1984
|
24 |
4 |
p. 807-
1 p.
|
artikel
|
| 164 |
Quality assurance with laser light and microprocessors on moving workpieces
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 165 |
Quality solder paste systems for use in microelectronic applications
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 166 |
Radiation annealing of epitaxial silver films
|
|
|
1984
|
24 |
4 |
p. 822-
1 p.
|
artikel
|
| 167 |
Rapid wafer heating: status 1983
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 168 |
Reactive ion beam etching of tantalum silicide for VLSI applications
|
|
|
1984
|
24 |
4 |
p. 822-
1 p.
|
artikel
|
| 169 |
Reactive-ion etching eases restrictions on materials and feature sizes
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 170 |
Reactive sputtering
|
|
|
1984
|
24 |
4 |
p. 820-
1 p.
|
artikel
|
| 171 |
Real time sputter deposition monitoring using glow discharge mass spectroscopy
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 172 |
Recent developments in the characterisation of semiconductors by transport measurements
|
|
|
1984
|
24 |
4 |
p. 817-
1 p.
|
artikel
|
| 173 |
Reinterpretation of the silicon-hydrogen stretch frequencies in amorphous silicon
|
|
|
1984
|
24 |
4 |
p. 818-
1 p.
|
artikel
|
| 174 |
Reliability analysis of an intermittently used system
|
|
|
1984
|
24 |
4 |
p. 809-
1 p.
|
artikel
|
| 175 |
Reliability analysis of optical fibre communication systems
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 176 |
Reliability and maintainability data for industrial plants
|
Reiche, H.
|
|
1984
|
24 |
4 |
p. 802-
1 p.
|
artikel
|
| 177 |
Reliability effects of fluorine contamination of aluminum bonding pads on semiconductor chips
|
|
|
1984
|
24 |
4 |
p. 805-806
2 p.
|
artikel
|
| 178 |
Reliability evaluation of systems with critical human error
|
Dhillon, Balbir S.
|
|
1984
|
24 |
4 |
p. 743-759
17 p.
|
artikel
|
| 179 |
Reliability prediction of microcircuits
|
|
|
1984
|
24 |
4 |
p. 809-
1 p.
|
artikel
|
| 180 |
Reliability study of a microwave Ga As field-effect transistor, by means of factorial analysis and automatic classification methods
|
|
|
1984
|
24 |
4 |
p. 805-
1 p.
|
artikel
|
| 181 |
Residual stress in thick films
|
|
|
1984
|
24 |
4 |
p. 820-821
2 p.
|
artikel
|
| 182 |
Scanning electron microscopes
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 183 |
Seeded bug volume for software validation
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 184 |
Semiconductor manufacturing in Central Europe
|
|
|
1984
|
24 |
4 |
p. 812-
1 p.
|
artikel
|
| 185 |
Semiconductor manufacturing in Thailand
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 186 |
Semiconductor materials and devices characterization by noise measurements
|
|
|
1984
|
24 |
4 |
p. 817-
1 p.
|
artikel
|
| 187 |
Semiconductor processing with excimer lasers
|
|
|
1984
|
24 |
4 |
p. 825-
1 p.
|
artikel
|
| 188 |
Semiconductor surface reconstruction
|
|
|
1984
|
24 |
4 |
p. 818-819
2 p.
|
artikel
|
| 189 |
Semiconductor surfaces and interfaces
|
|
|
1984
|
24 |
4 |
p. 819-
1 p.
|
artikel
|
| 190 |
s-expected number of inspections and repairs of a one-server two-unit system subject to arbitrary failure
|
Subramanyam Naidu, R.
|
|
1984
|
24 |
4 |
p. 647-649
3 p.
|
artikel
|
| 191 |
s-expected number of inspections and repairs of a single server n-unit system subject to arbitrary failure
|
Subramanyam Naidu, R.
|
|
1984
|
24 |
4 |
p. 651-658
8 p.
|
artikel
|
| 192 |
Shallow doping in silicon
|
|
|
1984
|
24 |
4 |
p. 819-
1 p.
|
artikel
|
| 193 |
Silicon epitaxy: a 1983 perspective
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 194 |
Silicon film recrystallization using e-beam line source
|
|
|
1984
|
24 |
4 |
p. 824-
1 p.
|
artikel
|
| 195 |
Silicon-on-insulator structures using high dose oxygen implantation to form buried oxide films
|
|
|
1984
|
24 |
4 |
p. 824-825
2 p.
|
artikel
|
| 196 |
Simplification of Boolean functions through petri nets
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 197 |
Size effect on different impurity levels in semiconductors
|
|
|
1984
|
24 |
4 |
p. 818-
1 p.
|
artikel
|
| 198 |
Software performance modelling and management
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 199 |
Soldering in electronics
|
G.W.A.D.,
|
|
1984
|
24 |
4 |
p. 802-803
2 p.
|
artikel
|
| 200 |
Some aspects of placement optimization of thermal significant components in thick film high-power hybrid integrated circuits
|
|
|
1984
|
24 |
4 |
p. 820-
1 p.
|
artikel
|
| 201 |
Some present and future applications of laser processing—an overview
|
|
|
1984
|
24 |
4 |
p. 823-
1 p.
|
artikel
|
| 202 |
Spatial yield analysis in integrated circuit manufacturing
|
|
|
1984
|
24 |
4 |
p. 807-
1 p.
|
artikel
|
| 203 |
Steady-state availability of k-out-of-n: G system with single repair
|
|
|
1984
|
24 |
4 |
p. 809-
1 p.
|
artikel
|
| 204 |
Step coverage by vapor deposited thin aluminum films
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 205 |
Stochastic analysis of outdoor power systems in fluctuating environment
|
|
|
1984
|
24 |
4 |
p. 808-
1 p.
|
artikel
|
| 206 |
Stochastic behaviour of a two-unit repairable system subject to two types of failure and inspection
|
|
|
1984
|
24 |
4 |
p. 809-
1 p.
|
artikel
|
| 207 |
Structural characterization of processed silicon wafers
|
|
|
1984
|
24 |
4 |
p. 813-
1 p.
|
artikel
|
| 208 |
Surface roughness and the thermopower of thin films
|
|
|
1984
|
24 |
4 |
p. 821-822
2 p.
|
artikel
|
| 209 |
Symbolic reliability analysis with the aid of variable-entered Karnaugh maps
|
|
|
1984
|
24 |
4 |
p. 810-
1 p.
|
artikel
|
| 210 |
Technical data package for procurement
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 211 |
Technique for measuring the moisture content of sealed IC packages
|
|
|
1984
|
24 |
4 |
p. 814-
1 p.
|
artikel
|
| 212 |
Test bar checks reliability of STL semicustom logic arrays
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 213 |
The case for CMOS
|
|
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1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 214 |
The design and performace of near micron SOS MOSFETs
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 215 |
The effect of high dissipation components on the solder joints of ceramic chip carriers attached to thick film alumina substrates
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 216 |
The effects of hydrogen ambients on electromigration kinetics in Al-2% Cu thin film conductors
|
|
|
1984
|
24 |
4 |
p. 821-
1 p.
|
artikel
|
| 217 |
The electrical properties of zinc implanted GaAs
|
|
|
1984
|
24 |
4 |
p. 825-
1 p.
|
artikel
|
| 218 |
The forces behind epitaxial-silicon trends
|
|
|
1984
|
24 |
4 |
p. 811-812
2 p.
|
artikel
|
| 219 |
The generic method of the multistate fault tree analysis
|
Huang, Xizhi
|
|
1984
|
24 |
4 |
p. 617-622
6 p.
|
artikel
|
| 220 |
Theory of the growth of SiO2 in an oxygen plasma
|
|
|
1984
|
24 |
4 |
p. 819-
1 p.
|
artikel
|
| 221 |
Thermal management of electronic packages
|
|
|
1984
|
24 |
4 |
p. 813-
1 p.
|
artikel
|
| 222 |
Thermal nitridation of silicon and silicon dioxide for thin gate insulators. Part II
|
|
|
1984
|
24 |
4 |
p. 818-
1 p.
|
artikel
|
| 223 |
Thermal studies on pin grid array packages for high density LSI and VLSI logic circuits
|
|
|
1984
|
24 |
4 |
p. 813-
1 p.
|
artikel
|
| 224 |
The role of surface treatment on the anodic oxidation of n-GaAs
|
Kochhar, Madhu
|
|
1984
|
24 |
4 |
p. 629-631
3 p.
|
artikel
|
| 225 |
The time resolved electron beam induced current method applied to P-N junctions
|
|
|
1984
|
24 |
4 |
p. 824-
1 p.
|
artikel
|
| 226 |
The top-event's failure frequency for non-coherent multi-state fault trees
|
Bossche, A.
|
|
1984
|
24 |
4 |
p. 707-715
9 p.
|
artikel
|
| 227 |
The width of the non-steady state transition region in deep level impurity measurements
|
|
|
1984
|
24 |
4 |
p. 817-818
2 p.
|
artikel
|
| 228 |
Thin film processing of hybrid ICs
|
|
|
1984
|
24 |
4 |
p. 820-
1 p.
|
artikel
|
| 229 |
Thin film studies of oxides by the organometallic-CVD technique
|
|
|
1984
|
24 |
4 |
p. 820-
1 p.
|
artikel
|
| 230 |
Three-chip set offers universal cost-effective SLIC
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 231 |
Top-edge imaging in E-beam lithography
|
|
|
1984
|
24 |
4 |
p. 822-
1 p.
|
artikel
|
| 232 |
Trends in medical electronics using surface mounted components and hybrids
|
|
|
1984
|
24 |
4 |
p. 821-
1 p.
|
artikel
|
| 233 |
Tunnelling of holes from acceptor levels in an applied field
|
|
|
1984
|
24 |
4 |
p. 819-820
2 p.
|
artikel
|
| 234 |
Updating of CMOS reliability
|
|
|
1984
|
24 |
4 |
p. 806-
1 p.
|
artikel
|
| 235 |
VLSI, computer designers swap ideas
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 236 |
VLSI: the challenge of one million transistors
|
|
|
1984
|
24 |
4 |
p. 811-
1 p.
|
artikel
|
| 237 |
Voltage—testing of thin-film capacitors
|
|
|
1984
|
24 |
4 |
p. 821-
1 p.
|
artikel
|
| 238 |
Wafer and mask imaging systems
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 239 |
Waveguides become integrated circuits in new space- and cost-saving method
|
|
|
1984
|
24 |
4 |
p. 816-
1 p.
|
artikel
|
| 240 |
X-ray lithography: optical's heir
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
|
| 241 |
X-ray source technology for microlithography
|
|
|
1984
|
24 |
4 |
p. 815-
1 p.
|
artikel
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