| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A boolean algebra method for reliability calculations
|
Gupta, P.P.
|
|
1983
|
23 |
5 |
p. 863-865
3 p.
|
artikel
|
| 2 |
A ceramic capacitor substrate for high speed switching VLSI chips
|
|
|
1983
|
23 |
5 |
p. 1003-
1 p.
|
artikel
|
| 3 |
A CMOS process for VLSI instrumentation
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 4 |
Acoustic-emission-monitored tests for TAB inner lead bond quality
|
|
|
1983
|
23 |
5 |
p. 992-
1 p.
|
artikel
|
| 5 |
A dynamic bias system for burn-in or thermal endurance treatments of 8085A microprocessors
|
|
|
1983
|
23 |
5 |
p. 993-
1 p.
|
artikel
|
| 6 |
A Heuristic approach to the generation of tests for faults on the intermediate lines
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 7 |
A Kolmogorov-Smirnov goodness-of-fit test for the two-parameter Weibull distribution when the parameters are estimated from the data
|
|
|
1983
|
23 |
5 |
p. 996-
1 p.
|
artikel
|
| 8 |
Alteration of diffusion profiles in semiconductors due to p-n junctions
|
|
|
1983
|
23 |
5 |
p. 1001-
1 p.
|
artikel
|
| 9 |
A multicomponent two-unit cold standby system with three modes
|
Goel, L.R.
|
|
1983
|
23 |
5 |
p. 799-803
5 p.
|
artikel
|
| 10 |
A multi-standby multi-failure mode system with repair and replacement policy
|
Goel, L.R.
|
|
1983
|
23 |
5 |
p. 809-812
4 p.
|
artikel
|
| 11 |
An alternate approach to syndrome algebra for diagnostics
|
|
|
1983
|
23 |
5 |
p. 996-
1 p.
|
artikel
|
| 12 |
Analysis of series deviance in a parallel state transition diagram and applications to fault tolerant computing
|
Lombardi, Fabrizio
|
|
1983
|
23 |
5 |
p. 963-980
18 p.
|
artikel
|
| 13 |
An entropy barrier against vacancy-interstitial recombination in silicon
|
|
|
1983
|
23 |
5 |
p. 1001-
1 p.
|
artikel
|
| 14 |
A notation for designing restoring logic circuitry in CMOS
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 15 |
A Petri net approach to enumerate all system success paths for reliability evaluation of a complex system
|
|
|
1983
|
23 |
5 |
p. 996-
1 p.
|
artikel
|
| 16 |
Application of molecular beam epitaxy to III–V microwave and high speed device fabrication
|
|
|
1983
|
23 |
5 |
p. 1004-
1 p.
|
artikel
|
| 17 |
A radiation hardened 256 × 4 bulk CMOS RAM
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 18 |
A re-extrapolation technique in Newton-Sor computer simulation of semiconductor devices
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 19 |
A repairable system with N failure modes and K standby units
|
|
|
1983
|
23 |
5 |
p. 994-
1 p.
|
artikel
|
| 20 |
A semi-regenerative process of two-unit warm standby system
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 21 |
A simple evaporation process for producing improved interlevel via resistance
|
|
|
1983
|
23 |
5 |
p. 998-
1 p.
|
artikel
|
| 22 |
A single unit multicomponent system subject to various types of failures
|
Goel, L.R.
|
|
1983
|
23 |
5 |
p. 813-816
4 p.
|
artikel
|
| 23 |
A unified switching theory with applications to VLSI design
|
|
|
1983
|
23 |
5 |
p. 998-999
2 p.
|
artikel
|
| 24 |
Availability measures for an intermittently used repairable system
|
Kapur, P.K.
|
|
1983
|
23 |
5 |
p. 841-844
4 p.
|
artikel
|
| 25 |
Bias humidity performance and failure mechanisms of nonhermetic aluminium SIC's in an environment contaminated with SO2
|
|
|
1983
|
23 |
5 |
p. 992-993
2 p.
|
artikel
|
| 26 |
Bounds of age replacement time
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 27 |
Burn-in board design, material and component selection
|
|
|
1983
|
23 |
5 |
p. 992-
1 p.
|
artikel
|
| 28 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1983
|
23 |
5 |
p. 767-771
5 p.
|
artikel
|
| 29 |
Can velocity overshoot or ballistic transport be efficient in submicron devices?
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 30 |
Characterisation of Se implanted layers for GaAs FETs
|
Singh, B.R.
|
|
1983
|
23 |
5 |
p. 857-861
5 p.
|
artikel
|
| 31 |
Chemically vapour-deposited borophosphosilicate glasses for silicon device applications
|
|
|
1983
|
23 |
5 |
p. 992-
1 p.
|
artikel
|
| 32 |
Chipstrate interconnection substrates for advanced electronic systems
|
|
|
1983
|
23 |
5 |
p. 1002-
1 p.
|
artikel
|
| 33 |
Controlling semiconductor processes
|
|
|
1983
|
23 |
5 |
p. 998-
1 p.
|
artikel
|
| 34 |
Copper impurity levels in silicon
|
|
|
1983
|
23 |
5 |
p. 1001-
1 p.
|
artikel
|
| 35 |
Cost based reliability growth apportionment
|
Govil, K.K.
|
|
1983
|
23 |
5 |
p. 789-792
4 p.
|
artikel
|
| 36 |
Creating the integrated engineering design office
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 37 |
CVD Tungsten interconnect and contact barrier technology for VLSI
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 38 |
DC leakage currents in trichloroethylene oxides
|
|
|
1983
|
23 |
5 |
p. 1001-
1 p.
|
artikel
|
| 39 |
Debunking the learning curve
|
|
|
1983
|
23 |
5 |
p. 991-
1 p.
|
artikel
|
| 40 |
Defect levels in chromium-doped silicon
|
|
|
1983
|
23 |
5 |
p. 1001-1002
2 p.
|
artikel
|
| 41 |
Delay times in fault tree analysis
|
|
|
1983
|
23 |
5 |
p. 994-
1 p.
|
artikel
|
| 42 |
Deposition and properties of RF reactively sputtered SiO2 layers
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 43 |
Designing reliable communication networks in a planned failure environment
|
|
|
1983
|
23 |
5 |
p. 997-
1 p.
|
artikel
|
| 44 |
Designing the CF-18 to be operationally ready
|
|
|
1983
|
23 |
5 |
p. 994-
1 p.
|
artikel
|
| 45 |
Design parameters of four-terminal distributed thin film integrated band-reject filter
|
Singh, H.R.
|
|
1983
|
23 |
5 |
p. 795-797
3 p.
|
artikel
|
| 46 |
Determination of the oxygen precipitate-free zone width in silicon wafers from surface photovoltage measurements
|
|
|
1983
|
23 |
5 |
p. 1001-
1 p.
|
artikel
|
| 47 |
Devices meeting probes the limits of semiconductors and circuitry
|
|
|
1983
|
23 |
5 |
p. 997-
1 p.
|
artikel
|
| 48 |
Diffusivity and growth rate of silicon in solid-phase epitaxy with an aluminium medium
|
|
|
1983
|
23 |
5 |
p. 1001-
1 p.
|
artikel
|
| 49 |
Digital systems with algorithm implementation
|
G.W.A.D.,
|
|
1983
|
23 |
5 |
p. 989-
1 p.
|
artikel
|
| 50 |
Effects of accelerated temperature testing on the low-frequency noise of planar NPN transistors
|
Stojadinović, N.D.
|
|
1983
|
23 |
5 |
p. 899-901
3 p.
|
artikel
|
| 51 |
Enumeration of all 2-trees in a graph through Petri nets
|
Hura, G.S.
|
|
1983
|
23 |
5 |
p. 851-853
3 p.
|
artikel
|
| 52 |
Erratum
|
|
|
1983
|
23 |
5 |
p. 1005-
1 p.
|
artikel
|
| 53 |
Etch delineation of defects in phosphosilicate glass layers
|
|
|
1983
|
23 |
5 |
p. 992-
1 p.
|
artikel
|
| 54 |
Evaluating the MIL-STD-883B alternate die visual screen for LSI
|
|
|
1983
|
23 |
5 |
p. 997-
1 p.
|
artikel
|
| 55 |
Expected repair cost under doubly stochastic damage processes
|
|
|
1983
|
23 |
5 |
p. 994-
1 p.
|
artikel
|
| 56 |
Fabrication of through-wafer via conductors in Si by laser photochemical processing
|
|
|
1983
|
23 |
5 |
p. 1004-
1 p.
|
artikel
|
| 57 |
Fault-cover investigations of fan-out reconvergent circuits using Boolean differences
|
|
|
1983
|
23 |
5 |
p. 993-
1 p.
|
artikel
|
| 58 |
Fault spectrums—comparative experiences
|
|
|
1983
|
23 |
5 |
p. 993-
1 p.
|
artikel
|
| 59 |
Geometric programming method for optimal reliability allocation for a series system subject to cost constraint
|
Govil, K.K.
|
|
1983
|
23 |
5 |
p. 783-784
2 p.
|
artikel
|
| 60 |
High reliability polymer thick film
|
|
|
1983
|
23 |
5 |
p. 1002-
1 p.
|
artikel
|
| 61 |
Implant gettering and ion beam detection of generation impurities in silicon
|
|
|
1983
|
23 |
5 |
p. 1004-
1 p.
|
artikel
|
| 62 |
Inspecting incoming components
|
|
|
1983
|
23 |
5 |
p. 992-
1 p.
|
artikel
|
| 63 |
Interconnection and circuit packaging for electromagnetic compatibility
|
|
|
1983
|
23 |
5 |
p. 997-998
2 p.
|
artikel
|
| 64 |
Ion-cleaning damage in (100) GaAs, and its effect on Schottky diodes
|
|
|
1983
|
23 |
5 |
p. 1004-
1 p.
|
artikel
|
| 65 |
Isolation techniques for very large scale integration
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 66 |
Laser and electron beam scanning of GaAs FETS
|
|
|
1983
|
23 |
5 |
p. 1003-
1 p.
|
artikel
|
| 67 |
Laser processing cuts wider swath
|
|
|
1983
|
23 |
5 |
p. 1003-
1 p.
|
artikel
|
| 68 |
Laser processing of semiconductor silicon. Part II
|
|
|
1983
|
23 |
5 |
p. 1003-
1 p.
|
artikel
|
| 69 |
Linewidth measurement on IC masks by diffraction from grating test patterns
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 70 |
Low temperature double-exposed polyimide/oxide dielectric for VLSI multilevel metal interconnection
|
|
|
1983
|
23 |
5 |
p. 998-
1 p.
|
artikel
|
| 71 |
LPCVD of aluminium and Al-Si alloys for semiconductor metallization
|
|
|
1983
|
23 |
5 |
p. 997-
1 p.
|
artikel
|
| 72 |
Magnetron sputtering systems
|
|
|
1983
|
23 |
5 |
p. 1002-
1 p.
|
artikel
|
| 73 |
Maintainability and availability calculations for series, parallel and r-out-of-n configurations
|
Govil, K.K.
|
|
1983
|
23 |
5 |
p. 785-787
3 p.
|
artikel
|
| 74 |
Maintenance of reliable real time systems: hardware versus software tradeoffs
|
|
|
1983
|
23 |
5 |
p. 997-
1 p.
|
artikel
|
| 75 |
Major circuit yield improvement: yours for the price of minor resistor redesign
|
|
|
1983
|
23 |
5 |
p. 1003-
1 p.
|
artikel
|
| 76 |
Metal migrations outside the package during accelerated life tests
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 77 |
Microcomputer real time software reliability and fault recovery
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 78 |
Mix-and-match of 10 : 1 wafer steppers with die-by-die alignment to 1 : 1 proximity and projection systems
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 79 |
Modelling systems with high early failure occurrence patterns
|
|
|
1983
|
23 |
5 |
p. 994-
1 p.
|
artikel
|
| 80 |
Moderate inversion in MOS devices
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 81 |
Modification of cutsets for reliability evaluation of communication systems
|
|
|
1983
|
23 |
5 |
p. 994-
1 p.
|
artikel
|
| 82 |
Modification to the reduction technique of Thomas Case for obtaining a simplified reliability expression
|
Govil, K.K.
|
|
1983
|
23 |
5 |
p. 793-
1 p.
|
artikel
|
| 83 |
Modified periodic preventive maintenance policies
|
Nakagawa, Toshio
|
|
1983
|
23 |
5 |
p. 945-951
7 p.
|
artikel
|
| 84 |
More reliable connections to condensation-soldered terminals
|
|
|
1983
|
23 |
5 |
p. 992-
1 p.
|
artikel
|
| 85 |
More than a decade of the non-saturating autoclave as a highly accelerated stress technique for evaluating the reliability of nonhermetic microelectronic components
|
Sinnadurai, N.
|
|
1983
|
23 |
5 |
p. 833-836
4 p.
|
artikel
|
| 86 |
Morphology of copper precipitates characterizing lattice imperfection in EFG ribbon silicon
|
|
|
1983
|
23 |
5 |
p. 1002-
1 p.
|
artikel
|
| 87 |
Multiprocessor architecture tunes in to transaction processing
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 88 |
Multi-standby system with repair and replacement policy
|
Goel, L.R.
|
|
1983
|
23 |
5 |
p. 805-808
4 p.
|
artikel
|
| 89 |
New thick film multilayer interconnection technology using a Nd- YAG laser
|
|
|
1983
|
23 |
5 |
p. 1003-
1 p.
|
artikel
|
| 90 |
Non-noble metal inks for thick film hybrid circuits
|
|
|
1983
|
23 |
5 |
p. 1002-
1 p.
|
artikel
|
| 91 |
Nonparametric tests for testing the homogenetty of k (> 2) exponential, gamma and weibull populations using censored data
|
Padmanabhan, A.R.
|
|
1983
|
23 |
5 |
p. 953-961
9 p.
|
artikel
|
| 92 |
On a model for software reliability performance
|
|
|
1983
|
23 |
5 |
p. 994-
1 p.
|
artikel
|
| 93 |
On creating a reliable programming environment
|
|
|
1983
|
23 |
5 |
p. 996-
1 p.
|
artikel
|
| 94 |
On early stage degradation in Zn diffused GaAs LED
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 95 |
On optimal maintenance of a series system
|
Kumar, Ashok
|
|
1983
|
23 |
5 |
p. 827-831
5 p.
|
artikel
|
| 96 |
On profit evaluation in a modular system with two types of failures
|
Gupta, M.C.
|
|
1983
|
23 |
5 |
p. 823-825
3 p.
|
artikel
|
| 97 |
On standby redundant system with repair, post repair and preventive maintenance
|
Mahmoud, M.I.
|
|
1983
|
23 |
5 |
p. 817-819
3 p.
|
artikel
|
| 98 |
On the analysis of diffusion length measurements by SEM
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 99 |
On the canonical representation of homogeneous Markov processes modelling failure-time distributions
|
|
|
1983
|
23 |
5 |
p. 994-
1 p.
|
artikel
|
| 100 |
Operational repairable equipments and the Duane model
|
|
|
1983
|
23 |
5 |
p. 996-
1 p.
|
artikel
|
| 101 |
Optical emission and pressure correlations during plasma etching
|
|
|
1983
|
23 |
5 |
p. 1003-1004
2 p.
|
artikel
|
| 102 |
Optimal structure of sensor systems composed of nonidentical sensors
|
|
|
1983
|
23 |
5 |
p. 996-
1 p.
|
artikel
|
| 103 |
Packaging reliability—how to define and measure it
|
|
|
1983
|
23 |
5 |
p. 997-
1 p.
|
artikel
|
| 104 |
Petri net approach to the analysis of a structured program
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 105 |
Petri net as a modelling tool
|
|
|
1983
|
23 |
5 |
p. 996-
1 p.
|
artikel
|
| 106 |
Plasma etching of aluminium: review of process and equipment technology
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 107 |
Positive resist material requirements for VLSI device fabrication. Part II
|
|
|
1983
|
23 |
5 |
p. 998-
1 p.
|
artikel
|
| 108 |
Prediction of component temperatures on circuit cards cooled by natural convection
|
|
|
1983
|
23 |
5 |
p. 998-
1 p.
|
artikel
|
| 109 |
Preventive maintenance of a 1-unit system with two types of repair
|
|
|
1983
|
23 |
5 |
p. 996-
1 p.
|
artikel
|
| 110 |
Principles of manufacturing data management
|
|
|
1983
|
23 |
5 |
p. 991-
1 p.
|
artikel
|
| 111 |
Publications, notices, calls for paper, etc.
|
|
|
1983
|
23 |
5 |
p. 773-782
10 p.
|
artikel
|
| 112 |
Punch-through gate protection of M.O.S. devices
|
|
|
1983
|
23 |
5 |
p. 993-
1 p.
|
artikel
|
| 113 |
Quality assurance in an electronics production
|
|
|
1983
|
23 |
5 |
p. 991-
1 p.
|
artikel
|
| 114 |
Quality assurance in an enterprise of the computer branch
|
|
|
1983
|
23 |
5 |
p. 993-
1 p.
|
artikel
|
| 115 |
Quality assurance with soft soldering in electronics
|
|
|
1983
|
23 |
5 |
p. 991-
1 p.
|
artikel
|
| 116 |
Quality improvement program addressed to M.O.S. microprocessors
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 117 |
Reliability analysis of time-dependent cascade system with deterministic cycle times
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 118 |
Reliability analysis: optimal inspection and maintenance schedules of failing systems
|
|
|
1983
|
23 |
5 |
p. 993-
1 p.
|
artikel
|
| 119 |
Reliability and availability analysis of systems operating in multiple environments
|
Dhillon, B.S.
|
|
1983
|
23 |
5 |
p. 883-898
16 p.
|
artikel
|
| 120 |
Reliability theory for multistate systems with multistate components
|
|
|
1983
|
23 |
5 |
p. 993-994
2 p.
|
artikel
|
| 121 |
Replacing destructive by non-destructive testing
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 122 |
Review of reliability improvements of GaAlAs laser diodes
|
|
|
1983
|
23 |
5 |
p. 992-
1 p.
|
artikel
|
| 123 |
Review paper. Approximations for Fermi-Dirac integrals, especially the function J 1 2 (η) used to describe electron density in a semiconductor
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 124 |
Sawing systems update
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 125 |
Seeded bug volume for software validation
|
Ramzan, Mohammed Tahir
|
|
1983
|
23 |
5 |
p. 981-988
8 p.
|
artikel
|
| 126 |
Sequential evaluation of terminal pair reliability in a reliability network
|
|
|
1983
|
23 |
5 |
p. 993-
1 p.
|
artikel
|
| 127 |
Services for monitoring hazardous conditions
|
|
|
1983
|
23 |
5 |
p. 997-
1 p.
|
artikel
|
| 128 |
Significant features of solder connections to gold-plated thin films
|
|
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1983
|
23 |
5 |
p. 1003-
1 p.
|
artikel
|
| 129 |
Software implemented fault tolerance: a methodology
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 130 |
Software reliability models: A review
|
Shanthikumar, J.G.
|
|
1983
|
23 |
5 |
p. 903-943
41 p.
|
artikel
|
| 131 |
Solid-state power relays enter the IC era
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 132 |
Some stress—strength reliability models
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 133 |
Specific contact resistance and noise in contacts on thin layers
|
|
|
1983
|
23 |
5 |
p. 1003-
1 p.
|
artikel
|
| 134 |
Steiner trees in probabilistic networks
|
Wald, Joseph A.
|
|
1983
|
23 |
5 |
p. 837-840
4 p.
|
artikel
|
| 135 |
Stochastic analysis of outdoor power systems in fluctuating environment
|
Dhillon, B.S.
|
|
1983
|
23 |
5 |
p. 867-881
15 p.
|
artikel
|
| 136 |
Stochastic behavior of a 1-server n-unit system subject to arbitrary failure, exponential inspection and repair
|
Subramanyam Naidu, R.
|
|
1983
|
23 |
5 |
p. 845-849
5 p.
|
artikel
|
| 137 |
Stochastic models for predicting human reliability
|
|
|
1983
|
23 |
5 |
p. 991-
1 p.
|
artikel
|
| 138 |
Study of electron traps in the thin interfacial oxide layer of Al-, Au- and Sn-n GaAs Schottky barriers by detrapping experiments
|
|
|
1983
|
23 |
5 |
p. 1002-
1 p.
|
artikel
|
| 139 |
Success with handling hazardous gases
|
|
|
1983
|
23 |
5 |
p. 997-
1 p.
|
artikel
|
| 140 |
Systems safety: a survey
|
|
|
1983
|
23 |
5 |
p. 994-
1 p.
|
artikel
|
| 141 |
Test device structures for integrated circuit design, process technology development and evaluation
|
|
|
1983
|
23 |
5 |
p. 996-
1 p.
|
artikel
|
| 142 |
The application of marginal voltage measurements to detect and locate defects in digital microcircuits
|
|
|
1983
|
23 |
5 |
p. 993-
1 p.
|
artikel
|
| 143 |
The art of package sealing
|
|
|
1983
|
23 |
5 |
p. 998-
1 p.
|
artikel
|
| 144 |
The chemistry and stability of ruthenium-based resistors
|
|
|
1983
|
23 |
5 |
p. 1002-
1 p.
|
artikel
|
| 145 |
The common thread for operational reliability and failure physics
|
|
|
1983
|
23 |
5 |
p. 991-
1 p.
|
artikel
|
| 146 |
The effect of preventive maintenance on a system with imperfect switchover
|
Mahmoud, M.I.
|
|
1983
|
23 |
5 |
p. 821-822
2 p.
|
artikel
|
| 147 |
The measurement and sources of substrate heat flux encountered with magnetron sputtering
|
|
|
1983
|
23 |
5 |
p. 1002-
1 p.
|
artikel
|
| 148 |
The present situation on hybrid techniques in Hungary especially in high frequency applications
|
|
|
1983
|
23 |
5 |
p. 1002-
1 p.
|
artikel
|
| 149 |
Thermal emission rates and capture cross-section of majority carriers at titanium levels in silicon
|
|
|
1983
|
23 |
5 |
p. 1001-
1 p.
|
artikel
|
| 150 |
Thermosonic gold wire bonding to copper conductors
|
|
|
1983
|
23 |
5 |
p. 998-
1 p.
|
artikel
|
| 151 |
The role of CAD in semicustom IC design
|
|
|
1983
|
23 |
5 |
p. 998-
1 p.
|
artikel
|
| 152 |
The role of germanium in evaporated Au-Ge OHMIC contacts to GaAs
|
|
|
1983
|
23 |
5 |
p. 1000-
1 p.
|
artikel
|
| 153 |
Thick film materials and reliability
|
|
|
1983
|
23 |
5 |
p. 1002-
1 p.
|
artikel
|
| 154 |
Threshold shift of p-channel transistors by boron implantation and the C-V characteristics of the corresponding MOS structures
|
|
|
1983
|
23 |
5 |
p. 1004-
1 p.
|
artikel
|
| 155 |
Tin and tin-alloy plating
|
G.W.A.D.,
|
|
1983
|
23 |
5 |
p. 989-990
2 p.
|
artikel
|
| 156 |
Transient transport and transferred electron behaviour in gallium arsenide under the condition of high-energy electron injection
|
|
|
1983
|
23 |
5 |
p. 1001-
1 p.
|
artikel
|
| 157 |
Trends in metallization materials
|
|
|
1983
|
23 |
5 |
p. 999-
1 p.
|
artikel
|
| 158 |
Une modelisation Bayesienne du taux de defaillance en fiabilite
|
|
|
1983
|
23 |
5 |
p. 996-997
2 p.
|
artikel
|
| 159 |
VLSI thermal management in cost driven systems
|
|
|
1983
|
23 |
5 |
p. 998-
1 p.
|
artikel
|
| 160 |
Wafer marking and reading
|
|
|
1983
|
23 |
5 |
p. 998-
1 p.
|
artikel
|
| 161 |
Water defect detection systems
|
|
|
1983
|
23 |
5 |
p. 992-
1 p.
|
artikel
|
| 162 |
Weapons systems analysis, part II: simulation techniques and models
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 163 |
Weapons systems analysis, part I: system effectiveness
|
|
|
1983
|
23 |
5 |
p. 995-
1 p.
|
artikel
|
| 164 |
Wirebonding reliability techniques and analysis
|
|
|
1983
|
23 |
5 |
p. 991-992
2 p.
|
artikel
|
| 165 |
Worst case reliability bounds
|
Govindachar, Suresh
|
|
1983
|
23 |
5 |
p. 855-856
2 p.
|
artikel
|
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