| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A bibliography on silicon nitride films
|
Morosanu, C.-E.
|
|
1980
|
20 |
3 |
p. 357-370
14 p.
|
artikel
|
| 2 |
Accelerated reliability evaluation of trimetal integrated circuit chips in plastic packages
|
|
|
1980
|
20 |
3 |
p. 375-
1 p.
|
artikel
|
| 3 |
Active device prescreening for hybrids
|
|
|
1980
|
20 |
3 |
p. 388-
1 p.
|
artikel
|
| 4 |
Advances in testing LSI populated boards
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 5 |
Aging of solder connection to Ti-Pd-Au films
|
|
|
1980
|
20 |
3 |
p. 377-
1 p.
|
artikel
|
| 6 |
A high-stability RC circuit using high nitrogen doped tantalum
|
|
|
1980
|
20 |
3 |
p. 388-
1 p.
|
artikel
|
| 7 |
Air film system for handling semiconductor wafers
|
|
|
1980
|
20 |
3 |
p. 382-
1 p.
|
artikel
|
| 8 |
A low-cost thin-film microcircuit process
|
|
|
1980
|
20 |
3 |
p. 388-389
2 p.
|
artikel
|
| 9 |
American Society for Quality Control 33rd Annual Technical Conference Transactions
|
G.W.A.D.,
|
|
1980
|
20 |
3 |
p. 185-187
3 p.
|
artikel
|
| 10 |
A method of symbolic steady-state availability evaluation of k∣ out-of-n:G system
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 11 |
Analysis of microprocessors test generation—its meaning and use
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 12 |
Analysis of the effects of mechanical stress on the properties of p-channel MOS structures. Part I. Choice of the theoretical model. The effect of stress on the valence band structure in silicon
|
|
|
1980
|
20 |
3 |
p. 377-
1 p.
|
artikel
|
| 13 |
An analysis of LPCVD system parameters for polysilicon, silicon nitride and silicon dioxide deposition
|
|
|
1980
|
20 |
3 |
p. 385-
1 p.
|
artikel
|
| 14 |
An availability evaluation for computer communication networks
|
Corsi, F.
|
|
1980
|
20 |
3 |
p. 309-313
5 p.
|
artikel
|
| 15 |
A new resistor system for high reliability applications
|
|
|
1980
|
20 |
3 |
p. 389-
1 p.
|
artikel
|
| 16 |
Annealing of ion implanted layers by laser beam
|
|
|
1980
|
20 |
3 |
p. 391-
1 p.
|
artikel
|
| 17 |
An overview of E-beam mask-making
|
|
|
1980
|
20 |
3 |
p. 390-391
2 p.
|
artikel
|
| 18 |
Application of the ZBA-10 electron-beam exposure system in the production of precision photomasks with pattern element dimensions in the submicron range
|
|
|
1980
|
20 |
3 |
p. 391-
1 p.
|
artikel
|
| 19 |
Approaches to comparing cut-set enumeration algorithms
|
|
|
1980
|
20 |
3 |
p. 379-
1 p.
|
artikel
|
| 20 |
Approximation of distribution density functions
|
|
|
1980
|
20 |
3 |
p. 379-
1 p.
|
artikel
|
| 21 |
Approximations to moments of parallel-system lifetime based on sampling from a finite population
|
|
|
1980
|
20 |
3 |
p. 378-
1 p.
|
artikel
|
| 22 |
A production-compatible microelectronic test pattern for evaluating photomask misalignment
|
|
|
1980
|
20 |
3 |
p. 187-
1 p.
|
artikel
|
| 23 |
A reparable multistate device
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 24 |
Ar-ion implant damage gettering of generation impurities in silicon employing voltage ramping and nitrogen back-scattering
|
|
|
1980
|
20 |
3 |
p. 391-
1 p.
|
artikel
|
| 25 |
A simplified method for evaluating time dependent fault-trees, using Weibull distribution
|
Dubuisson, B.
|
|
1980
|
20 |
3 |
p. 347-350
4 p.
|
artikel
|
| 26 |
A thick film capacitive temperature sensor using barium strontium titanate glass formulations
|
|
|
1980
|
20 |
3 |
p. 389-
1 p.
|
artikel
|
| 27 |
A two-dimensional placement algorithm for the layout of electronic circuits
|
Gupta, Hariom
|
|
1980
|
20 |
3 |
p. 323-328
6 p.
|
artikel
|
| 28 |
A user's performance profile of a thick-film resistor system
|
|
|
1980
|
20 |
3 |
p. 387-
1 p.
|
artikel
|
| 29 |
Automatic in-circuit inspection of printed circuit board assemblies
|
|
|
1980
|
20 |
3 |
p. 376-
1 p.
|
artikel
|
| 30 |
Basis sets for the study of point defects in solids using Green's-function methods
|
|
|
1980
|
20 |
3 |
p. 386-
1 p.
|
artikel
|
| 31 |
Behaviour of a two-unit standby redundant system with imperfect switching and delayed repair
|
Kumar, Ashok
|
|
1980
|
20 |
3 |
p. 315-321
7 p.
|
artikel
|
| 32 |
Calculating the time-specific frequency of system failure
|
|
|
1980
|
20 |
3 |
p. 379-
1 p.
|
artikel
|
| 33 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1980
|
20 |
3 |
p. 173-175
3 p.
|
artikel
|
| 34 |
Characteristics of three-terminal metal-tunnel Oxide-n/p+ devices
|
|
|
1980
|
20 |
3 |
p. 385-
1 p.
|
artikel
|
| 35 |
Chip corrosion in plastic packages
|
Berg, Howard M.
|
|
1980
|
20 |
3 |
p. 247-263
17 p.
|
artikel
|
| 36 |
Chip makers ride CRT controller wave
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 37 |
C-MOS LSI: comparing second-generation approaches
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 38 |
Coding and decoding of Wafers
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 39 |
Computer aids for reliability prediction and spares provisioning
|
|
|
1980
|
20 |
3 |
p. 379-
1 p.
|
artikel
|
| 40 |
Computer controlled optical microprojection system for one micron structures
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 41 |
Confidence bounds on reliability for the inverse Gaussian model
|
|
|
1980
|
20 |
3 |
p. 379-
1 p.
|
artikel
|
| 42 |
Contact and relaxation behaviour of aluminium conductor materials in the solderless wire-wrap technique, Part 1
|
|
|
1980
|
20 |
3 |
p. 376-
1 p.
|
artikel
|
| 43 |
Correlating tropical exposure of plastic encapsulated devices with laboratory tests
|
|
|
1980
|
20 |
3 |
p. 376-
1 p.
|
artikel
|
| 44 |
Cost optimization of some stochastic maintenance policies
|
|
|
1980
|
20 |
3 |
p. 378-
1 p.
|
artikel
|
| 45 |
Deposition and characterization of magnetron sputtered aluminum and aluminum alloy films
|
|
|
1980
|
20 |
3 |
p. 388-
1 p.
|
artikel
|
| 46 |
Design considerations for molecular beam epitaxy systems
|
|
|
1980
|
20 |
3 |
p. 390-
1 p.
|
artikel
|
| 47 |
Detection and identification of potential impurities activated by neutron irradiation of Czochralski silicon
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 48 |
Diamond-tipped and other new thermodes for device bonding
|
|
|
1980
|
20 |
3 |
p. 376-
1 p.
|
artikel
|
| 49 |
Digital phase-locked loop finds clock signal in bit stream
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 50 |
Direct wafer exposure
|
|
|
1980
|
20 |
3 |
p. 382-383
2 p.
|
artikel
|
| 51 |
Double epitaxy method for the simultaneous manufacture of I2L-arrangements and insulated transistors
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 52 |
Echo-canceling chip opens way to increased use of satellite channels
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 53 |
ECL accelerates to new system speeds with high-density byte-slice parts
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 54 |
Editorial
|
G.W.A.D.,
|
|
1980
|
20 |
3 |
p. 169-172
4 p.
|
artikel
|
| 55 |
Effect of structural defects on degradation of diffused GaAs LED's
|
|
|
1980
|
20 |
3 |
p. 384-385
2 p.
|
artikel
|
| 56 |
Electron-beam-induced-current investigations on MOS and MNOS devices
|
|
|
1980
|
20 |
3 |
p. 390-
1 p.
|
artikel
|
| 57 |
Electron-exciton inelastic collision cross sections for different semiconductors
|
|
|
1980
|
20 |
3 |
p. 385-
1 p.
|
artikel
|
| 58 |
Electronic dielectric constant of III–V semiconductors
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 59 |
Electronics reliability: A state-of-the-art survey
|
Blanks, Henry S.
|
|
1980
|
20 |
3 |
p. 219-245
27 p.
|
artikel
|
| 60 |
Electron trapping in neutron-irradiated very thin films of Al2O3
|
|
|
1980
|
20 |
3 |
p. 388-
1 p.
|
artikel
|
| 61 |
Energy levels and degeneracy ratios for magnesium in n-type silicon
|
|
|
1980
|
20 |
3 |
p. 386-
1 p.
|
artikel
|
| 62 |
Enumeration of all minimal cut-sets for a node pair in a graph
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 63 |
E-PROM doubles bit density without adding a pin
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 64 |
Estimation in a Pareto distribution: theory and computation
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 65 |
Estimation of the reliability of computer components from field renewal data
|
Trindade, David C.
|
|
1980
|
20 |
3 |
p. 205-218
14 p.
|
artikel
|
| 66 |
Evaluation delay cut by low-cost microprocessor development
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 67 |
Evaluation of equipment reliability
|
|
|
1980
|
20 |
3 |
p. 377-
1 p.
|
artikel
|
| 68 |
Experience gathered with the application of the special-type ZRM-12 scanning electron microscope in the semiconductor industry
|
|
|
1980
|
20 |
3 |
p. 382-
1 p.
|
artikel
|
| 69 |
Experimental verification of the model of silicon epitaxy
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 70 |
Failure analysis of r.f. power transistors
|
|
|
1980
|
20 |
3 |
p. 376-
1 p.
|
artikel
|
| 71 |
Generalized transport equations for semiconductors
|
|
|
1980
|
20 |
3 |
p. 385-
1 p.
|
artikel
|
| 72 |
Hazard reduction in process plant by instrumentation philosophy
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 73 |
Hermetic packages for hybrid circuits
|
|
|
1980
|
20 |
3 |
p. 387-
1 p.
|
artikel
|
| 74 |
HMOS II static RAMs overtake bipolar competition
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 75 |
How to measure software reliability and how not to
|
|
|
1980
|
20 |
3 |
p. 378-
1 p.
|
artikel
|
| 76 |
Hybrid IC structures using solder reflow technology
|
|
|
1980
|
20 |
3 |
p. 388-
1 p.
|
artikel
|
| 77 |
Improvement of supervision schedules for protective systems
|
|
|
1980
|
20 |
3 |
p. 377-
1 p.
|
artikel
|
| 78 |
In-circuit and functional board tests
|
|
|
1980
|
20 |
3 |
p. 375-
1 p.
|
artikel
|
| 79 |
Inspection intervals for condition-maintained items which fail in an obvious manner
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 80 |
International quality control—cooperation in an overview
|
|
|
1980
|
20 |
3 |
p. 375-
1 p.
|
artikel
|
| 81 |
Investigations of gold surface-state energy levels in gold-doped MOS transistors
|
|
|
1980
|
20 |
3 |
p. 377-
1 p.
|
artikel
|
| 82 |
Learning processes and growth curves in the field of integrated circuits
|
Hilberg, W.
|
|
1980
|
20 |
3 |
p. 337-341
5 p.
|
artikel
|
| 83 |
Low expansivity organic substrate for flip-chip bonding
|
|
|
1980
|
20 |
3 |
p. 382-
1 p.
|
artikel
|
| 84 |
LSI reliability prediction based on time
|
Jääskeläinen, Pentti
|
|
1980
|
20 |
3 |
p. 351-356
6 p.
|
artikel
|
| 85 |
Maximum reliability route subject to M improvements in a nondirected network
|
|
|
1980
|
20 |
3 |
p. 379-
1 p.
|
artikel
|
| 86 |
Memory testing: characterisation, timing and patterns
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 87 |
Microfiltration of high purity deionised water
|
|
|
1980
|
20 |
3 |
p. 382-
1 p.
|
artikel
|
| 88 |
Microline-etching technique
|
Singh, A.
|
|
1980
|
20 |
3 |
p. 293-294
2 p.
|
artikel
|
| 89 |
Micromechanical membrane switches on silicon
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 90 |
Microprocessors — Principles and applications
|
G.W.A.D.,
|
|
1980
|
20 |
3 |
p. 185-
1 p.
|
artikel
|
| 91 |
MNOS technology—will it survive?
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 92 |
Model for describing emission characteristics of electron- beam evaporation sources
|
|
|
1980
|
20 |
3 |
p. 390-
1 p.
|
artikel
|
| 93 |
Model of 1 f noise in ion-implanted resistors as a function of the resistance, determined by a reverse bias voltage
|
|
|
1980
|
20 |
3 |
p. 390-
1 p.
|
artikel
|
| 94 |
Modified method-of-moments in empirical Bayes estimation
|
|
|
1980
|
20 |
3 |
p. 379-
1 p.
|
artikel
|
| 95 |
Modular IC tester is easily optimized
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 96 |
Monemolecular resists: a new class of high resolution resists for electron beam microlithography
|
|
|
1980
|
20 |
3 |
p. 391-
1 p.
|
artikel
|
| 97 |
Monolithic MICs gain momentum as gallium arsenide MSI nears
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 98 |
Multiprocessors architectures
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 99 |
Negative Hall effect of hot holes in silicon
|
|
|
1980
|
20 |
3 |
p. 386-
1 p.
|
artikel
|
| 100 |
New generation of electronic components and how they influence printed circuit boards
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 101 |
Nonequilibrium response of m.o.s. devices to a linear voltage ramp in the presence of illumination
|
|
|
1980
|
20 |
3 |
p. 387-
1 p.
|
artikel
|
| 102 |
Now for the math-processing chips
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 103 |
Observation of a donor exciton band in silicon
|
|
|
1980
|
20 |
3 |
p. 386-
1 p.
|
artikel
|
| 104 |
Older processes revamped as new arrivals extend performance limits
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 105 |
One-chip data-encryption unit accesses memory directly
|
|
|
1980
|
20 |
3 |
p. 383-384
2 p.
|
artikel
|
| 106 |
One micron range photoresist imaging: a practical approach
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 107 |
On human reliability—Bibliography
|
Dhillon, Balbir S.
|
|
1980
|
20 |
3 |
p. 371-373
3 p.
|
artikel
|
| 108 |
On reliable software development for microprocessors
|
Soi, Inder M.
|
|
1980
|
20 |
3 |
p. 273-279
7 p.
|
artikel
|
| 109 |
On some minimal repair model
|
Adachi, Kouichi
|
|
1980
|
20 |
3 |
p. 265-271
7 p.
|
artikel
|
| 110 |
On the splitting of the exciton ground state in silicon
|
|
|
1980
|
20 |
3 |
p. 387-
1 p.
|
artikel
|
| 111 |
Optical switching in metal tunnel-insulator n−p+ silicon devices
|
|
|
1980
|
20 |
3 |
p. 385-
1 p.
|
artikel
|
| 112 |
Optimal number of minimal repairs before replacement
|
|
|
1980
|
20 |
3 |
p. 377-
1 p.
|
artikel
|
| 113 |
Optimum redundancy allocation in non series-parallel systems by using Boolean differences
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 114 |
Parameter estimation with noncontinuous inspection
|
|
|
1980
|
20 |
3 |
p. 377-
1 p.
|
artikel
|
| 115 |
Peculiarities in optimal redundancy for a bridge network
|
|
|
1980
|
20 |
3 |
p. 379-380
2 p.
|
artikel
|
| 116 |
Peripheral chips shift microprocessor systems into high gear
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 117 |
Personal liability and your future role
|
|
|
1980
|
20 |
3 |
p. 375-
1 p.
|
artikel
|
| 118 |
Plasma etching
|
|
|
1980
|
20 |
3 |
p. 382-
1 p.
|
artikel
|
| 119 |
Plastic encapsulated semiconductor devices—Bibliogrpahy IV
|
Taylor, C.H.
|
|
1980
|
20 |
3 |
p. 287-291
5 p.
|
artikel
|
| 120 |
Plastics in microcircuit fabrication — Bibliography II
|
Taylor, C.H.
|
|
1980
|
20 |
3 |
p. 281-285
5 p.
|
artikel
|
| 121 |
pn Junction applications and transport properties in polysilicon rods
|
|
|
1980
|
20 |
3 |
p. 386-387
2 p.
|
artikel
|
| 122 |
Polysilicon production: cost analysis of conventional process
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 123 |
Pooling procedure for life-test data
|
|
|
1980
|
20 |
3 |
p. 378-
1 p.
|
artikel
|
| 124 |
Predicting from early failures the last failure time of a (log) normal sample
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 125 |
Pressure oxidation of silicon: an emerging technology
|
|
|
1980
|
20 |
3 |
p. 386-
1 p.
|
artikel
|
| 126 |
Processing considerations to achieve optimum performance from low TCR resistor systems
|
|
|
1980
|
20 |
3 |
p. 388-
1 p.
|
artikel
|
| 127 |
Publications, notices, calls for papers, etc.
|
|
|
1980
|
20 |
3 |
p. 177-184
8 p.
|
artikel
|
| 128 |
Radiation hardened MOS technology
|
|
|
1980
|
20 |
3 |
p. 386-
1 p.
|
artikel
|
| 129 |
Redistribution of dopant impurities in oxidizing ambients
|
|
|
1980
|
20 |
3 |
p. 386-
1 p.
|
artikel
|
| 130 |
Reliability and maintainability contribution to Hornet mission success
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 131 |
Reliability design of a standby system by a large-scale multiobjective optimization method
|
Sakawa, M.
|
|
1980
|
20 |
3 |
p. 191-204
14 p.
|
artikel
|
| 132 |
Reliability estimates for the truncated 2-parameter exponential distribution
|
|
|
1980
|
20 |
3 |
p. 378-
1 p.
|
artikel
|
| 133 |
Reliability indices for a power network considering static, transient, and dynamic performance
|
|
|
1980
|
20 |
3 |
p. 378-
1 p.
|
artikel
|
| 134 |
Reliability investigations of advanced semiconductor devices
|
|
|
1980
|
20 |
3 |
p. 376-
1 p.
|
artikel
|
| 135 |
Reliability of a repairable system with redundant units and preventive maintenance
|
|
|
1980
|
20 |
3 |
p. 378-
1 p.
|
artikel
|
| 136 |
Reliability proven: BDW55/56 gold-gold medium-power transistors
|
|
|
1980
|
20 |
3 |
p. 375-
1 p.
|
artikel
|
| 137 |
Response of diazoquinone resists to optical and electron-beam exposure
|
|
|
1980
|
20 |
3 |
p. 391-
1 p.
|
artikel
|
| 138 |
Responsibilities for materials reliability and safety
|
|
|
1980
|
20 |
3 |
p. 375-
1 p.
|
artikel
|
| 139 |
Role of chlorine in silicon oxidation (Part 1)
|
|
|
1980
|
20 |
3 |
p. 386-
1 p.
|
artikel
|
| 140 |
Role of chlorine in silicon oxidation—Part II
|
|
|
1980
|
20 |
3 |
p. 387-
1 p.
|
artikel
|
| 141 |
S.A.W. technique of testing piezo-electric semiconductors
|
Singh, Awater
|
|
1980
|
20 |
3 |
p. 295-296
2 p.
|
artikel
|
| 142 |
Scaled process adds new life to bipolar RAMs
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 143 |
Semiconductor superlattices by MBE and their characterization
|
|
|
1980
|
20 |
3 |
p. 390-
1 p.
|
artikel
|
| 144 |
Semiconductor surface and crystal physics studies by MBE
|
|
|
1980
|
20 |
3 |
p. 390-
1 p.
|
artikel
|
| 145 |
Semicustom analog chip sports two metalization layers
|
|
|
1980
|
20 |
3 |
p. 382-
1 p.
|
artikel
|
| 146 |
Silicon epitaxial films of submicrometer thickness
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 147 |
Silicon epitaxy
|
|
|
1980
|
20 |
3 |
p. 386-
1 p.
|
artikel
|
| 148 |
Silver migration and the reliability of Pd/Ag conductors in thick-film dielectric crossover structures
|
|
|
1980
|
20 |
3 |
p. 389-
1 p.
|
artikel
|
| 149 |
Simplified relations for determining flat-band capacitance and impurity concentration in MOS structures
|
|
|
1980
|
20 |
3 |
p. 384-
1 p.
|
artikel
|
| 150 |
Solar-grade silicon by directional solidification in carbon crucibles
|
|
|
1980
|
20 |
3 |
p. 385-
1 p.
|
artikel
|
| 151 |
Some annealing properties of low-energy-antimony-implanted silicon resistors
|
|
|
1980
|
20 |
3 |
p. 391-
1 p.
|
artikel
|
| 152 |
Standardisation
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 153 |
Starting and limiting values for reliability growth
|
|
|
1980
|
20 |
3 |
p. 379-
1 p.
|
artikel
|
| 154 |
Stochastic analysis of 2-unit system subject to two types of failure
|
Dharmadhikari, A.D.
|
|
1980
|
20 |
3 |
p. 343-345
3 p.
|
artikel
|
| 155 |
Store coupling of unequal microprocessors
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 156 |
Study of the surface properties of thermally oxidized silicon using surface acoustic wave attentuation
|
|
|
1980
|
20 |
3 |
p. 385-
1 p.
|
artikel
|
| 157 |
Surface-acoustic-wave filters prove versatile in vhf applications
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 158 |
Surface Contamination Genesis, Detection, and Control
|
G.W.A.D.,
|
|
1980
|
20 |
3 |
p. 189-
1 p.
|
artikel
|
| 159 |
Surface state study of ion implanted GaAs (Se) from photoreflectance
|
|
|
1980
|
20 |
3 |
p. 390-
1 p.
|
artikel
|
| 160 |
Switching system maintenance—and more
|
|
|
1980
|
20 |
3 |
p. 379-
1 p.
|
artikel
|
| 161 |
System reliability as a function of hardware flexibility
|
|
|
1980
|
20 |
3 |
p. 378-
1 p.
|
artikel
|
| 162 |
Temperature acceleration of CMOS IC operating life
|
Isagawa, Masaaki
|
|
1980
|
20 |
3 |
p. 329-335
7 p.
|
artikel
|
| 163 |
Temperature aging of external connections condensation soldered to Ti-Pol-Au thin films
|
|
|
1980
|
20 |
3 |
p. 389-
1 p.
|
artikel
|
| 164 |
Temperature dependence of the Hall coefficient of thin films
|
|
|
1980
|
20 |
3 |
p. 388-
1 p.
|
artikel
|
| 165 |
Temperature-dependent instabilities of the electrical properties of transistors and quartz crystal oscillators in tinplated packages
|
|
|
1980
|
20 |
3 |
p. 376-377
2 p.
|
artikel
|
| 166 |
Testing bare PC boards
|
|
|
1980
|
20 |
3 |
p. 375-376
2 p.
|
artikel
|
| 167 |
The adherence of chromium and titanium films deposited on alumina, quartz, and glass—testing and improvement of electron-beam-deposition techniques
|
|
|
1980
|
20 |
3 |
p. 391-
1 p.
|
artikel
|
| 168 |
The cell method, a new approach to multiple stuck-at-fault test generation
|
|
|
1980
|
20 |
3 |
p. 380-
1 p.
|
artikel
|
| 169 |
The determination of interfacial and bulk properties of gold in m.o.s. structures using quasiequilibrium and non-steady-state linear voltage-ramp techniques
|
|
|
1980
|
20 |
3 |
p. 387-
1 p.
|
artikel
|
| 170 |
The economics of standard electronic packaging
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 171 |
The effect of RF annealing upon electron-beam irradiated MIS structures
|
|
|
1980
|
20 |
3 |
p. 390-
1 p.
|
artikel
|
| 172 |
The electron beam: a better way to make semiconductor masks
|
|
|
1980
|
20 |
3 |
p. 390-
1 p.
|
artikel
|
| 173 |
The engineering of microprocessor systems
|
G.W.A.D.,
|
|
1980
|
20 |
3 |
p. 188-
1 p.
|
artikel
|
| 174 |
The interpretation of failure data using Weibull plots
|
|
|
1980
|
20 |
3 |
p. 377-
1 p.
|
artikel
|
| 175 |
The limitations of reactively-bonded thick film gold conductors
|
|
|
1980
|
20 |
3 |
p. 389-
1 p.
|
artikel
|
| 176 |
The MPUR mask projection and alignment repeater of VEB Carl Zeiss JENA
|
|
|
1980
|
20 |
3 |
p. 382-
1 p.
|
artikel
|
| 177 |
Theoretical estimates of the sheet resistance of Gaussian n-type ion-implanted layers in semiconductors: phosphorus in silicon
|
|
|
1980
|
20 |
3 |
p. 390-
1 p.
|
artikel
|
| 178 |
Theoretical study of the raman cross section and its pressure dependence in silicon
|
|
|
1980
|
20 |
3 |
p. 385-
1 p.
|
artikel
|
| 179 |
The resistance of space-quality solder joints to thermal fatigue—Part 1
|
|
|
1980
|
20 |
3 |
p. 376-
1 p.
|
artikel
|
| 180 |
The temperature dependence of component failure rate
|
Blanks, H.S.
|
|
1980
|
20 |
3 |
p. 297-307
11 p.
|
artikel
|
| 181 |
Thick film resistors at liquid nitrogen temperature and at microwave frequencies
|
|
|
1980
|
20 |
3 |
p. 387-388
2 p.
|
artikel
|
| 182 |
Tories changing rules of the game
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 183 |
Tunnels in semiconductor epitaxy
|
|
|
1980
|
20 |
3 |
p. 386-
1 p.
|
artikel
|
| 184 |
Two algorithms for determining the most reliable path of a network
|
|
|
1980
|
20 |
3 |
p. 378-
1 p.
|
artikel
|
| 185 |
Using infrared to analyse board faults
|
|
|
1980
|
20 |
3 |
p. 376-
1 p.
|
artikel
|
| 186 |
Vibration, shock and intense noise testing for reliability
|
|
|
1980
|
20 |
3 |
p. 377-
1 p.
|
artikel
|
| 187 |
V-MOS chip joins microprocessor to handle signals in real time
|
|
|
1980
|
20 |
3 |
p. 383-
1 p.
|
artikel
|
| 188 |
Wafers to challenge disks, bubbles?
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
| 189 |
Yield improvement on L.S.I.
|
|
|
1980
|
20 |
3 |
p. 381-
1 p.
|
artikel
|
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