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                             237 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A CdSe thin-film field effect transistor 1979
19 5-6 p. 427-
1 p.
artikel
2 A closer look at hybrid microcircuit screening 1979
19 5-6 p. 429-
1 p.
artikel
3 A confidence interval for the Barlow-Scheuer reliability growth model 1979
19 5-6 p. 413-
1 p.
artikel
4 A correlation interface circuit for microprocessor systems 1979
19 5-6 p. 423-
1 p.
artikel
5 Acoustic imaging for nondestructive evaluation 1979
19 5-6 p. 422-
1 p.
artikel
6 A decomposition method for computing system reliability by a matrix expression 1979
19 5-6 p. 414-
1 p.
artikel
7 A design review approach toward dynamic RAM reliability 1979
19 5-6 p. 411-
1 p.
artikel
8 Adhesion mechanisms of thick film conductors 1979
19 5-6 p. 427-
1 p.
artikel
9 Advances in double sided wafer processing 1979
19 5-6 p. 418-
1 p.
artikel
10 Advances in planar plasma etching equipment 1979
19 5-6 p. 420-
1 p.
artikel
11 A general procedure for designing tests for LSI digital circuits 1979
19 5-6 p. 419-
1 p.
artikel
12 A laser projector for edge-rounding contour measurement on polished wafers 1979
19 5-6 p. 430-
1 p.
artikel
13 A low cost reliability test specification 1979
19 5-6 p. 413-
1 p.
artikel
14 A method for determining the statistically weighted percent fault detection coverage of a self-test program 1979
19 5-6 p. 415-
1 p.
artikel
15 A method for dynamic analysis of integrated MOS inverters with non-linear resistive loads 1979
19 5-6 p. 424-
1 p.
artikel
16 A microelectronic test pattern for measuring uniformity of an integrated circuit fabrication technology 1979
19 5-6 p. 418-
1 p.
artikel
17 A minicomputer-controlled read-only-memory programmer 1979
19 5-6 p. 421-
1 p.
artikel
18 Amorphous silicon shows promise for flat-panel TV display 1979
19 5-6 p. 417-
1 p.
artikel
19 A multi-microcomputer interface Wood, A.R.
1979
19 5-6 p. 513-522
10 p.
artikel
20 Analog ICs divide accurately to conquer computation problems 1979
19 5-6 p. 428-
1 p.
artikel
21 Analogue sampling ICs in data acquisition systems Bowers, Derek F.
1979
19 5-6 p. 497-511
15 p.
artikel
22 Analysis of thin oxide films on silicon by back-scattering techniques 1979
19 5-6 p. 431-
1 p.
artikel
23 A new analytical expression for the T.C.R. of thin monocrystalline metal films 1979
19 5-6 p. 428-
1 p.
artikel
24 A new breed of linear ICs runs at 1-volt levels 1979
19 5-6 p. 421-
1 p.
artikel
25 A new technique for component mounting and interconnection: double face circuitry on polyimide film 1979
19 5-6 p. 419-
1 p.
artikel
26 A new ultra low power ULA and its application Forshaw, P.
1979
19 5-6 p. 463-472
10 p.
artikel
27 An improved algorithm for network reliability 1979
19 5-6 p. 416-
1 p.
artikel
28 An improved algorithm for reliability optimization 1979
19 5-6 p. 411-
1 p.
artikel
29 Anisotropic plasma etching of semiconductor materials 1979
19 5-6 p. 420-
1 p.
artikel
30 An optical pattern generator for large area devices and direct wafer stepping 1979
19 5-6 p. 419-
1 p.
artikel
31 A note on heuristic methods in optimal system reliability 1979
19 5-6 p. 414-
1 p.
artikel
32 A note on the implementation of three-valued unary operators with C-MOS integrated circuits 1979
19 5-6 p. 421-
1 p.
artikel
33 A novel double dielectric two phase CCD with overlapping gates 1979
19 5-6 p. 421-
1 p.
artikel
34 Application of discrete Fourier transform to decision-making in reliability 1979
19 5-6 p. 413-
1 p.
artikel
35 Application of the MOSFET device structure in characterizing imperfection centers in indium-doped silicon 1979
19 5-6 p. 423-424
2 p.
artikel
36 Applications for silicon tetrafluoride in plasma etching 1979
19 5-6 p. 420-
1 p.
artikel
37 Applications of thin film and thick film technologies to high microwave frequencies 1979
19 5-6 p. 429-
1 p.
artikel
38 A reliability growth model 1979
19 5-6 p. 411-412
2 p.
artikel
39 A review of microprocessor software Rundle, A.R.
1979
19 5-6 p. 541-548
8 p.
artikel
40 Assembly technologies for hybrid integrated circuits and their mechanization 1979
19 5-6 p. 429-
1 p.
artikel
41 Automated inspection system for various defects in screenprinted patterns 1979
19 5-6 p. 430-
1 p.
artikel
42 Availability: A low-density deployment case study 1979
19 5-6 p. 416-
1 p.
artikel
43 Availability of a parallel redundant complex system 1979
19 5-6 p. 413-
1 p.
artikel
44 Availability of k-out-of-m:G repairable system with nonidentical elements 1979
19 5-6 p. 413-
1 p.
artikel
45 Bevel cross sectioning of ultra-thin (∼ 100 Å) III–V semiconductor layers 1979
19 5-6 p. 424-
1 p.
artikel
46 16 bit microprocessor for the hard environment Fox, R.E.
1979
19 5-6 p. 599-610
12 p.
artikel
47 Bubble memories demand unique test methods 1979
19 5-6 p. 421-
1 p.
artikel
48 Carrier transport across heterojunction interfaces 1979
19 5-6 p. 423-
1 p.
artikel
49 Causes of wavesoldering defects 1979
19 5-6 p. 411-
1 p.
artikel
50 Channel current limitations in GaAs MESFETS 1979
19 5-6 p. 426-
1 p.
artikel
51 Characterization of thick film compositions on porcelain steel substrates 1979
19 5-6 p. 430-
1 p.
artikel
52 Charge-transfer filtering 1979
19 5-6 p. 424-
1 p.
artikel
53 Chip handles I/O channel 1979
19 5-6 p. 421-
1 p.
artikel
54 C-MOS codec solves phone line problems with bipolar interface 1979
19 5-6 p. 421-
1 p.
artikel
55 Codec has on-chip signaling for phone applications 1979
19 5-6 p. 422-
1 p.
artikel
56 Codecs for P.C.M. processing Jenkins, Mike
1979
19 5-6 p. 479-496
18 p.
artikel
57 Component replacement and the use of Relcode 1979
19 5-6 p. 412-
1 p.
artikel
58 Components of microcomputer systems Lister, P.F.
1979
19 5-6 p. 433-440
8 p.
artikel
59 Computation-based reliability analysis in real time applications 1979
19 5-6 p. 412-
1 p.
artikel
60 CP-140 aircraft reliability program—A “tailored” management approach 1979
19 5-6 p. 415-
1 p.
artikel
61 Current/voltage characteristics of transistors operating in current-mode second breakdown 1979
19 5-6 p. 410-
1 p.
artikel
62 Degradation of electrical contacts caused by oscillatory micromotion between the contact members 1979
19 5-6 p. 410-
1 p.
artikel
63 Designing low power 12 bit microprocessor systems Watson, David
1979
19 5-6 p. 575-578
4 p.
artikel
64 Design of reliability acceptance sampling plans based upon prior distribution 1979
19 5-6 p. 415-
1 p.
artikel
65 Determination of complete carrier density and drift mobility profiles in thin semiconductor layers 1979
19 5-6 p. 424-
1 p.
artikel
66 Determinations of MTTF from the transition probability matrix and diagram 1979
19 5-6 p. 412-413
2 p.
artikel
67 Developing the sampling plans 1979
19 5-6 p. 411-
1 p.
artikel
68 Developments in CMOS memory Watson, David
1979
19 5-6 p. 449-452
4 p.
artikel
69 Digital signal processing and LSI in modems for data transmission 1979
19 5-6 p. 421-
1 p.
artikel
70 Discrete probability models with modified zeros 1979
19 5-6 p. 415-
1 p.
artikel
71 Dissociation of GaAs and Ga0.7Al0.3As during alloying of gold contact films 1979
19 5-6 p. 425-
1 p.
artikel
72 Disturbance caused in telecommunications cables by thyristor fitted locomotives 1979
19 5-6 p. 409-410
2 p.
artikel
73 Does DSA stand for better MOS? 1979
19 5-6 p. 420-
1 p.
artikel
74 Double-step annealing and ambient effects on phosphorus implanted emitters in silicon 1979
19 5-6 p. 430-
1 p.
artikel
75 E-beam exposure for semiconductor device lithography 1979
19 5-6 p. 419-420
2 p.
artikel
76 Effect of restricted repair on system reliability indices 1979
19 5-6 p. 414-415
2 p.
artikel
77 Effect of silicon film thickness on threshold voltage of SOS-MOSFETs 1979
19 5-6 p. 424-
1 p.
artikel
78 Effect of substrate generation current on oxide I–V measurement on p-type MOS structures 1979
19 5-6 p. 424-
1 p.
artikel
79 Effects of nitrogen annealing on electron scatterings in Si-SiO2 interface 1979
19 5-6 p. 425-
1 p.
artikel
80 Effects of trichloroethane oxidation of silicon wafers on SiO2 and Si properties 1979
19 5-6 p. 427-
1 p.
artikel
81 Eigenvalue approach for computing the reliability of Markov systems 1979
19 5-6 p. 412-
1 p.
artikel
82 Electrical conduction of silicon nitride films 1979
19 5-6 p. 426-
1 p.
artikel
83 Electrically erasable memory behaves like a fast nonvolatile RAM 1979
19 5-6 p. 421-
1 p.
artikel
84 Electrical properties of epitaxial aluminium films 1979
19 5-6 p. 427-428
2 p.
artikel
85 Electrical properties of RF sputtering systems 1979
19 5-6 p. 428-
1 p.
artikel
86 Electrode effects in electrical measurements in SiO thin films 1979
19 5-6 p. 426-
1 p.
artikel
87 Electron mobility in Si-MOSFETs with an additional implanted channel 1979
19 5-6 p. 430-
1 p.
artikel
88 Empirical Bayes estimators of reliability for lognormal failure model 1979
19 5-6 p. 412-
1 p.
artikel
89 Empirical studies of software validation 1979
19 5-6 p. 413-
1 p.
artikel
90 Engineering and technological problems of the hybrid integration 1979
19 5-6 p. 429-
1 p.
artikel
91 Engineering risk reduction in satellite programs 1979
19 5-6 p. 416-
1 p.
artikel
92 Enhancing MOS/LSI's role in analog design 1979
19 5-6 p. 418-
1 p.
artikel
93 Estimation of periodically changing failure rate 1979
19 5-6 p. 416-
1 p.
artikel
94 Estimation of reliability from multiple independent grouped censored samples with failure times known 1979
19 5-6 p. 415-
1 p.
artikel
95 Estimation of the reliability of hierarchical communication networks 1979
19 5-6 p. 411-
1 p.
artikel
96 Fabrication of microelectronics reticles 1979
19 5-6 p. 418-
1 p.
artikel
97 Factors affecting adhesion of lithographic materials 1979
19 5-6 p. 419-
1 p.
artikel
98 Fast electrical test monitors chip-package bond quality 1979
19 5-6 p. 418-
1 p.
artikel
99 Fault diagnosis in computer control systems 1979
19 5-6 p. 416-
1 p.
artikel
100 Fault isolation for modular electronic equipment 1979
19 5-6 p. 416-
1 p.
artikel
101 Film carrier assembly process 1979
19 5-6 p. 418-
1 p.
artikel
102 GaAs lasers—A family of laser structures emerging for new applications Kirkby, P.A.
1979
19 5-6 p. 633-644
12 p.
artikel
103 Gold ion plating: A recently developed coating process 1979
19 5-6 p. 430-
1 p.
artikel
104 High productivity, high reliability electron beam welder 1979
19 5-6 p. 430-431
2 p.
artikel
105 Impact of design rule reduction on size, yield, and cost of integrated circuits 1979
19 5-6 p. 418-
1 p.
artikel
106 Improvement of adhesion, line definition, contact resistance and semiconductor properties by sputter-etching 1979
19 5-6 p. 427-
1 p.
artikel
107 Impurity effects in amorphous germanium and silicon 1979
19 5-6 p. 427-
1 p.
artikel
108 In-circuit tester using signature analysis adds digital LSI to its range 1979
19 5-6 p. 422-
1 p.
artikel
109 In-circuit unit does analog and digital testing 1979
19 5-6 p. 423-
1 p.
artikel
110 Influence of interface states on the charge injection in m.n.o.s. memory devices 1979
19 5-6 p. 426-
1 p.
artikel
111 Interactions of industrial integration and standardization 1979
19 5-6 p. 411-
1 p.
artikel
112 Interactive graphics in new product quality assurance programs 1979
19 5-6 p. 411-
1 p.
artikel
113 Introduction to microprocessor software development Hunter, J.R.W.
1979
19 5-6 p. 441-448
8 p.
artikel
114 Liquid encapsulated compounding and Czochralski growth of semi-insulating gallium arsenide 1979
19 5-6 p. 425-
1 p.
artikel
115 Lithography chases the incredible shrinking line 1979
19 5-6 p. 418-
1 p.
artikel
116 Low-temperature vapour-phase growth of silicon dioxide 1979
19 5-6 p. 425-
1 p.
artikel
117 LSI-based data encryption discourages the data thief 1979
19 5-6 p. 417-
1 p.
artikel
118 LSI streamlines instrument interface with standard IEEE-488 bus 1979
19 5-6 p. 421-
1 p.
artikel
119 Management of satellite systems reliability program 1979
19 5-6 p. 414-
1 p.
artikel
120 Management of total reliability 1979
19 5-6 p. 414-
1 p.
artikel
121 Manual backup operations: Some behavioral aspects of human reliability 1979
19 5-6 p. 409-
1 p.
artikel
122 Measurements and mechanisms of etchant production during the plasma oxidation of CF4 and C2F6 1979
19 5-6 p. 420-
1 p.
artikel
123 Megabit bubble-memory chip gets support from LSI family 1979
19 5-6 p. 421-
1 p.
artikel
124 Megabit bubble modules move in on mass storage 1979
19 5-6 p. 421-
1 p.
artikel
125 Memory design for micros Lewis, Dave
1979
19 5-6 p. 453-455
3 p.
artikel
126 Microprocessor implementation of tactical modems for data transmissions over v.h.f. radios 1979
19 5-6 p. 422-
1 p.
artikel
127 Miniature programmable transversal filter using CCD/MOS technology 1979
19 5-6 p. 420-421
2 p.
artikel
128 Miniaturized thick-film RC-active filters for PCM application 1979
19 5-6 p. 428-
1 p.
artikel
129 Mobile ion instability in SiO2 films on silicon 1979
19 5-6 p. 426-
1 p.
artikel
130 Modelling I2L/MTL cells 1979
19 5-6 p. 417-
1 p.
artikel
131 Model of gas phase etching of silicon with HCl 1979
19 5-6 p. 420-
1 p.
artikel
132 Modularity is not a matter of size 1979
19 5-6 p. 423-
1 p.
artikel
133 Monolithic approach bears fruit in data conversion 1979
19 5-6 p. 422-
1 p.
artikel
134 MOS semiconductor random access memory failure rate 1979
19 5-6 p. 410-
1 p.
artikel
135 Multiband and multivalley effective-mass theory for impurities in semiconductors 1979
19 5-6 p. 425-
1 p.
artikel
136 Multiobjective optimization by the Surrogate Worth Trade-off method 1979
19 5-6 p. 414-
1 p.
artikel
137 Multiple insulator layers on GaAs studied by auger analysis 1979
19 5-6 p. 428-
1 p.
artikel
138 New crossovers using a combined film technique 1979
19 5-6 p. 427-
1 p.
artikel
139 New developments in thick film conductors 1979
19 5-6 p. 429-430
2 p.
artikel
140 New method for the electronic structure of heterojunctions—Application to the (100) Ge-GaAs interfaces 1979
19 5-6 p. 427-
1 p.
artikel
141 New optoelectronic devices and their applications de Vooght, Michel
1979
19 5-6 p. 611-622
12 p.
artikel
142 Noise immunity of CMOS integrated circuits 1979
19 5-6 p. 423-
1 p.
artikel
143 OEM control systems Hodge, Peter H.
1979
19 5-6 p. 535-540
6 p.
artikel
144 On fault trees and other reliability evaluation methods 1979
19 5-6 p. 412-
1 p.
artikel
145 On the surface recombination effect on some properties of semiconductor devices—Dynamic relationships 1979
19 5-6 p. 424-425
2 p.
artikel
146 On the temperature dependence of subthreshold currents in MOS electron inversion layers 1979
19 5-6 p. 425-
1 p.
artikel
147 Optimal allocation of fault detectors 1979
19 5-6 p. 414-
1 p.
artikel
148 Optimal replacement and build policies 1979
19 5-6 p. 417-
1 p.
artikel
149 Parallel processing with minicomputers increases performance, availability 1979
19 5-6 p. 421-
1 p.
artikel
150 Photochemical decomposition mechanisms for AZ-type photoresists 1979
19 5-6 p. 418-419
2 p.
artikel
151 Physical and thermodynamic properties of silicon tetrachloride 1979
19 5-6 p. 417-
1 p.
artikel
152 Plasma etch monitoring with laser interferometry 1979
19 5-6 p. 430-
1 p.
artikel
153 Porcelain-on-steel boards can launch a thousand chips 1979
19 5-6 p. 417-
1 p.
artikel
154 Practical components for fibre optic data transmission Watts, J.K.
1979
19 5-6 p. 623-632
10 p.
artikel
155 Problems in the production and measurement of very high vacuum, especially in applications, and a new approach to measurement based on the use of field emission 1979
19 5-6 p. 428-
1 p.
artikel
156 Problems of the application of microprocessors 1979
19 5-6 p. 422-
1 p.
artikel
157 Product reliability due to random load variations at elevated temperatures 1979
19 5-6 p. 416-417
2 p.
artikel
158 Products liability in Europe: Proposed reforms: The Council of Europe Convention and the draft directive of the European Economic Community 1979
19 5-6 p. 409-
1 p.
artikel
159 Products liability in the United Kingdom: The current situation 1979
19 5-6 p. 409-
1 p.
artikel
160 Pulsed electron-beam processing of semiconductor devices 1979
19 5-6 p. 431-
1 p.
artikel
161 Quality improvement through defect source analysis 1979
19 5-6 p. 415-
1 p.
artikel
162 Radiation levels associated with the electron-beam metallization process 1979
19 5-6 p. 431-
1 p.
artikel
163 Rapid RMA assessment—The painless plot 1979
19 5-6 p. 422-423
2 p.
artikel
164 RC-active filters in single-layer tantalum RC-film technology 1979
19 5-6 p. 428-
1 p.
artikel
165 Reappraising CCD memories: can they stand up to RAMs? 1979
19 5-6 p. 422-
1 p.
artikel
166 Recent developments in gold conductor bonding performance and failure mechanisms 1979
19 5-6 p. 410-
1 p.
artikel
167 Recent innovations in semiconductor materials 1979
19 5-6 p. 417-
1 p.
artikel
168 Relationship between carrier mobility and electron concentration in silicon heavily doped with phosphorus 1979
19 5-6 p. 426-427
2 p.
artikel
169 Reliability and maintainability growth of a modern, high performance aircraft, the F-14A 1979
19 5-6 p. 413-
1 p.
artikel
170 Reliability assessment of small signal GaAs FETS 1979
19 5-6 p. 410-
1 p.
artikel
171 Reliability based quality (RBQ) technique for evaluating the degradation of reliability during manufacturing 1979
19 5-6 p. 414-
1 p.
artikel
172 Reliability learning model: Application to color TV 1979
19 5-6 p. 412-
1 p.
artikel
173 Reliability optimization in the design of telephone networks 1979
19 5-6 p. 413-
1 p.
artikel
174 Resist materials for fine line lithography 1979
19 5-6 p. 419-
1 p.
artikel
175 Retention and endurance characteristics of HCl-annealed and unannealed MNOS capacitors 1979
19 5-6 p. 423-
1 p.
artikel
176 Screen printable inks in hybrid microelectronics: availability and physical properties 1979
19 5-6 p. 429-
1 p.
artikel
177 Screen printable inks in hybrid microelectronics: materials and their behaviour 1979
19 5-6 p. 429-
1 p.
artikel
178 Screen printing inks for high resolution rheology and printing 1979
19 5-6 p. 429-
1 p.
artikel
179 Self-consistent pseudopotential calculations of the equilibrium properties of bulk and surface Si 1979
19 5-6 p. 423-
1 p.
artikel
180 Selling reliability engineering to the company 1979
19 5-6 p. 412-
1 p.
artikel
181 Separation of surface and bulk gases in contact materials of vacuum switches—Determination of gases and effect on vacuum breakdown 1979
19 5-6 p. 410-
1 p.
artikel
182 Sequencing of diagnostic tests for fault isolation by dynamic programming 1979
19 5-6 p. 413-
1 p.
artikel
183 Silicon wafer damage—Two useful investigation techniques 1979
19 5-6 p. 410-
1 p.
artikel
184 Single-chip microcomputers with 1 million bits of information, English-language programming, and canned software are seen ahead 1979
19 5-6 p. 421-
1 p.
artikel
185 Software packages Healey, Martin
1979
19 5-6 p. 549-554
6 p.
artikel
186 Solder bump interconnected, multiple chip, thick film hybrid for 40-character alphanumeric LCD application 1979
19 5-6 p. 429-
1 p.
artikel
187 Some applications of molecular electronics 1979
19 5-6 p. 417-
1 p.
artikel
188 Some chemical aspects of the fluorocarbon plasma etching of silicon and its compounds 1979
19 5-6 p. 420-
1 p.
artikel
189 Some chemical aspects of the fluorocarbon plasma etching of silicon and its compounds 1979
19 5-6 p. 418-
1 p.
artikel
190 Some design aspects of m.o.s.l.s.i. operational amplifiers 1979
19 5-6 p. 419-
1 p.
artikel
191 Some recents advances in integrated crystal filters 1979
19 5-6 p. 420-
1 p.
artikel
192 Special seminex 1979 edition semiconductors and microprocessors Dummer, G.W.A.
1979
19 5-6 p. 407-
1 p.
artikel
193 Specification of an automatic test system vs an optimum maintenance policy and equipment reliability 1979
19 5-6 p. 416-
1 p.
artikel
194 Spectroscopic determination of the energy gaps in the inversion layer band structure on vicinal planes of Si (001) 1979
19 5-6 p. 426-
1 p.
artikel
195 Sputtering process model of deposition rate 1979
19 5-6 p. 428-
1 p.
artikel
196 Stochastic behavior of some 2-unit redundant systems 1979
19 5-6 p. 412-
1 p.
artikel
197 Tailoring RAM to meet the user's need 1979
19 5-6 p. 422-
1 p.
artikel
198 Technical and practical considerations of incorporating microprocessors in OEM products—A management view Sambell, S.
1979
19 5-6 p. 523-533
11 p.
artikel
199 Temperature dependent threshold behavior of depletion mode MOSFETs—Characterization and simulation 1979
19 5-6 p. 424-
1 p.
artikel
200 Testability analysis: Predict it more closely 1979
19 5-6 p. 417-
1 p.
artikel
201 The 8086—An advanced 16-bit microcomputer Kornstein, Howard
1979
19 5-6 p. 591-597
7 p.
artikel
202 The application of low cost microprocessors in keyboard design Lowe, John M.
1979
19 5-6 p. 563-569
7 p.
artikel
203 The Burr distribution as a failure model from a Bayesian approach 1979
19 5-6 p. 413-
1 p.
artikel
204 The effect of heat treatment on unpassivated and passivated gallium arsenide surfaces 1979
19 5-6 p. 426-
1 p.
artikel
205 The expanding role of CMOS in digital L.S.I. Watson, David
1979
19 5-6 p. 473-478
6 p.
artikel
206 The F-16 RIW program 1979
19 5-6 p. 415-
1 p.
artikel
207 The fundamental limitations of digital semiconductor technology 1979
19 5-6 p. 417-
1 p.
artikel
208 The influence of gold when present at a silicon/silicon dioxide interface 1979
19 5-6 p. 425-
1 p.
artikel
209 The limitations of reactively-bonded thick film gold conductors 1979
19 5-6 p. 427-
1 p.
artikel
210 The logistics of life cycle cost 1979
19 5-6 p. 411-
1 p.
artikel
211 The need for feedback of field RAM data 1979
19 5-6 p. 414-
1 p.
artikel
212 The NOVRAM—A new concept in electrically alterable memories 1979
19 5-6 p. 421-
1 p.
artikel
213 The numerical analysis of anomalous doping profiles of phosphorus in silicon 1979
19 5-6 p. 423-
1 p.
artikel
214 The operational impact of Navy's first TAAF program 1979
19 5-6 p. 415-
1 p.
artikel
215 The race heats up in fast static RAMs 1979
19 5-6 p. 421-
1 p.
artikel
216 The recognition of latent defects in electronic circuits by measuring phase noise 1979
19 5-6 p. 411-
1 p.
artikel
217 Thermal stress in bonded joints 1979
19 5-6 p. 411-
1 p.
artikel
218 The S9900—Mini on a chip? Walsh, M.J.
1979
19 5-6 p. 579-590
12 p.
artikel
219 The software development notebook—A proven technique 1979
19 5-6 p. 415-
1 p.
artikel
220 Thick film technology 1979
19 5-6 p. 430-
1 p.
artikel
221 Title section, volume contents and author index for volume 19, 1979 1979
19 5-6 p. i-vi
nvt p.
artikel
222 Tools for building microprocessor software systems Baker, Keith D.
1979
19 5-6 p. 555-562
8 p.
artikel
223 Top-end microprocessors—Introductory review Cooke, P.
1979
19 5-6 p. 571-573
3 p.
artikel
224 Transition metal deep centers in GaAs, GaP and Si 1979
19 5-6 p. 425-426
2 p.
artikel
225 Transport properties of doped amorphous silicon 1979
19 5-6 p. 426-
1 p.
artikel
226 Trimming of thin and thick film resistors 1979
19 5-6 p. 428-429
2 p.
artikel
227 Two dimensional electron GaAs at a semiconductor-semiconductor interface 1979
19 5-6 p. 423-
1 p.
artikel
228 Two-dimensional position-sensitive photodetector with high linearity made with standard i.c.-technology 1979
19 5-6 p. 422-
1 p.
artikel
229 Universal logic gates for custom-design I.C. requirements Hurst, S.L.
1979
19 5-6 p. 457-461
5 p.
artikel
230 VLSI and other solid-state devices. New fabrication technologies put us on the threshold of a quantum jump in IC complexity 1979
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231 VLSI shakes the foundations of computer architecture 1979
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232 V-MOS packs 16 kilobits into static random-access memory 1979
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233 Wafer flatness: An overview of measurement considerations and equipment correlation 1979
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234 Warranties—The easy way out 1979
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235 What to look for in logic timing analyzers 1979
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236 Yield-area analysis: Part II—Effects of photomask alignment errors on zero yield loci 1979
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237 Zero bias anomaly in tunnel resistance and electron-electron interaction 1979
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                             237 gevonden resultaten
 
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