| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accurate two-port model of the metal-oxide semiconductor transistor
|
Kumar, Umesh
|
|
1978
|
18 |
5 |
p. 427-432
6 p.
|
artikel
|
| 2 |
Achieving reliable consumer products through total program management of new models
|
|
|
1978
|
18 |
5 |
p. 406-
1 p.
|
artikel
|
| 3 |
Advanced manufacturing techniques of discrete packs
|
|
|
1978
|
18 |
5 |
p. 408-
1 p.
|
artikel
|
| 4 |
Advances in BiMOS integrated circuits
|
|
|
1978
|
18 |
5 |
p. 408-
1 p.
|
artikel
|
| 5 |
A fast response non-contact type potentiometer using an improved CdSe film
|
|
|
1978
|
18 |
5 |
p. 412-
1 p.
|
artikel
|
| 6 |
A field study of the electrical performance of separable connectors
|
|
|
1978
|
18 |
5 |
p. 400-401
2 p.
|
artikel
|
| 7 |
A high performance thick film capacitor system
|
|
|
1978
|
18 |
5 |
p. 413-
1 p.
|
artikel
|
| 8 |
A high stability RC circuit using high nitrogen doped tantalum
|
|
|
1978
|
18 |
5 |
p. 414-
1 p.
|
artikel
|
| 9 |
A k-out-of-n three-state devices system with common-cause failures
|
Dhillon, Balbir S.
|
|
1978
|
18 |
5 |
p. 447-448
2 p.
|
artikel
|
| 10 |
A low cost thick-film active filter for consumer application
|
|
|
1978
|
18 |
5 |
p. 414-
1 p.
|
artikel
|
| 11 |
A low power thermal head realizing high quality printing
|
|
|
1978
|
18 |
5 |
p. 412-
1 p.
|
artikel
|
| 12 |
Aluminum wire to thick film connections for high temperature operation
|
|
|
1978
|
18 |
5 |
p. 408-
1 p.
|
artikel
|
| 13 |
A manufacturer's approach to reliability in capacitor production for the domestic market
|
|
|
1978
|
18 |
5 |
p. 400-
1 p.
|
artikel
|
| 14 |
A microelectronics packaging technology for consumer product applications
|
|
|
1978
|
18 |
5 |
p. 408-
1 p.
|
artikel
|
| 15 |
A microprocessor-based semiconductor measurement system
|
|
|
1978
|
18 |
5 |
p. 410-
1 p.
|
artikel
|
| 16 |
Analysis of retrospective failure data using computer graphics
|
|
|
1978
|
18 |
5 |
p. 405-
1 p.
|
artikel
|
| 17 |
Analysis of truncated SPRT: Exponential case
|
|
|
1978
|
18 |
5 |
p. 406-
1 p.
|
artikel
|
| 18 |
An analytical approach to determining optimum reliability and maintainability requirements
|
|
|
1978
|
18 |
5 |
p. 402-
1 p.
|
artikel
|
| 19 |
An electronic reliability data bank
|
|
|
1978
|
18 |
5 |
p. 401-
1 p.
|
artikel
|
| 20 |
A new approach to reliability optimization in general modular redundant systems
|
Gopal, Krishna
|
|
1978
|
18 |
5 |
p. 419-422
4 p.
|
artikel
|
| 21 |
Applications of massspectrometers to plasma process monitoring & control
|
|
|
1978
|
18 |
5 |
p. 411-
1 p.
|
artikel
|
| 22 |
A review of electronics reliability engineering practice
|
Sandiford, S.L.
|
|
1978
|
18 |
5 |
p. 437-446
10 p.
|
artikel
|
| 23 |
Assessment of moisture permeation of an epoxy sealed test module
|
|
|
1978
|
18 |
5 |
p. 410-
1 p.
|
artikel
|
| 24 |
Assessment of system reliability in electronics
|
|
|
1978
|
18 |
5 |
p. 404-
1 p.
|
artikel
|
| 25 |
A thick film active filter for PCM communication systems
|
|
|
1978
|
18 |
5 |
p. 413-
1 p.
|
artikel
|
| 26 |
A thick film capacitive temperature sensor
|
|
|
1978
|
18 |
5 |
p. 413-
1 p.
|
artikel
|
| 27 |
Automated wire bonding versus tape automated bonding: What are the tradeoffs?
|
|
|
1978
|
18 |
5 |
p. 408-
1 p.
|
artikel
|
| 28 |
Automatic photoresist develop process end point detection software
|
|
|
1978
|
18 |
5 |
p. 407-
1 p.
|
artikel
|
| 29 |
A workable software quality/reliability plan
|
|
|
1978
|
18 |
5 |
p. 406-
1 p.
|
artikel
|
| 30 |
Breakdown in ceramic capacitors under pulsed high voltage stress
|
|
|
1978
|
18 |
5 |
p. 400-
1 p.
|
artikel
|
| 31 |
Burn-in forever? There must be a better way!
|
|
|
1978
|
18 |
5 |
p. 402-
1 p.
|
artikel
|
| 32 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1978
|
18 |
5 |
p. 379-381
3 p.
|
artikel
|
| 33 |
Characteristics of an indium—tin oxide transparent conductor deposited from organometallic compositions
|
|
|
1978
|
18 |
5 |
p. 411-
1 p.
|
artikel
|
| 34 |
Characteristics of low ohmic, high-power, metallized thick-film resistors
|
|
|
1978
|
18 |
5 |
p. 413-414
2 p.
|
artikel
|
| 35 |
Chemical etching of silicon, germanium, gallium arsenide, and gallium phosphide
|
|
|
1978
|
18 |
5 |
p. 411-
1 p.
|
artikel
|
| 36 |
Chip-joining—A review
|
|
|
1978
|
18 |
5 |
p. 408-
1 p.
|
artikel
|
| 37 |
Circuit theory and design
|
|
|
1978
|
18 |
5 |
p. 417-
1 p.
|
artikel
|
| 38 |
Contaminant induced aging in integrated circuit packages
|
|
|
1978
|
18 |
5 |
p. 401-
1 p.
|
artikel
|
| 39 |
Contractor initiatives for R&M/cost improvement
|
|
|
1978
|
18 |
5 |
p. 403-
1 p.
|
artikel
|
| 40 |
Contractor risk associated with reliability improvement warranty
|
|
|
1978
|
18 |
5 |
p. 399-
1 p.
|
artikel
|
| 41 |
Correlation of thin film adhesion with current noise measurements of Ta2N-Cr-Au resistors on sapphire and alumina substrates
|
|
|
1978
|
18 |
5 |
p. 412-
1 p.
|
artikel
|
| 42 |
Cost-effective reliability testing
|
|
|
1978
|
18 |
5 |
p. 403-
1 p.
|
artikel
|
| 43 |
Courses
|
|
|
1978
|
18 |
5 |
p. 389-391
3 p.
|
artikel
|
| 44 |
Dependent components with increasing failure rates and failure rate averages
|
|
|
1978
|
18 |
5 |
p. 400-
1 p.
|
artikel
|
| 45 |
Designing-in reliability—A new approach
|
|
|
1978
|
18 |
5 |
p. 405-
1 p.
|
artikel
|
| 46 |
Detection of conductive condensates resulting from adhesive outgassing in hybrid microcircuits
|
|
|
1978
|
18 |
5 |
p. 414-
1 p.
|
artikel
|
| 47 |
Detection of cracking during rotational soldering of a high reliability and voltage ceramic capacitor
|
|
|
1978
|
18 |
5 |
p. 401-
1 p.
|
artikel
|
| 48 |
Development of a life cycle management cost model
|
|
|
1978
|
18 |
5 |
p. 403-
1 p.
|
artikel
|
| 49 |
Development of the tab-process at SAAB-SCANIA
|
|
|
1978
|
18 |
5 |
p. 409-
1 p.
|
artikel
|
| 50 |
Distributional errors in reliability
|
Livson, B.U.
|
|
1978
|
18 |
5 |
p. 449-
1 p.
|
artikel
|
| 51 |
Dual-port RAM hikes throughput in input/output controller board
|
|
|
1978
|
18 |
5 |
p. 409-
1 p.
|
artikel
|
| 52 |
ECL memories speeding to market
|
|
|
1978
|
18 |
5 |
p. 407-
1 p.
|
artikel
|
| 53 |
Effects of “on-off” cycling on equipment reliability
|
|
|
1978
|
18 |
5 |
p. 405-
1 p.
|
artikel
|
| 54 |
Electronic effect on the Debye temperature of n-type silicon
|
|
|
1978
|
18 |
5 |
p. 411-
1 p.
|
artikel
|
| 55 |
Encapsulation of large beam leaded devices
|
|
|
1978
|
18 |
5 |
p. 409-
1 p.
|
artikel
|
| 56 |
Error prediction in software
|
Soi, Inder M.
|
|
1978
|
18 |
5 |
p. 433-436
4 p.
|
artikel
|
| 57 |
Fault tree analysis with probability evaluation
|
|
|
1978
|
18 |
5 |
p. 404-
1 p.
|
artikel
|
| 58 |
Flight control safety: A total systems approach
|
|
|
1978
|
18 |
5 |
p. 405-
1 p.
|
artikel
|
| 59 |
Growth of Polycrystalline GaAs for solar cell applications
|
|
|
1978
|
18 |
5 |
p. 411-
1 p.
|
artikel
|
| 60 |
High accuracy hybrid type 12-bit D—A converter made of TaAl-N thin film resistors
|
|
|
1978
|
18 |
5 |
p. 415-
1 p.
|
artikel
|
| 61 |
High-density high-reliability multichip hybrid packaging with thin films and beam leads
|
|
|
1978
|
18 |
5 |
p. 414-
1 p.
|
artikel
|
| 62 |
High frequency measurement of Q-factors of ceramic chip capacitors
|
|
|
1978
|
18 |
5 |
p. 410-
1 p.
|
artikel
|
| 63 |
High Range low cost resistor system
|
|
|
1978
|
18 |
5 |
p. 415-
1 p.
|
artikel
|
| 64 |
High reliability thermocompression bonding for hybrid applications
|
|
|
1978
|
18 |
5 |
p. 413-
1 p.
|
artikel
|
| 65 |
History of electronic reliability in Canada
|
|
|
1978
|
18 |
5 |
p. 399-
1 p.
|
artikel
|
| 66 |
Hybrid IC structures using solder reflow technology
|
|
|
1978
|
18 |
5 |
p. 413-
1 p.
|
artikel
|
| 67 |
Hybrid integrated circuit assembly using computerized imaging analysis
|
|
|
1978
|
18 |
5 |
p. 412-
1 p.
|
artikel
|
| 68 |
Interaction of parylene and moisture in hermetically sealed hybrids
|
|
|
1978
|
18 |
5 |
p. 411-412
2 p.
|
artikel
|
| 69 |
Intervalley diffusion of hot electrons in germanium
|
|
|
1978
|
18 |
5 |
p. 411-
1 p.
|
artikel
|
| 70 |
Ion implantation in amorphous germanium and silicon
|
|
|
1978
|
18 |
5 |
p. 415-
1 p.
|
artikel
|
| 71 |
Is there repair after failure?
|
|
|
1978
|
18 |
5 |
p. 405-406
2 p.
|
artikel
|
| 72 |
Key reliability assurance techniques—Power Tools
|
|
|
1978
|
18 |
5 |
p. 407-
1 p.
|
artikel
|
| 73 |
Lead forming and outer lead bond pattern design of tape bonded hybrids
|
|
|
1978
|
18 |
5 |
p. 414-415
2 p.
|
artikel
|
| 74 |
Logistics supportability testing
|
|
|
1978
|
18 |
5 |
p. 404-
1 p.
|
artikel
|
| 75 |
Low cost silicon for solar energy conversion applications
|
|
|
1978
|
18 |
5 |
p. 411-
1 p.
|
artikel
|
| 76 |
Low expansivity organic substrate for flip-chip bonding
|
|
|
1978
|
18 |
5 |
p. 409-
1 p.
|
artikel
|
| 77 |
Maintainability and life cycle costing
|
|
|
1978
|
18 |
5 |
p. 404-405
2 p.
|
artikel
|
| 78 |
Material characterization of thick film resistor pastes
|
|
|
1978
|
18 |
5 |
p. 414-
1 p.
|
artikel
|
| 79 |
Mechanical reliability for low cycle fatigue
|
|
|
1978
|
18 |
5 |
p. 406-
1 p.
|
artikel
|
| 80 |
Modeling with interactive computer methods
|
|
|
1978
|
18 |
5 |
p. 403-
1 p.
|
artikel
|
| 81 |
Modelling variable hazard rate life data
|
|
|
1978
|
18 |
5 |
p. 399-400
2 p.
|
artikel
|
| 82 |
Modern network theory — An introduction
|
|
|
1978
|
18 |
5 |
p. 417-418
2 p.
|
artikel
|
| 83 |
Motivating management on Maintainability
|
|
|
1978
|
18 |
5 |
p. 402-
1 p.
|
artikel
|
| 84 |
New interpretation of the electronic structure of SiO2
|
|
|
1978
|
18 |
5 |
p. 411-
1 p.
|
artikel
|
| 85 |
Nondestructive bond pull in high reliability applications
|
|
|
1978
|
18 |
5 |
p. 408-
1 p.
|
artikel
|
| 86 |
Nondestructive examination of multilayer capacitors by neutron radiography
|
|
|
1978
|
18 |
5 |
p. 409-410
2 p.
|
artikel
|
| 87 |
On circuit design for timing margin reliability
|
|
|
1978
|
18 |
5 |
p. 407-
1 p.
|
artikel
|
| 88 |
On the nature of the disordered layer produced by ion implantation
|
|
|
1978
|
18 |
5 |
p. 415-
1 p.
|
artikel
|
| 89 |
Operational influences on maintainability
|
|
|
1978
|
18 |
5 |
p. 406-407
2 p.
|
artikel
|
| 90 |
Plasma processes set to etch finer lines with less undercutting
|
|
|
1978
|
18 |
5 |
p. 409-
1 p.
|
artikel
|
| 91 |
Prediction methods for equipment reliability evaluation
|
|
|
1978
|
18 |
5 |
p. 405-
1 p.
|
artikel
|
| 92 |
Prelid burn-in of hybrid circuits
|
|
|
1978
|
18 |
5 |
p. 412-
1 p.
|
artikel
|
| 93 |
Proceedings of the 7th International Broadcasting Convention
|
|
|
1978
|
18 |
5 |
p. 418-
1 p.
|
artikel
|
| 94 |
Profit or liability: Contract intent vs content
|
|
|
1978
|
18 |
5 |
p. 399-
1 p.
|
artikel
|
| 95 |
Program standards help software maintainability
|
|
|
1978
|
18 |
5 |
p. 403-
1 p.
|
artikel
|
| 96 |
Progress in Liquid-Metal Fast Breeder Reactor safety research and development—An overview of the issues
|
|
|
1978
|
18 |
5 |
p. 402-
1 p.
|
artikel
|
| 97 |
Publications, notices, calls for papers, etc.
|
|
|
1978
|
18 |
5 |
p. 383-388
6 p.
|
artikel
|
| 98 |
RAM techniques in the electric power industry
|
|
|
1978
|
18 |
5 |
p. 401-402
2 p.
|
artikel
|
| 99 |
Recent patents on microelectronics
|
|
|
1978
|
18 |
5 |
p. 391-
1 p.
|
artikel
|
| 100 |
Reducing post trim drift of thin film resistors by optimizing YAG laser output characteristics
|
|
|
1978
|
18 |
5 |
p. 415-
1 p.
|
artikel
|
| 101 |
Redundancy techniques for software quality
|
|
|
1978
|
18 |
5 |
p. 405-
1 p.
|
artikel
|
| 102 |
Regression model for LPE film property control
|
|
|
1978
|
18 |
5 |
p. 410-411
2 p.
|
artikel
|
| 103 |
Reliability appraisal for complex equipment
|
|
|
1978
|
18 |
5 |
p. 404-
1 p.
|
artikel
|
| 104 |
Reliability-centered maintenance
|
|
|
1978
|
18 |
5 |
p. 407-
1 p.
|
artikel
|
| 105 |
Reliability growth planning and control
|
|
|
1978
|
18 |
5 |
p. 403-404
2 p.
|
artikel
|
| 106 |
Reliability optimization in systems with many failure modes
|
Gopal, Krishna
|
|
1978
|
18 |
5 |
p. 423-425
3 p.
|
artikel
|
| 107 |
Reliability specifications rethinking Mission Profile Testing
|
|
|
1978
|
18 |
5 |
p. 406-
1 p.
|
artikel
|
| 108 |
Risk control in the development of energy processes
|
|
|
1978
|
18 |
5 |
p. 407-
1 p.
|
artikel
|
| 109 |
RIW data collection and reporting method
|
|
|
1978
|
18 |
5 |
p. 405-
1 p.
|
artikel
|
| 110 |
RPM—A recent real life case history
|
|
|
1978
|
18 |
5 |
p. 402-403
2 p.
|
artikel
|
| 111 |
Simulation models: Analysis and research tools
|
|
|
1978
|
18 |
5 |
p. 406-
1 p.
|
artikel
|
| 112 |
Solderable low contact resistance metallizations for PTC thermistors
|
|
|
1978
|
18 |
5 |
p. 410-
1 p.
|
artikel
|
| 113 |
Some aspects of contamination detection, analyses, and control in microcircuits for the NASA Space Shuttle program
|
|
|
1978
|
18 |
5 |
p. 413-
1 p.
|
artikel
|
| 114 |
Step-stress testing of Schottky-barrier diodes
|
|
|
1978
|
18 |
5 |
p. 401-
1 p.
|
artikel
|
| 115 |
Subjective data in human reliability estimates
|
|
|
1978
|
18 |
5 |
p. 400-
1 p.
|
artikel
|
| 116 |
Tacan RIW program
|
|
|
1978
|
18 |
5 |
p. 407-
1 p.
|
artikel
|
| 117 |
Technology and circuit technique of static memories
|
|
|
1978
|
18 |
5 |
p. 409-
1 p.
|
artikel
|
| 118 |
Television chips are good bet for channel tuning
|
|
|
1978
|
18 |
5 |
p. 407-
1 p.
|
artikel
|
| 119 |
Temperature coefficient of resistance for p- and n-type silicon
|
|
|
1978
|
18 |
5 |
p. 411-
1 p.
|
artikel
|
| 120 |
Testing whether more failures occur later
|
|
|
1978
|
18 |
5 |
p. 402-
1 p.
|
artikel
|
| 121 |
Test methods for steady state availability
|
|
|
1978
|
18 |
5 |
p. 406-
1 p.
|
artikel
|
| 122 |
Text book perfect
|
|
|
1978
|
18 |
5 |
p. 404-
1 p.
|
artikel
|
| 123 |
The infrared signature for PC boards maintenance
|
|
|
1978
|
18 |
5 |
p. 400-
1 p.
|
artikel
|
| 124 |
The microelectronic wire bond pull test—How to use it, how to abuse it
|
|
|
1978
|
18 |
5 |
p. 409-
1 p.
|
artikel
|
| 125 |
The optimization of lead frame bond parameters for production of reliable thermocompression bonds
|
|
|
1978
|
18 |
5 |
p. 408-
1 p.
|
artikel
|
| 126 |
The reliability of integrated circuits and systems from a manufacturing point of view
|
|
|
1978
|
18 |
5 |
p. 400-
1 p.
|
artikel
|
| 127 |
Thermal compression bond failures due to incomplete sintering of alumina ceramics
|
|
|
1978
|
18 |
5 |
p. 401-
1 p.
|
artikel
|
| 128 |
Thermocompression bondability of bare copper leads
|
|
|
1978
|
18 |
5 |
p. 408-
1 p.
|
artikel
|
| 129 |
The role of testing and growth techniques in enhancing reliability
|
|
|
1978
|
18 |
5 |
p. 401-
1 p.
|
artikel
|
| 130 |
The status of reliability terminology in the national and international scene
|
|
|
1978
|
18 |
5 |
p. 399-
1 p.
|
artikel
|
| 131 |
Time series analysis of failure data
|
|
|
1978
|
18 |
5 |
p. 406-
1 p.
|
artikel
|
| 132 |
Ultra-high density VLSI modules
|
|
|
1978
|
18 |
5 |
p. 410-
1 p.
|
artikel
|
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Value engineering and the problems of time and deadlines
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| 134 |
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1978
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Yield-area analysis: Part I—A diagnostic tool for fundamental integrated-circuit process problems
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