| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A class of distributions useful in life testing and reliability
|
|
|
1977
|
16 |
6 |
p. 646-
1 p.
|
artikel
|
| 2 |
A cost model for skip-lot destructive sampling
|
|
|
1977
|
16 |
6 |
p. 644-
1 p.
|
artikel
|
| 3 |
A model for an estimation of the product warranty return rate
|
|
|
1977
|
16 |
6 |
p. 648-649
2 p.
|
artikel
|
| 4 |
Analyse de la composition des surfaces et des couches minces par diffusion d'ions de brasse energie
|
|
|
1977
|
16 |
6 |
p. 657-
1 p.
|
artikel
|
| 5 |
An experimental evaluation of thermal performance of DIPs on expoxy metal vs. epoxy glass printed wiring boards
|
|
|
1977
|
16 |
6 |
p. 653-
1 p.
|
artikel
|
| 6 |
An image method application to multilayer spreading resistance analysis
|
|
|
1977
|
16 |
6 |
p. 655-656
2 p.
|
artikel
|
| 7 |
An improved management approach to upgrade avionic system reliability
|
|
|
1977
|
16 |
6 |
p. 646-
1 p.
|
artikel
|
| 8 |
A numerical analysis of various cross sheet resistor test structures
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 9 |
A postal service field evaluation of letter sorting machine keyboards
|
|
|
1977
|
16 |
6 |
p. 649-
1 p.
|
artikel
|
| 10 |
Applied stresses, cyclotron masses and charge-density-waves in silicon inversion layers
|
|
|
1977
|
16 |
6 |
p. 657-
1 p.
|
artikel
|
| 11 |
A reliability control tool during manufacturing
|
|
|
1977
|
16 |
6 |
p. 647-
1 p.
|
artikel
|
| 12 |
A support system life cycle cost model
|
|
|
1977
|
16 |
6 |
p. 647-
1 p.
|
artikel
|
| 13 |
A survey of published information on universal logic arrays
|
Hurst, S.L.
|
|
1977
|
16 |
6 |
p. 663-674
12 p.
|
artikel
|
| 14 |
Automated shock in particle impact noise (PIN) testing
|
|
|
1977
|
16 |
6 |
p. 654-
1 p.
|
artikel
|
| 15 |
Automatic testing of integrated circuits
|
|
|
1977
|
16 |
6 |
p. 646-
1 p.
|
artikel
|
| 16 |
Behaviour of amorphous Ge contacts to monocrystalline silicon
|
|
|
1977
|
16 |
6 |
p. 656-
1 p.
|
artikel
|
| 17 |
Calculating the probability of Boolean expression being 1
|
|
|
1977
|
16 |
6 |
p. 645-
1 p.
|
artikel
|
| 18 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1977
|
16 |
6 |
p. 627-628
2 p.
|
artikel
|
| 19 |
Carrier system for testing and conditioning of beam lead devices
|
|
|
1977
|
16 |
6 |
p. 653-
1 p.
|
artikel
|
| 20 |
Characterisation of chemical vapour-deposition processes. Part 1
|
|
|
1977
|
16 |
6 |
p. 656-
1 p.
|
artikel
|
| 21 |
Characterisation of chemical vapour-deposition processes Part II
|
|
|
1977
|
16 |
6 |
p. 656-
1 p.
|
artikel
|
| 22 |
Chip carriers, lids and sots—an analysis of cost and performance tradeoffs for hybrid applications
|
|
|
1977
|
16 |
6 |
p. 659-
1 p.
|
artikel
|
| 23 |
CMOS reliability
|
|
|
1977
|
16 |
6 |
p. 644-
1 p.
|
artikel
|
| 24 |
Component reliability exposed to thermal neutron environment—III
|
Lal, Krishan
|
|
1977
|
16 |
6 |
p. 675-677
3 p.
|
artikel
|
| 25 |
Composition and stress state of thin films deposited by ion beam sputtering
|
|
|
1977
|
16 |
6 |
p. 659-
1 p.
|
artikel
|
| 26 |
Computer aided synthesis of fault-trees
|
|
|
1977
|
16 |
6 |
p. 645-
1 p.
|
artikel
|
| 27 |
Computer program for approximating the reliability characteristics of acyclic directed graphs
|
|
|
1977
|
16 |
6 |
p. 644-
1 p.
|
artikel
|
| 28 |
Connection between ESR and electrical conduction in amorphous Si films
|
|
|
1977
|
16 |
6 |
p. 656-
1 p.
|
artikel
|
| 29 |
Contract bid evaluation
|
Reiche, Hans
|
|
1977
|
16 |
6 |
p. 699-700
2 p.
|
artikel
|
| 30 |
Controlling potential static charge problems
|
|
|
1977
|
16 |
6 |
p. 641-
1 p.
|
artikel
|
| 31 |
Correlation between thick-film resistance values
|
|
|
1977
|
16 |
6 |
p. 657-
1 p.
|
artikel
|
| 32 |
Courses
|
|
|
1977
|
16 |
6 |
p. 629-631
3 p.
|
artikel
|
| 33 |
Demands of LSI are turning chip makers towards automation, production innovations
|
|
|
1977
|
16 |
6 |
p. 650-
1 p.
|
artikel
|
| 34 |
Depletion—capacitance-induced distortion in surface-channel c.c.d. transversal filters
|
|
|
1977
|
16 |
6 |
p. 653-
1 p.
|
artikel
|
| 35 |
Depth chemical profiles of MNOS structures measured by AES
|
|
|
1977
|
16 |
6 |
p. 656-
1 p.
|
artikel
|
| 36 |
Design for reliability in hostile environment
|
|
|
1977
|
16 |
6 |
p. 649-
1 p.
|
artikel
|
| 37 |
Design of a single-stress relaxation test for pressure connections
|
|
|
1977
|
16 |
6 |
p. 653-
1 p.
|
artikel
|
| 38 |
Distribution function relaxation times in gallium arsenide
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 39 |
Drain characteristics of thin film MOS FET's
|
|
|
1977
|
16 |
6 |
p. 658-
1 p.
|
artikel
|
| 40 |
Effect of oxidation on the breakdown characteristics of aluminium diffused junctions
|
|
|
1977
|
16 |
6 |
p. 643-644
2 p.
|
artikel
|
| 41 |
Effect of temperature-dependent band shifts on semiconductor transport properties
|
|
|
1977
|
16 |
6 |
p. 656-
1 p.
|
artikel
|
| 42 |
Electrically conductive epoxies for screen printing applications
|
|
|
1977
|
16 |
6 |
p. 651-
1 p.
|
artikel
|
| 43 |
Electrical properties of thin films-metal-semiconductor contacts. 1. Metal-semiconductor junctions-related to deposition of thin films
|
|
|
1977
|
16 |
6 |
p. 657-
1 p.
|
artikel
|
| 44 |
Electrical ratings of electronic components from the viewpoint of reliability
|
|
|
1977
|
16 |
6 |
p. 642-643
2 p.
|
artikel
|
| 45 |
Electromigration and hall effect in cobalt films
|
|
|
1977
|
16 |
6 |
p. 658-
1 p.
|
artikel
|
| 46 |
Encapsulation, sectioning and examination of multilayer ceramic chip capacitors
|
|
|
1977
|
16 |
6 |
p. 643-
1 p.
|
artikel
|
| 47 |
Estimating reliability growth
|
|
|
1977
|
16 |
6 |
p. 646-
1 p.
|
artikel
|
| 48 |
Estimation of mission reliability from multiple independent grouped s censored samples
|
|
|
1977
|
16 |
6 |
p. 646-
1 p.
|
artikel
|
| 49 |
Extremely uniform thin films by vacuum deposition from a “tube source”
|
|
|
1977
|
16 |
6 |
p. 657-
1 p.
|
artikel
|
| 50 |
Failure mechanisms in beam lead semiconductors
|
|
|
1977
|
16 |
6 |
p. 641-
1 p.
|
artikel
|
| 51 |
Failure mechanisms in solid electrolytic capacitors
|
|
|
1977
|
16 |
6 |
p. 643-
1 p.
|
artikel
|
| 52 |
Failure modes and effects analysis by matrix method
|
|
|
1977
|
16 |
6 |
p. 647-
1 p.
|
artikel
|
| 53 |
Fast emulator debugs 8085-based microcomputers in real time
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 54 |
Fault simulation and digital circuit testability
|
|
|
1977
|
16 |
6 |
p. 649-
1 p.
|
artikel
|
| 55 |
Fault substitutes: The true bases for strict liability
|
|
|
1977
|
16 |
6 |
p. 645-
1 p.
|
artikel
|
| 56 |
Field environmental testing of electronic components
|
Kit, Eliezer
|
|
1977
|
16 |
6 |
p. 661-
1 p.
|
artikel
|
| 57 |
Fixed-head disk memory unit for high reliability applications
|
|
|
1977
|
16 |
6 |
p. 647-
1 p.
|
artikel
|
| 58 |
Formation of various metal-semiconductor junctions by means of ion evaporation
|
|
|
1977
|
16 |
6 |
p. 659-
1 p.
|
artikel
|
| 59 |
Gallium aluminium arsenide heterostructure lasers: factors affecting catastrophic degradation
|
|
|
1977
|
16 |
6 |
p. 659-660
2 p.
|
artikel
|
| 60 |
Gallium arsenide spawns speed
|
|
|
1977
|
16 |
6 |
p. 654-
1 p.
|
artikel
|
| 61 |
Growing pin count is forcing LSI package changes
|
|
|
1977
|
16 |
6 |
p. 654-
1 p.
|
artikel
|
| 62 |
Hazards in combinational circuits
|
|
|
1977
|
16 |
6 |
p. 649-
1 p.
|
artikel
|
| 63 |
Hermetic glass encapsulated capacitors
|
|
|
1977
|
16 |
6 |
p. 644-
1 p.
|
artikel
|
| 64 |
High purity chemicals in semicon production
|
|
|
1977
|
16 |
6 |
p. 654-
1 p.
|
artikel
|
| 65 |
Holographic methods of checking automatic production processes
|
|
|
1977
|
16 |
6 |
p. 645-
1 p.
|
artikel
|
| 66 |
Hybrid microcircuit tape chip carrier materials processing trade-offs
|
|
|
1977
|
16 |
6 |
p. 658-
1 p.
|
artikel
|
| 67 |
IC makers leery about air bags
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 68 |
I2L: A comprehensive review of techniques and technology
|
|
|
1977
|
16 |
6 |
p. 650-
1 p.
|
artikel
|
| 69 |
Improved reliability through dry and hermetic microcircuit packaging
|
|
|
1977
|
16 |
6 |
p. 652-
1 p.
|
artikel
|
| 70 |
Incandescent lamp filaments: facet-cooling, failure mechanisms
|
|
|
1977
|
16 |
6 |
p. 642-
1 p.
|
artikel
|
| 71 |
Indirect interactions between localized magnetic moments in doped semiconductors
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 72 |
Influence of defects in the silicon wafer on the properties of silicon oxide films formed by reactive sputtering
|
|
|
1977
|
16 |
6 |
p. 643-
1 p.
|
artikel
|
| 73 |
Inline production magnetron sputtering
|
|
|
1977
|
16 |
6 |
p. 658-
1 p.
|
artikel
|
| 74 |
Inspecting IC masks with a differential laser scanning inspection system
|
|
|
1977
|
16 |
6 |
p. 659-
1 p.
|
artikel
|
| 75 |
Integrated circuit artwork generation by laser machining
|
|
|
1977
|
16 |
6 |
p. 660-
1 p.
|
artikel
|
| 76 |
International vacuum standardisation
|
|
|
1977
|
16 |
6 |
p. 650-
1 p.
|
artikel
|
| 77 |
Investigation of the Au-Ge-Ni system used for alloyed contacts to GaAs
|
|
|
1977
|
16 |
6 |
p. 654-
1 p.
|
artikel
|
| 78 |
Investigations of metal contacts to amorphous evaporated Ge films
|
|
|
1977
|
16 |
6 |
p. 656-
1 p.
|
artikel
|
| 79 |
Laser scanning of active integrated circuits and discrete semiconductor devices
|
|
|
1977
|
16 |
6 |
p. 660-
1 p.
|
artikel
|
| 80 |
Lead-indium for controlled-collapse chip joining
|
|
|
1977
|
16 |
6 |
p. 653-
1 p.
|
artikel
|
| 81 |
Majority and similarity voting in analogue redundant systems
|
|
|
1977
|
16 |
6 |
p. 649-
1 p.
|
artikel
|
| 82 |
Mechanism and control of post-trim drift of laser trimmed thick film resistors
|
|
|
1977
|
16 |
6 |
p. 659-
1 p.
|
artikel
|
| 83 |
Metallurigical considerations for beam tape assembly
|
|
|
1977
|
16 |
6 |
p. 651-
1 p.
|
artikel
|
| 84 |
Microprocessor tops silicon-on-sapphire line of devices
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 85 |
MOS processor picks up speed with bipolar multipliers
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 86 |
MTBF and yield prediction system
|
|
|
1977
|
16 |
6 |
p. 648-
1 p.
|
artikel
|
| 87 |
MTBF prediction by programmable calculator
|
|
|
1977
|
16 |
6 |
p. 648-
1 p.
|
artikel
|
| 88 |
Multi-valued circuits in fault detection of binary logic circuits
|
|
|
1977
|
16 |
6 |
p. 649-
1 p.
|
artikel
|
| 89 |
New chip carrier package concepts offer unprecedented electronic system flexibility
|
|
|
1977
|
16 |
6 |
p. 652-
1 p.
|
artikel
|
| 90 |
New gold alloy for aluminum bonding in MOS hermetic packages
|
|
|
1977
|
16 |
6 |
p. 652-
1 p.
|
artikel
|
| 91 |
Noise injection as a measure of semiconductor component performance and degradation
|
Ager, D.J.
|
|
1977
|
16 |
6 |
p. 679-687
9 p.
|
artikel
|
| 92 |
Obtaining high reliability performance from commercial quality opto-isolators
|
|
|
1977
|
16 |
6 |
p. 642-
1 p.
|
artikel
|
| 93 |
On availability prediction of complex systems
|
|
|
1977
|
16 |
6 |
p. 649-
1 p.
|
artikel
|
| 94 |
On the behaviour of failure frequency bounds
|
|
|
1977
|
16 |
6 |
p. 645-
1 p.
|
artikel
|
| 95 |
On the reliability of a 3-unit redundant system with two types of repair
|
Khalil, Z.
|
|
1977
|
16 |
6 |
p. 689-690
2 p.
|
artikel
|
| 96 |
Organics used in microelectronics: a review of outgassing materials and efforts
|
|
|
1977
|
16 |
6 |
p. 651-
1 p.
|
artikel
|
| 97 |
Oscillator devices using thick-film technology
|
|
|
1977
|
16 |
6 |
p. 659-
1 p.
|
artikel
|
| 98 |
Phase and amplitude tracking of hybrid RF components
|
|
|
1977
|
16 |
6 |
p. 658-
1 p.
|
artikel
|
| 99 |
Phased mission analysis: a review of new developments and an application
|
|
|
1977
|
16 |
6 |
p. 645-646
2 p.
|
artikel
|
| 100 |
Plastic encapsulated semiconductor devices—A bibliography
|
Taylor, C.H.
|
|
1977
|
16 |
6 |
p. 701-704
4 p.
|
artikel
|
| 101 |
Plastic outgassing induced wire bond failure
|
|
|
1977
|
16 |
6 |
p. 642-
1 p.
|
artikel
|
| 102 |
Plating with ion accelerators
|
|
|
1977
|
16 |
6 |
p. 657-658
2 p.
|
artikel
|
| 103 |
PMR, NDE, design practices; present and future
|
|
|
1977
|
16 |
6 |
p. 648-
1 p.
|
artikel
|
| 104 |
Predicting in-plant test failures
|
|
|
1977
|
16 |
6 |
p. 646-
1 p.
|
artikel
|
| 105 |
Predicting the cost impact of system improvements
|
|
|
1977
|
16 |
6 |
p. 646-647
2 p.
|
artikel
|
| 106 |
Press fit pins in printed circuit boards second test series
|
|
|
1977
|
16 |
6 |
p. 654-
1 p.
|
artikel
|
| 107 |
Process refinements bring C-MOS on sapphire into commercial use
|
|
|
1977
|
16 |
6 |
p. 650-
1 p.
|
artikel
|
| 108 |
Product design liability: An analysis of legal criteria
|
|
|
1977
|
16 |
6 |
p. 645-
1 p.
|
artikel
|
| 109 |
Properties of die bond alloys relating to thermal fatigue
|
|
|
1977
|
16 |
6 |
p. 651-
1 p.
|
artikel
|
| 110 |
Publications, notices, calls for papers, etc.
|
|
|
1977
|
16 |
6 |
p. 631-635
5 p.
|
artikel
|
| 111 |
Quality matters
|
|
|
1977
|
16 |
6 |
p. 641-
1 p.
|
artikel
|
| 112 |
Quantitative models used in the RIW decision process
|
|
|
1977
|
16 |
6 |
p. 648-
1 p.
|
artikel
|
| 113 |
Recent patents on microelectronics
|
|
|
1977
|
16 |
6 |
p. 637-640
4 p.
|
artikel
|
| 114 |
Recursive algorithm for traffic distribution calculation for certain unreliable telephone exchanges
|
|
|
1977
|
16 |
6 |
p. 645-
1 p.
|
artikel
|
| 115 |
Reliability analysis of an m n system with inspections
|
Singh, C.
|
|
1977
|
16 |
6 |
p. 691-697
7 p.
|
artikel
|
| 116 |
Reliability assessment of beam-lead sealed-junction integrated circuits in polymer sealed packages
|
|
|
1977
|
16 |
6 |
p. 642-
1 p.
|
artikel
|
| 117 |
Reliability growth cruves for one shot devices
|
|
|
1977
|
16 |
6 |
p. 648-
1 p.
|
artikel
|
| 118 |
Reliability model and analysis of a system with nonexponential down-time distributions including a derated state
|
|
|
1977
|
16 |
6 |
p. 649-
1 p.
|
artikel
|
| 119 |
Reliability problems in reflow soldering of Ag- and Pd/Ag-terminated chip components
|
|
|
1977
|
16 |
6 |
p. 642-
1 p.
|
artikel
|
| 120 |
Reliability proving for commercial products
|
|
|
1977
|
16 |
6 |
p. 648-
1 p.
|
artikel
|
| 121 |
Reliability study of wire bonds to silver plated surfaces
|
|
|
1977
|
16 |
6 |
p. 642-
1 p.
|
artikel
|
| 122 |
Repair limit suspension policies for a two-unit standby redundant system with two phase repairs
|
|
|
1977
|
16 |
6 |
p. 648-
1 p.
|
artikel
|
| 123 |
Research notes: The effect of carrier temperature on the drift induced instabilities in semiconductor plasmas
|
|
|
1977
|
16 |
6 |
p. 656-
1 p.
|
artikel
|
| 124 |
Residual lattice absorption in gallium arsenide
|
|
|
1977
|
16 |
6 |
p. 656-
1 p.
|
artikel
|
| 125 |
Resistance increases in gold aluminum interconnects with time and temperature
|
|
|
1977
|
16 |
6 |
p. 652-
1 p.
|
artikel
|
| 126 |
RIW experiences at ECOM
|
|
|
1977
|
16 |
6 |
p. 648-
1 p.
|
artikel
|
| 127 |
Silicon films growth in vacuum by pyrolysis of silane
|
|
|
1977
|
16 |
6 |
p. 658-
1 p.
|
artikel
|
| 128 |
Single C-MOS-IC forms pulse-width modulator
|
|
|
1977
|
16 |
6 |
p. 654-
1 p.
|
artikel
|
| 129 |
Small sized plated through connections in flexible cables
|
|
|
1977
|
16 |
6 |
p. 641-
1 p.
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artikel
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| 130 |
Solid state relay status
|
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1977
|
16 |
6 |
p. 644-
1 p.
|
artikel
|
| 131 |
Solving reliability models of nuclear systems
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1977
|
16 |
6 |
p. 647-
1 p.
|
artikel
|
| 132 |
Some electrical properties of amorphous thin-film sandwiches of Cu-BaO (50%)SiO(50%)-Cu
|
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1977
|
16 |
6 |
p. 658-
1 p.
|
artikel
|
| 133 |
Special lot acceptance tests for multilayer ceramic chip capacitors
|
|
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1977
|
16 |
6 |
p. 643-
1 p.
|
artikel
|
| 134 |
Sprint missile subsystem reliability achievements
|
|
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1977
|
16 |
6 |
p. 650-
1 p.
|
artikel
|
| 135 |
Statistical design of R/M experiments
|
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1977
|
16 |
6 |
p. 647-648
2 p.
|
artikel
|
| 136 |
Strict liability or breach of warranty. The patently dangerous doctrine overruled
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|
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1977
|
16 |
6 |
p. 645-
1 p.
|
artikel
|
| 137 |
Surface and bulk electrical conduction in low-deposition-temperature Si3N4 and Al2O3 films for silicon devices
|
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1977
|
16 |
6 |
p. 654-
1 p.
|
artikel
|
| 138 |
System availability and reliability analysis. SARA
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1977
|
16 |
6 |
p. 649-
1 p.
|
artikel
|
| 139 |
Tab lead capacitor
|
|
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1977
|
16 |
6 |
p. 643-
1 p.
|
artikel
|
| 140 |
TAU 1: Un outil pour le test des circuits integres logiques
|
|
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1977
|
16 |
6 |
p. 645-
1 p.
|
artikel
|
| 141 |
The application of reliability methods in electronic instrument design
|
|
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1977
|
16 |
6 |
p. 649-650
2 p.
|
artikel
|
| 142 |
The consideration of reliability in a fully automatic assembly system of small signal transistors
|
|
|
1977
|
16 |
6 |
p. 642-
1 p.
|
artikel
|
| 143 |
The effect of solid state reactions upon solder lap shear strength
|
|
|
1977
|
16 |
6 |
p. 652-
1 p.
|
artikel
|
| 144 |
The effects of emitter impurity concentration on the high-current gain of silicon npn power transistors
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 145 |
The multifacets of I2L
|
|
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1977
|
16 |
6 |
p. 650-
1 p.
|
artikel
|
| 146 |
The nature of negative photoresist scumming. Part 11. NO2 and ozone induced scumming
|
|
|
1977
|
16 |
6 |
p. 653-
1 p.
|
artikel
|
| 147 |
The pn-product in silicon
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 148 |
The production of complex thin film circuits
|
|
|
1977
|
16 |
6 |
p. 658-
1 p.
|
artikel
|
| 149 |
The reliability of thick film capacitors and crossovers
|
|
|
1977
|
16 |
6 |
p. 641-
1 p.
|
artikel
|
| 150 |
Thermal analysis of positive photoresist films by mass spectrometry
|
|
|
1977
|
16 |
6 |
p. 651-
1 p.
|
artikel
|
| 151 |
Thermal analysis of single-crystal silicon ribbon growth processes
|
|
|
1977
|
16 |
6 |
p. 652-653
2 p.
|
artikel
|
| 152 |
Thermal effects on the photoresist AZ1350J
|
|
|
1977
|
16 |
6 |
p. 652-
1 p.
|
artikel
|
| 153 |
Thermally stable tantalum oxide thin film capacitors
|
|
|
1977
|
16 |
6 |
p. 643-
1 p.
|
artikel
|
| 154 |
Thermocompression bonding of copper leads plated with thin gold
|
|
|
1977
|
16 |
6 |
p. 651-
1 p.
|
artikel
|
| 155 |
The splitting of the 1s excitions in silicon
|
|
|
1977
|
16 |
6 |
p. 657-
1 p.
|
artikel
|
| 156 |
The use of acoustic emission in a test for beam-lead, TAB and hybrid chip capacitor bond integrity
|
|
|
1977
|
16 |
6 |
p. 644-
1 p.
|
artikel
|
| 157 |
The versatile technique of RF plasma etching. Part 11—Kinetics of etchant formation
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 158 |
Thin silicon ion-implanted p-i-n photodiodes
|
|
|
1977
|
16 |
6 |
p. 659-
1 p.
|
artikel
|
| 159 |
Thyristor trigger circuit using a 555 IC timer
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 160 |
Universal logic element or “superfunction” arrays
|
|
|
1977
|
16 |
6 |
p. 654-
1 p.
|
artikel
|
| 161 |
Using pattern recognition in product assurance
|
|
|
1977
|
16 |
6 |
p. 647-
1 p.
|
artikel
|
| 162 |
Using procurement incentives for technological innovation
|
|
|
1977
|
16 |
6 |
p. 648-
1 p.
|
artikel
|
| 163 |
Using the ANR 4 4 Automatic Nine-Barrel Repeater in the semiconductor industry
|
|
|
1977
|
16 |
6 |
p. 653-654
2 p.
|
artikel
|
| 164 |
“What ifs” for nuclear plants
|
|
|
1977
|
16 |
6 |
p. 646-
1 p.
|
artikel
|
| 165 |
When and why to use passive chips in hybrid circuits
|
Singh, Awatar
|
|
1977
|
16 |
6 |
p. 705-706
2 p.
|
artikel
|
| 166 |
Where and when to use which data converter
|
|
|
1977
|
16 |
6 |
p. 650-
1 p.
|
artikel
|
| 167 |
Which non-sinusoidal voltage may shorten the life of a capacitor?
|
|
|
1977
|
16 |
6 |
p. 643-
1 p.
|
artikel
|
| 168 |
Wiring algorithms for the computer-aided layout of multilayer hybrid microcircuits
|
|
|
1977
|
16 |
6 |
p. 655-
1 p.
|
artikel
|
| 169 |
XM-712 COPPERHEAD (CLGP) projectile storage reliability verification test program
|
|
|
1977
|
16 |
6 |
p. 650-
1 p.
|
artikel
|
| 170 |
X-ray lithography for IC processing
|
|
|
1977
|
16 |
6 |
p. 651-
1 p.
|
artikel
|
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