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                             170 results found
no title author magazine year volume issue page(s) type
1 A class of distributions useful in life testing and reliability 1977
 16 6 p. 646-
1 p.
 article
2 A cost model for skip-lot destructive sampling 1977
 16 6 p. 644-
1 p.
 article
3 A model for an estimation of the product warranty return rate 1977
 16 6 p. 648-649
2 p.
 article
4 Analyse de la composition des surfaces et des couches minces par diffusion d'ions de brasse energie 1977
 16 6 p. 657-
1 p.
 article
5 An experimental evaluation of thermal performance of DIPs on expoxy metal vs. epoxy glass printed wiring boards 1977
 16 6 p. 653-
1 p.
 article
6 An image method application to multilayer spreading resistance analysis 1977
 16 6 p. 655-656
2 p.
 article
7 An improved management approach to upgrade avionic system reliability 1977
 16 6 p. 646-
1 p.
 article
8 A numerical analysis of various cross sheet resistor test structures 1977
 16 6 p. 655-
1 p.
 article
9 A postal service field evaluation of letter sorting machine keyboards 1977
 16 6 p. 649-
1 p.
 article
10 Applied stresses, cyclotron masses and charge-density-waves in silicon inversion layers 1977
 16 6 p. 657-
1 p.
 article
11 A reliability control tool during manufacturing 1977
 16 6 p. 647-
1 p.
 article
12 A support system life cycle cost model 1977
 16 6 p. 647-
1 p.
 article
13 A survey of published information on universal logic arrays Hurst, S.L.
 1977
 16 6 p. 663-674
12 p.
 article
14 Automated shock in particle impact noise (PIN) testing 1977
 16 6 p. 654-
1 p.
 article
15 Automatic testing of integrated circuits 1977
 16 6 p. 646-
1 p.
 article
16 Behaviour of amorphous Ge contacts to monocrystalline silicon 1977
 16 6 p. 656-
1 p.
 article
17 Calculating the probability of Boolean expression being 1 1977
 16 6 p. 645-
1 p.
 article
18 Calendar of international conferences, symposia, lectures and meetings of interest 1977
 16 6 p. 627-628
2 p.
 article
19 Carrier system for testing and conditioning of beam lead devices 1977
 16 6 p. 653-
1 p.
 article
20 Characterisation of chemical vapour-deposition processes. Part 1 1977
 16 6 p. 656-
1 p.
 article
21 Characterisation of chemical vapour-deposition processes Part II 1977
 16 6 p. 656-
1 p.
 article
22 Chip carriers, lids and sots—an analysis of cost and performance tradeoffs for hybrid applications 1977
 16 6 p. 659-
1 p.
 article
23 CMOS reliability 1977
 16 6 p. 644-
1 p.
 article
24 Component reliability exposed to thermal neutron environment—III Lal, Krishan
 1977
 16 6 p. 675-677
3 p.
 article
25 Composition and stress state of thin films deposited by ion beam sputtering 1977
 16 6 p. 659-
1 p.
 article
26 Computer aided synthesis of fault-trees 1977
 16 6 p. 645-
1 p.
 article
27 Computer program for approximating the reliability characteristics of acyclic directed graphs 1977
 16 6 p. 644-
1 p.
 article
28 Connection between ESR and electrical conduction in amorphous Si films 1977
 16 6 p. 656-
1 p.
 article
29 Contract bid evaluation Reiche, Hans
 1977
 16 6 p. 699-700
2 p.
 article
30 Controlling potential static charge problems 1977
 16 6 p. 641-
1 p.
 article
31 Correlation between thick-film resistance values 1977
 16 6 p. 657-
1 p.
 article
32 Courses 1977
 16 6 p. 629-631
3 p.
 article
33 Demands of LSI are turning chip makers towards automation, production innovations 1977
 16 6 p. 650-
1 p.
 article
34 Depletion—capacitance-induced distortion in surface-channel c.c.d. transversal filters 1977
 16 6 p. 653-
1 p.
 article
35 Depth chemical profiles of MNOS structures measured by AES 1977
 16 6 p. 656-
1 p.
 article
36 Design for reliability in hostile environment 1977
 16 6 p. 649-
1 p.
 article
37 Design of a single-stress relaxation test for pressure connections 1977
 16 6 p. 653-
1 p.
 article
38 Distribution function relaxation times in gallium arsenide 1977
 16 6 p. 655-
1 p.
 article
39 Drain characteristics of thin film MOS FET's 1977
 16 6 p. 658-
1 p.
 article
40 Effect of oxidation on the breakdown characteristics of aluminium diffused junctions 1977
 16 6 p. 643-644
2 p.
 article
41 Effect of temperature-dependent band shifts on semiconductor transport properties 1977
 16 6 p. 656-
1 p.
 article
42 Electrically conductive epoxies for screen printing applications 1977
 16 6 p. 651-
1 p.
 article
43 Electrical properties of thin films-metal-semiconductor contacts. 1. Metal-semiconductor junctions-related to deposition of thin films 1977
 16 6 p. 657-
1 p.
 article
44 Electrical ratings of electronic components from the viewpoint of reliability 1977
 16 6 p. 642-643
2 p.
 article
45 Electromigration and hall effect in cobalt films 1977
 16 6 p. 658-
1 p.
 article
46 Encapsulation, sectioning and examination of multilayer ceramic chip capacitors 1977
 16 6 p. 643-
1 p.
 article
47 Estimating reliability growth 1977
 16 6 p. 646-
1 p.
 article
48 Estimation of mission reliability from multiple independent grouped s censored samples 1977
 16 6 p. 646-
1 p.
 article
49 Extremely uniform thin films by vacuum deposition from a “tube source” 1977
 16 6 p. 657-
1 p.
 article
50 Failure mechanisms in beam lead semiconductors 1977
 16 6 p. 641-
1 p.
 article
51 Failure mechanisms in solid electrolytic capacitors 1977
 16 6 p. 643-
1 p.
 article
52 Failure modes and effects analysis by matrix method 1977
 16 6 p. 647-
1 p.
 article
53 Fast emulator debugs 8085-based microcomputers in real time 1977
 16 6 p. 655-
1 p.
 article
54 Fault simulation and digital circuit testability 1977
 16 6 p. 649-
1 p.
 article
55 Fault substitutes: The true bases for strict liability 1977
 16 6 p. 645-
1 p.
 article
56 Field environmental testing of electronic components Kit, Eliezer
 1977
 16 6 p. 661-
1 p.
 article
57 Fixed-head disk memory unit for high reliability applications 1977
 16 6 p. 647-
1 p.
 article
58 Formation of various metal-semiconductor junctions by means of ion evaporation 1977
 16 6 p. 659-
1 p.
 article
59 Gallium aluminium arsenide heterostructure lasers: factors affecting catastrophic degradation 1977
 16 6 p. 659-660
2 p.
 article
60 Gallium arsenide spawns speed 1977
 16 6 p. 654-
1 p.
 article
61 Growing pin count is forcing LSI package changes 1977
 16 6 p. 654-
1 p.
 article
62 Hazards in combinational circuits 1977
 16 6 p. 649-
1 p.
 article
63 Hermetic glass encapsulated capacitors 1977
 16 6 p. 644-
1 p.
 article
64 High purity chemicals in semicon production 1977
 16 6 p. 654-
1 p.
 article
65 Holographic methods of checking automatic production processes 1977
 16 6 p. 645-
1 p.
 article
66 Hybrid microcircuit tape chip carrier materials processing trade-offs 1977
 16 6 p. 658-
1 p.
 article
67 IC makers leery about air bags 1977
 16 6 p. 655-
1 p.
 article
68 I2L: A comprehensive review of techniques and technology 1977
 16 6 p. 650-
1 p.
 article
69 Improved reliability through dry and hermetic microcircuit packaging 1977
 16 6 p. 652-
1 p.
 article
70 Incandescent lamp filaments: facet-cooling, failure mechanisms 1977
 16 6 p. 642-
1 p.
 article
71 Indirect interactions between localized magnetic moments in doped semiconductors 1977
 16 6 p. 655-
1 p.
 article
72 Influence of defects in the silicon wafer on the properties of silicon oxide films formed by reactive sputtering 1977
 16 6 p. 643-
1 p.
 article
73 Inline production magnetron sputtering 1977
 16 6 p. 658-
1 p.
 article
74 Inspecting IC masks with a differential laser scanning inspection system 1977
 16 6 p. 659-
1 p.
 article
75 Integrated circuit artwork generation by laser machining 1977
 16 6 p. 660-
1 p.
 article
76 International vacuum standardisation 1977
 16 6 p. 650-
1 p.
 article
77 Investigation of the Au-Ge-Ni system used for alloyed contacts to GaAs 1977
 16 6 p. 654-
1 p.
 article
78 Investigations of metal contacts to amorphous evaporated Ge films 1977
 16 6 p. 656-
1 p.
 article
79 Laser scanning of active integrated circuits and discrete semiconductor devices 1977
 16 6 p. 660-
1 p.
 article
80 Lead-indium for controlled-collapse chip joining 1977
 16 6 p. 653-
1 p.
 article
81 Majority and similarity voting in analogue redundant systems 1977
 16 6 p. 649-
1 p.
 article
82 Mechanism and control of post-trim drift of laser trimmed thick film resistors 1977
 16 6 p. 659-
1 p.
 article
83 Metallurigical considerations for beam tape assembly 1977
 16 6 p. 651-
1 p.
 article
84 Microprocessor tops silicon-on-sapphire line of devices 1977
 16 6 p. 655-
1 p.
 article
85 MOS processor picks up speed with bipolar multipliers 1977
 16 6 p. 655-
1 p.
 article
86 MTBF and yield prediction system 1977
 16 6 p. 648-
1 p.
 article
87 MTBF prediction by programmable calculator 1977
 16 6 p. 648-
1 p.
 article
88 Multi-valued circuits in fault detection of binary logic circuits 1977
 16 6 p. 649-
1 p.
 article
89 New chip carrier package concepts offer unprecedented electronic system flexibility 1977
 16 6 p. 652-
1 p.
 article
90 New gold alloy for aluminum bonding in MOS hermetic packages 1977
 16 6 p. 652-
1 p.
 article
91 Noise injection as a measure of semiconductor component performance and degradation Ager, D.J.
 1977
 16 6 p. 679-687
9 p.
 article
92 Obtaining high reliability performance from commercial quality opto-isolators 1977
 16 6 p. 642-
1 p.
 article
93 On availability prediction of complex systems 1977
 16 6 p. 649-
1 p.
 article
94 On the behaviour of failure frequency bounds 1977
 16 6 p. 645-
1 p.
 article
95 On the reliability of a 3-unit redundant system with two types of repair Khalil, Z.
 1977
 16 6 p. 689-690
2 p.
 article
96 Organics used in microelectronics: a review of outgassing materials and efforts 1977
 16 6 p. 651-
1 p.
 article
97 Oscillator devices using thick-film technology 1977
 16 6 p. 659-
1 p.
 article
98 Phase and amplitude tracking of hybrid RF components 1977
 16 6 p. 658-
1 p.
 article
99 Phased mission analysis: a review of new developments and an application 1977
 16 6 p. 645-646
2 p.
 article
100 Plastic encapsulated semiconductor devices—A bibliography Taylor, C.H.
 1977
 16 6 p. 701-704
4 p.
 article
101 Plastic outgassing induced wire bond failure 1977
 16 6 p. 642-
1 p.
 article
102 Plating with ion accelerators 1977
 16 6 p. 657-658
2 p.
 article
103 PMR, NDE, design practices; present and future 1977
 16 6 p. 648-
1 p.
 article
104 Predicting in-plant test failures 1977
 16 6 p. 646-
1 p.
 article
105 Predicting the cost impact of system improvements 1977
 16 6 p. 646-647
2 p.
 article
106 Press fit pins in printed circuit boards second test series 1977
 16 6 p. 654-
1 p.
 article
107 Process refinements bring C-MOS on sapphire into commercial use 1977
 16 6 p. 650-
1 p.
 article
108 Product design liability: An analysis of legal criteria 1977
 16 6 p. 645-
1 p.
 article
109 Properties of die bond alloys relating to thermal fatigue 1977
 16 6 p. 651-
1 p.
 article
110 Publications, notices, calls for papers, etc. 1977
 16 6 p. 631-635
5 p.
 article
111 Quality matters 1977
 16 6 p. 641-
1 p.
 article
112 Quantitative models used in the RIW decision process 1977
 16 6 p. 648-
1 p.
 article
113 Recent patents on microelectronics 1977
 16 6 p. 637-640
4 p.
 article
114 Recursive algorithm for traffic distribution calculation for certain unreliable telephone exchanges 1977
 16 6 p. 645-
1 p.
 article
115 Reliability analysis of an m n system with inspections Singh, C.
 1977
 16 6 p. 691-697
7 p.
 article
116 Reliability assessment of beam-lead sealed-junction integrated circuits in polymer sealed packages 1977
 16 6 p. 642-
1 p.
 article
117 Reliability growth cruves for one shot devices 1977
 16 6 p. 648-
1 p.
 article
118 Reliability model and analysis of a system with nonexponential down-time distributions including a derated state 1977
 16 6 p. 649-
1 p.
 article
119 Reliability problems in reflow soldering of Ag- and Pd/Ag-terminated chip components 1977
 16 6 p. 642-
1 p.
 article
120 Reliability proving for commercial products 1977
 16 6 p. 648-
1 p.
 article
121 Reliability study of wire bonds to silver plated surfaces 1977
 16 6 p. 642-
1 p.
 article
122 Repair limit suspension policies for a two-unit standby redundant system with two phase repairs 1977
 16 6 p. 648-
1 p.
 article
123 Research notes: The effect of carrier temperature on the drift induced instabilities in semiconductor plasmas 1977
 16 6 p. 656-
1 p.
 article
124 Residual lattice absorption in gallium arsenide 1977
 16 6 p. 656-
1 p.
 article
125 Resistance increases in gold aluminum interconnects with time and temperature 1977
 16 6 p. 652-
1 p.
 article
126 RIW experiences at ECOM 1977
 16 6 p. 648-
1 p.
 article
127 Silicon films growth in vacuum by pyrolysis of silane 1977
 16 6 p. 658-
1 p.
 article
128 Single C-MOS-IC forms pulse-width modulator 1977
 16 6 p. 654-
1 p.
 article
129 Small sized plated through connections in flexible cables 1977
 16 6 p. 641-
1 p.
 article
130 Solid state relay status 1977
 16 6 p. 644-
1 p.
 article
131 Solving reliability models of nuclear systems 1977
 16 6 p. 647-
1 p.
 article
132 Some electrical properties of amorphous thin-film sandwiches of Cu-BaO (50%)SiO(50%)-Cu 1977
 16 6 p. 658-
1 p.
 article
133 Special lot acceptance tests for multilayer ceramic chip capacitors 1977
 16 6 p. 643-
1 p.
 article
134 Sprint missile subsystem reliability achievements 1977
 16 6 p. 650-
1 p.
 article
135 Statistical design of R/M experiments 1977
 16 6 p. 647-648
2 p.
 article
136 Strict liability or breach of warranty. The patently dangerous doctrine overruled 1977
 16 6 p. 645-
1 p.
 article
137 Surface and bulk electrical conduction in low-deposition-temperature Si3N4 and Al2O3 films for silicon devices 1977
 16 6 p. 654-
1 p.
 article
138 System availability and reliability analysis. SARA 1977
 16 6 p. 649-
1 p.
 article
139 Tab lead capacitor 1977
 16 6 p. 643-
1 p.
 article
140 TAU 1: Un outil pour le test des circuits integres logiques 1977
 16 6 p. 645-
1 p.
 article
141 The application of reliability methods in electronic instrument design 1977
 16 6 p. 649-650
2 p.
 article
142 The consideration of reliability in a fully automatic assembly system of small signal transistors 1977
 16 6 p. 642-
1 p.
 article
143 The effect of solid state reactions upon solder lap shear strength 1977
 16 6 p. 652-
1 p.
 article
144 The effects of emitter impurity concentration on the high-current gain of silicon npn power transistors 1977
 16 6 p. 655-
1 p.
 article
145 The multifacets of I2L 1977
 16 6 p. 650-
1 p.
 article
146 The nature of negative photoresist scumming. Part 11. NO2 and ozone induced scumming 1977
 16 6 p. 653-
1 p.
 article
147 The pn-product in silicon 1977
 16 6 p. 655-
1 p.
 article
148 The production of complex thin film circuits 1977
 16 6 p. 658-
1 p.
 article
149 The reliability of thick film capacitors and crossovers 1977
 16 6 p. 641-
1 p.
 article
150 Thermal analysis of positive photoresist films by mass spectrometry 1977
 16 6 p. 651-
1 p.
 article
151 Thermal analysis of single-crystal silicon ribbon growth processes 1977
 16 6 p. 652-653
2 p.
 article
152 Thermal effects on the photoresist AZ1350J 1977
 16 6 p. 652-
1 p.
 article
153 Thermally stable tantalum oxide thin film capacitors 1977
 16 6 p. 643-
1 p.
 article
154 Thermocompression bonding of copper leads plated with thin gold 1977
 16 6 p. 651-
1 p.
 article
155 The splitting of the 1s excitions in silicon 1977
 16 6 p. 657-
1 p.
 article
156 The use of acoustic emission in a test for beam-lead, TAB and hybrid chip capacitor bond integrity 1977
 16 6 p. 644-
1 p.
 article
157 The versatile technique of RF plasma etching. Part 11—Kinetics of etchant formation 1977
 16 6 p. 655-
1 p.
 article
158 Thin silicon ion-implanted p-i-n photodiodes 1977
 16 6 p. 659-
1 p.
 article
159 Thyristor trigger circuit using a 555 IC timer 1977
 16 6 p. 655-
1 p.
 article
160 Universal logic element or “superfunction” arrays 1977
 16 6 p. 654-
1 p.
 article
161 Using pattern recognition in product assurance 1977
 16 6 p. 647-
1 p.
 article
162 Using procurement incentives for technological innovation 1977
 16 6 p. 648-
1 p.
 article
163 Using the ANR 4 4 Automatic Nine-Barrel Repeater in the semiconductor industry 1977
 16 6 p. 653-654
2 p.
 article
164 “What ifs” for nuclear plants 1977
 16 6 p. 646-
1 p.
 article
165 When and why to use passive chips in hybrid circuits Singh, Awatar
 1977
 16 6 p. 705-706
2 p.
 article
166 Where and when to use which data converter 1977
 16 6 p. 650-
1 p.
 article
167 Which non-sinusoidal voltage may shorten the life of a capacitor? 1977
 16 6 p. 643-
1 p.
 article
168 Wiring algorithms for the computer-aided layout of multilayer hybrid microcircuits 1977
 16 6 p. 655-
1 p.
 article
169 XM-712 COPPERHEAD (CLGP) projectile storage reliability verification test program 1977
 16 6 p. 650-
1 p.
 article
170 X-ray lithography for IC processing 1977
 16 6 p. 651-
1 p.
 article
                             170 results found
 
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