| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A bibliography on charge-coupled devices
|
|
|
1976
|
15 |
5 |
p. 377-
1 p.
|
artikel
|
| 2 |
A burn-in programme for wearout unaffected equipments
|
|
|
1976
|
15 |
5 |
p. 375-
1 p.
|
artikel
|
| 3 |
Accelerated vibration fatigue life testing of leads and soldered joints
|
|
|
1976
|
15 |
5 |
p. 372-
1 p.
|
artikel
|
| 4 |
A contractor view of warranty contracting
|
|
|
1976
|
15 |
5 |
p. 371-
1 p.
|
artikel
|
| 5 |
Adhesion measurement of thin films
|
|
|
1976
|
15 |
5 |
p. 381-382
2 p.
|
artikel
|
| 6 |
A low-power circuit block for digital telephone exchanges
|
|
|
1976
|
15 |
5 |
p. 378-
1 p.
|
artikel
|
| 7 |
A manufacturing reliability program for xerographic copying machines
|
Douglas Ekings, J.
|
|
1976
|
15 |
5 |
p. 437-450
14 p.
|
artikel
|
| 8 |
A many-state Markov model for computer software performance parameters
|
|
|
1976
|
15 |
5 |
p. 375-
1 p.
|
artikel
|
| 9 |
A method for calculation of network reliability
|
|
|
1976
|
15 |
5 |
p. 376-
1 p.
|
artikel
|
| 10 |
A method of grading mica for use in high-reliability capacitors
|
|
|
1976
|
15 |
5 |
p. 373-374
2 p.
|
artikel
|
| 11 |
A MOS model for computer-aided design
|
|
|
1976
|
15 |
5 |
p. 377-
1 p.
|
artikel
|
| 12 |
An active R filter using CMOS transistor arrays
|
|
|
1976
|
15 |
5 |
p. 378-379
2 p.
|
artikel
|
| 13 |
Analysis of a repairable system which operates at discrete times
|
|
|
1976
|
15 |
5 |
p. 375-
1 p.
|
artikel
|
| 14 |
Analysis of a three-state system with two types of components
|
|
|
1976
|
15 |
5 |
p. 374-
1 p.
|
artikel
|
| 15 |
Analysis of implanted layers by means of secondary ion mass spectrometry (SIMS)
|
|
|
1976
|
15 |
5 |
p. 384-
1 p.
|
artikel
|
| 16 |
An evaluation of exponential and Weibull test plans
|
|
|
1976
|
15 |
5 |
p. 371-
1 p.
|
artikel
|
| 17 |
An experimental investigation of the dielectric properties of thermally evaporated rare earth oxides for use in thin-film capacitors
|
|
|
1976
|
15 |
5 |
p. 381-
1 p.
|
artikel
|
| 18 |
An integrated channel selector for VHF/UHF
|
|
|
1976
|
15 |
5 |
p. 501-502
2 p.
|
artikel
|
| 19 |
A note on a four-state system
|
Dhillon, Balbir S.
|
|
1976
|
15 |
5 |
p. 491-492
2 p.
|
artikel
|
| 20 |
Application of the ion-implantation technology to the production of varicap (varactor) diodes
|
|
|
1976
|
15 |
5 |
p. 383-
1 p.
|
artikel
|
| 21 |
Application of thermal analysis to the semiconductor plastic package thermal shock testing reliability
|
Ritchie, Kim
|
|
1976
|
15 |
5 |
p. 489-490
2 p.
|
artikel
|
| 22 |
Applications of ion-implantation in semiconductor devices
|
|
|
1976
|
15 |
5 |
p. 383-
1 p.
|
artikel
|
| 23 |
A production reactor for low temperature plasma-enhanced silicon nitride deposition
|
|
|
1976
|
15 |
5 |
p. 380-
1 p.
|
artikel
|
| 24 |
A review of fault detection methods for large system
|
|
|
1976
|
15 |
5 |
p. 376-
1 p.
|
artikel
|
| 25 |
A six-state system model
|
|
|
1976
|
15 |
5 |
p. 376-
1 p.
|
artikel
|
| 26 |
A survey of plasma-etching processes
|
|
|
1976
|
15 |
5 |
p. 378-
1 p.
|
artikel
|
| 27 |
A systems approach to condition monitoring
|
|
|
1976
|
15 |
5 |
p. 374-375
2 p.
|
artikel
|
| 28 |
Automatic alignment considerations in wafer fabrication
|
|
|
1976
|
15 |
5 |
p. 377-
1 p.
|
artikel
|
| 29 |
Availability of repairable units when failure and restoration rates age in real time
|
|
|
1976
|
15 |
5 |
p. 376-
1 p.
|
artikel
|
| 30 |
Bayesian decomposition method for computing the reliability of an oriented network
|
|
|
1976
|
15 |
5 |
p. 377-
1 p.
|
artikel
|
| 31 |
Best estimates of functions of the parameters of the Gaussian and gamma distributions
|
|
|
1976
|
15 |
5 |
p. 374-
1 p.
|
artikel
|
| 32 |
Bipolar bit slices advance fast
|
|
|
1976
|
15 |
5 |
p. 377-
1 p.
|
artikel
|
| 33 |
Calculation of lattice dynamical properties from electronic energies. Application to C, Si and Ge
|
|
|
1976
|
15 |
5 |
p. 380-
1 p.
|
artikel
|
| 34 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1976
|
15 |
5 |
p. 357-358
2 p.
|
artikel
|
| 35 |
Characteristics of an ion-implantation set-up for research
|
|
|
1976
|
15 |
5 |
p. 383-
1 p.
|
artikel
|
| 36 |
Charge coupled devices—Basic operation and principles
|
Arora, R.K.
|
|
1976
|
15 |
5 |
p. 475-483
9 p.
|
artikel
|
| 37 |
Choosing sides in digital watch technology
|
|
|
1976
|
15 |
5 |
p. 377-
1 p.
|
artikel
|
| 38 |
Comparison of DPA results on electronic components
|
|
|
1976
|
15 |
5 |
p. 373-
1 p.
|
artikel
|
| 39 |
Computer algorithm to determine MOS process-parameters
|
|
|
1976
|
15 |
5 |
p. 378-
1 p.
|
artikel
|
| 40 |
Copper tape set to carry IC chips
|
|
|
1976
|
15 |
5 |
p. 377-378
2 p.
|
artikel
|
| 41 |
Cost reliability trade off in an electronic module
|
Surendran, K.
|
|
1976
|
15 |
5 |
p. 493-496
4 p.
|
artikel
|
| 42 |
Current emission from sandwich metal layers Al-Al2O3-Au
|
|
|
1976
|
15 |
5 |
p. 380-
1 p.
|
artikel
|
| 43 |
Design for reliability
|
Dryden, M.H.
|
|
1976
|
15 |
5 |
p. 399-436
38 p.
|
artikel
|
| 44 |
Determination of temperature of integrated-circuit chips in hybrid packaging
|
|
|
1976
|
15 |
5 |
p. 379-
1 p.
|
artikel
|
| 45 |
Development of bubble memory chip test system
|
|
|
1976
|
15 |
5 |
p. 378-
1 p.
|
artikel
|
| 46 |
Dielectric breakdown properties in silicon dioxide films
|
|
|
1976
|
15 |
5 |
p. 381-
1 p.
|
artikel
|
| 47 |
Dielectric isolation techniques for integrated circuits
|
|
|
1976
|
15 |
5 |
p. 378-
1 p.
|
artikel
|
| 48 |
Distribution of a random variable defined through a constitutive equation
|
|
|
1976
|
15 |
5 |
p. 376-
1 p.
|
artikel
|
| 49 |
Distribution profiles of boron-implanted layers in silicon using a high resolution anodic oxidation cell
|
|
|
1976
|
15 |
5 |
p. 383-
1 p.
|
artikel
|
| 50 |
Doped silicon oxide as diffusion source
|
|
|
1976
|
15 |
5 |
p. 379-
1 p.
|
artikel
|
| 51 |
Doping uniformity and reproducibility of ion implanted wafers
|
|
|
1976
|
15 |
5 |
p. 383-
1 p.
|
artikel
|
| 52 |
Dynamic inspection of large scale integrated circuits
|
|
|
1976
|
15 |
5 |
p. 374-
1 p.
|
artikel
|
| 53 |
Effect of standby redundancy on system reliability
|
|
|
1976
|
15 |
5 |
p. 376-
1 p.
|
artikel
|
| 54 |
Eight-bit microprocessor aims at control applications
|
|
|
1976
|
15 |
5 |
p. 379-
1 p.
|
artikel
|
| 55 |
Electroless NiP processing for hybrid integrated circuits
|
|
|
1976
|
15 |
5 |
p. 381-
1 p.
|
artikel
|
| 56 |
Electron-beam lithography for microcircuit fabrication
|
|
|
1976
|
15 |
5 |
p. 384-
1 p.
|
artikel
|
| 57 |
Electron transport mechanisms in very thin Al2O3 films
|
|
|
1976
|
15 |
5 |
p. 381-
1 p.
|
artikel
|
| 58 |
Electrostatic discharge in microcircuits
|
|
|
1976
|
15 |
5 |
p. 372-
1 p.
|
artikel
|
| 59 |
Electrostatics in the electronics environment
|
G.W.A.D.,
|
|
1976
|
15 |
5 |
p. 370-
1 p.
|
artikel
|
| 60 |
Epitaxie par jets moleculaires
|
|
|
1976
|
15 |
5 |
p. 380-
1 p.
|
artikel
|
| 61 |
Evaluation of technology options for LSI processing elements
|
|
|
1976
|
15 |
5 |
p. 378-
1 p.
|
artikel
|
| 62 |
Evolution of the characteristics and performances of implantation machines
|
|
|
1976
|
15 |
5 |
p. 383-
1 p.
|
artikel
|
| 63 |
Factors in balancing government and contractors risk with warranties
|
|
|
1976
|
15 |
5 |
p. 371-
1 p.
|
artikel
|
| 64 |
Failure mechanisms in wet tantalum capacitors
|
|
|
1976
|
15 |
5 |
p. 373-
1 p.
|
artikel
|
| 65 |
Failure rate analysis of Goddard Space Flight Center spacecraft performance during orbital life
|
|
|
1976
|
15 |
5 |
p. 376-
1 p.
|
artikel
|
| 66 |
Failure review board—a management tool for producibility and profit
|
|
|
1976
|
15 |
5 |
p. 371-
1 p.
|
artikel
|
| 67 |
Fault isolation of electronic control systems
|
|
|
1976
|
15 |
5 |
p. 375-376
2 p.
|
artikel
|
| 68 |
Fluid abrasive trimming of thin-film resistors
|
|
|
1976
|
15 |
5 |
p. 382-
1 p.
|
artikel
|
| 69 |
Formation of impurity atmospheres in Cu-Ge alloy studies by positron annihilation
|
|
|
1976
|
15 |
5 |
p. 380-
1 p.
|
artikel
|
| 70 |
Government depot maintenance warranties
|
|
|
1976
|
15 |
5 |
p. 371-
1 p.
|
artikel
|
| 71 |
Handbook of thick film technology
|
G.W.A.D.,
|
|
1976
|
15 |
5 |
p. 369-370
2 p.
|
artikel
|
| 72 |
Heating in polyethylene terephthalate film AC capacitors
|
|
|
1976
|
15 |
5 |
p. 373-
1 p.
|
artikel
|
| 73 |
High energy in scattering as a tool for studying ion-implantation
|
|
|
1976
|
15 |
5 |
p. 384-
1 p.
|
artikel
|
| 74 |
High reliability Ta/Al thin-film hybrid circuits
|
|
|
1976
|
15 |
5 |
p. 382-
1 p.
|
artikel
|
| 75 |
High temp. burn-in and its effects on reliability
|
|
|
1976
|
15 |
5 |
p. 374-
1 p.
|
artikel
|
| 76 |
Hybrid circuit technology keeps rolling along
|
|
|
1976
|
15 |
5 |
p. 382-
1 p.
|
artikel
|
| 77 |
Implementation of the design to cost concept
|
|
|
1976
|
15 |
5 |
p. 375-
1 p.
|
artikel
|
| 78 |
Influence of low lifetime regions on recombination in high lifetime regions of semiconductors
|
|
|
1976
|
15 |
5 |
p. 379-380
2 p.
|
artikel
|
| 79 |
InSb-diffused junction diodes
|
|
|
1976
|
15 |
5 |
p. 380-
1 p.
|
artikel
|
| 80 |
Instability phenomena in thin insulating films on silicon
|
Singh, B.R.
|
|
1976
|
15 |
5 |
p. 385-398
14 p.
|
artikel
|
| 81 |
Integrated microwave transistor amplifiers
|
|
|
1976
|
15 |
5 |
p. 378-
1 p.
|
artikel
|
| 82 |
Interface between maintainability and commercial aircraft spares support
|
|
|
1976
|
15 |
5 |
p. 376-
1 p.
|
artikel
|
| 83 |
Ion implantation in II–VI semiconductors
|
|
|
1976
|
15 |
5 |
p. 384-
1 p.
|
artikel
|
| 84 |
Ion implantation into GaAs and related compounds
|
|
|
1976
|
15 |
5 |
p. 384-
1 p.
|
artikel
|
| 85 |
Island trip boosts reliability
|
|
|
1976
|
15 |
5 |
p. 375-
1 p.
|
artikel
|
| 86 |
Is maintainability keeping up with electronics?
|
|
|
1976
|
15 |
5 |
p. 374-
1 p.
|
artikel
|
| 87 |
Just how reliable are plastic encapsulated semiconductors for military applications and how can the maximum reliability be obtained?
|
|
|
1976
|
15 |
5 |
p. 373-
1 p.
|
artikel
|
| 88 |
Long-term life-tests of industrial power thyristors (SCR's) over 50,000 hr
|
|
|
1976
|
15 |
5 |
p. 372-373
2 p.
|
artikel
|
| 89 |
Microcomputer reliability improvement using triple-modular redundancy
|
|
|
1976
|
15 |
5 |
p. 375-
1 p.
|
artikel
|
| 90 |
Microprocessors and integrated electronic technology
|
|
|
1976
|
15 |
5 |
p. 378-
1 p.
|
artikel
|
| 91 |
More and more on less and less
|
|
|
1976
|
15 |
5 |
p. 377-
1 p.
|
artikel
|
| 92 |
MOS moves into higher-power applications
|
|
|
1976
|
15 |
5 |
p. 378-
1 p.
|
artikel
|
| 93 |
New wafer alignment technique
|
|
|
1976
|
15 |
5 |
p. 377-
1 p.
|
artikel
|
| 94 |
Nomograms for the design of reliability acceptance plans
|
|
|
1976
|
15 |
5 |
p. 374-
1 p.
|
artikel
|
| 95 |
Observed failure rates of electronic components in computer systems
|
|
|
1976
|
15 |
5 |
p. 372-
1 p.
|
artikel
|
| 96 |
On the mechanism of indirect band to band recombination in germanium electron-hole drops
|
|
|
1976
|
15 |
5 |
p. 379-
1 p.
|
artikel
|
| 97 |
On the reliability analysis of complex systems
|
Colombo, A.G.
|
|
1976
|
15 |
5 |
p. 459-467
9 p.
|
artikel
|
| 98 |
Photomask/resist capability—An approach to assessment
|
Volk, Charles E.
|
|
1976
|
15 |
5 |
p. 469-474
6 p.
|
artikel
|
| 99 |
Photo-thermal probing of Si-SiO2 surface centres—II. Experiment
|
|
|
1976
|
15 |
5 |
p. 379-
1 p.
|
artikel
|
| 100 |
Photo-thermal probing of Si-SiO2 surface centres—I. Theory
|
|
|
1976
|
15 |
5 |
p. 380-
1 p.
|
artikel
|
| 101 |
Physical aspects of ion-implantation
|
|
|
1976
|
15 |
5 |
p. 384-
1 p.
|
artikel
|
| 102 |
Plasma processing at moderate vacuum
|
|
|
1976
|
15 |
5 |
p. 380-381
2 p.
|
artikel
|
| 103 |
Prediction of future failures of a system
|
Lwin, T.
|
|
1976
|
15 |
5 |
p. 485-488
4 p.
|
artikel
|
| 104 |
Present and future programme related to high reliability parts in Europe
|
|
|
1976
|
15 |
5 |
p. 372-
1 p.
|
artikel
|
| 105 |
Prevention of liquid-metal embrittlement and stress-corrosion cracking in Kovar leads
|
|
|
1976
|
15 |
5 |
p. 373-
1 p.
|
artikel
|
| 106 |
Processor family specialises in dedicated control
|
|
|
1976
|
15 |
5 |
p. 379-
1 p.
|
artikel
|
| 107 |
Publications, notices, calls for papers, etc.
|
|
|
1976
|
15 |
5 |
p. 359-367
9 p.
|
artikel
|
| 108 |
Raman study of implanted semiconductors
|
|
|
1976
|
15 |
5 |
p. 381-
1 p.
|
artikel
|
| 109 |
Recent advances in ion implantation—a state of the art review
|
|
|
1976
|
15 |
5 |
p. 383-
1 p.
|
artikel
|
| 110 |
Reliability calculation of redundant systems with non-identical units
|
|
|
1976
|
15 |
5 |
p. 376-377
2 p.
|
artikel
|
| 111 |
Reliability growth management of SATCOM terminals
|
|
|
1976
|
15 |
5 |
p. 375-
1 p.
|
artikel
|
| 112 |
Reliability modelling algorithms for a class of large repairable systems
|
|
|
1976
|
15 |
5 |
p. 375-
1 p.
|
artikel
|
| 113 |
Reliability of copper-plated through-hole printed wiring board
|
|
|
1976
|
15 |
5 |
p. 373-
1 p.
|
artikel
|
| 114 |
Reliability of thin film conductors and air gap crossovers for hybrid circuits: Tests, results and design criteria
|
Piacentini, G.F.
|
|
1976
|
15 |
5 |
p. 451-458
8 p.
|
artikel
|
| 115 |
Repairing faults in plated through-holes
|
|
|
1976
|
15 |
5 |
p. 372-
1 p.
|
artikel
|
| 116 |
R.F. relaxation oscillations in polycrystalline TiO2 thin films
|
|
|
1976
|
15 |
5 |
p. 382-
1 p.
|
artikel
|
| 117 |
Right-censored, grouped life test data analysis assuming a two-parameter Weibull distribution function
|
Chace, E.F.
|
|
1976
|
15 |
5 |
p. 497-499
3 p.
|
artikel
|
| 118 |
Silicon p-n insulator-metal (p-n-I-M) devices
|
|
|
1976
|
15 |
5 |
p. 381-
1 p.
|
artikel
|
| 119 |
Silicon wafer technology—state of the art 1976
|
|
|
1976
|
15 |
5 |
p. 377-
1 p.
|
artikel
|
| 120 |
Some applications of ion-implantation in materials
|
|
|
1976
|
15 |
5 |
p. 383-
1 p.
|
artikel
|
| 121 |
Some properties of ion-implanted p-n junctions in silicon
|
|
|
1976
|
15 |
5 |
p. 383-
1 p.
|
artikel
|
| 122 |
Stacking faults in silicon epitaxial layers
|
|
|
1976
|
15 |
5 |
p. 380-
1 p.
|
artikel
|
| 123 |
Statistical interpretation of meniscograph solderability tests
|
|
|
1976
|
15 |
5 |
p. 382-
1 p.
|
artikel
|
| 124 |
Steady-state profit in a 2-unit standby system
|
|
|
1976
|
15 |
5 |
p. 376-
1 p.
|
artikel
|
| 125 |
Surface arcover in D.C. capacitors
|
|
|
1976
|
15 |
5 |
p. 372-
1 p.
|
artikel
|
| 126 |
Systems analysis by sequential fault trees
|
|
|
1976
|
15 |
5 |
p. 377-
1 p.
|
artikel
|
| 127 |
Techniques of adjusting thin- and thick-film resistors in hybrid microelectronic circuits
|
|
|
1976
|
15 |
5 |
p. 382-
1 p.
|
artikel
|
| 128 |
Test system checks microprocessors and LSI memories
|
|
|
1976
|
15 |
5 |
p. 378-
1 p.
|
artikel
|
| 129 |
The assurance of quality and reliability
|
|
|
1976
|
15 |
5 |
p. 374-
1 p.
|
artikel
|
| 130 |
The configuration-based approach for 3d impurities in palladium and platinum
|
|
|
1976
|
15 |
5 |
p. 379-
1 p.
|
artikel
|
| 131 |
The present status of microelectronics
|
Ingram-Cotton, John
|
|
1976
|
15 |
5 |
p. 355-356
2 p.
|
artikel
|
| 132 |
Thermal emission rates and activation energies of electrons at tantalum centres in silicon
|
|
|
1976
|
15 |
5 |
p. 380-
1 p.
|
artikel
|
| 133 |
Thick-film hybrid techniques offer new hope for the blind
|
|
|
1976
|
15 |
5 |
p. 382-
1 p.
|
artikel
|
| 134 |
Thin-film deposition techniques and design of thin-film passive components
|
|
|
1976
|
15 |
5 |
p. 382-
1 p.
|
artikel
|
| 135 |
Tri-pyramids in silicon epitaxial layers
|
|
|
1976
|
15 |
5 |
p. 379-
1 p.
|
artikel
|
| 136 |
When is goods inward testing necessary?
|
|
|
1976
|
15 |
5 |
p. 371-
1 p.
|
artikel
|
Tijdschrift beschrijving