nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A bibliography on charge-coupled devices
|
|
|
1976 |
15 |
5 |
p. 377- 1 p. |
artikel |
2 |
A burn-in programme for wearout unaffected equipments
|
|
|
1976 |
15 |
5 |
p. 375- 1 p. |
artikel |
3 |
Accelerated vibration fatigue life testing of leads and soldered joints
|
|
|
1976 |
15 |
5 |
p. 372- 1 p. |
artikel |
4 |
A contractor view of warranty contracting
|
|
|
1976 |
15 |
5 |
p. 371- 1 p. |
artikel |
5 |
Adhesion measurement of thin films
|
|
|
1976 |
15 |
5 |
p. 381-382 2 p. |
artikel |
6 |
A low-power circuit block for digital telephone exchanges
|
|
|
1976 |
15 |
5 |
p. 378- 1 p. |
artikel |
7 |
A manufacturing reliability program for xerographic copying machines
|
Douglas Ekings, J. |
|
1976 |
15 |
5 |
p. 437-450 14 p. |
artikel |
8 |
A many-state Markov model for computer software performance parameters
|
|
|
1976 |
15 |
5 |
p. 375- 1 p. |
artikel |
9 |
A method for calculation of network reliability
|
|
|
1976 |
15 |
5 |
p. 376- 1 p. |
artikel |
10 |
A method of grading mica for use in high-reliability capacitors
|
|
|
1976 |
15 |
5 |
p. 373-374 2 p. |
artikel |
11 |
A MOS model for computer-aided design
|
|
|
1976 |
15 |
5 |
p. 377- 1 p. |
artikel |
12 |
An active R filter using CMOS transistor arrays
|
|
|
1976 |
15 |
5 |
p. 378-379 2 p. |
artikel |
13 |
Analysis of a repairable system which operates at discrete times
|
|
|
1976 |
15 |
5 |
p. 375- 1 p. |
artikel |
14 |
Analysis of a three-state system with two types of components
|
|
|
1976 |
15 |
5 |
p. 374- 1 p. |
artikel |
15 |
Analysis of implanted layers by means of secondary ion mass spectrometry (SIMS)
|
|
|
1976 |
15 |
5 |
p. 384- 1 p. |
artikel |
16 |
An evaluation of exponential and Weibull test plans
|
|
|
1976 |
15 |
5 |
p. 371- 1 p. |
artikel |
17 |
An experimental investigation of the dielectric properties of thermally evaporated rare earth oxides for use in thin-film capacitors
|
|
|
1976 |
15 |
5 |
p. 381- 1 p. |
artikel |
18 |
An integrated channel selector for VHF/UHF
|
|
|
1976 |
15 |
5 |
p. 501-502 2 p. |
artikel |
19 |
A note on a four-state system
|
Dhillon, Balbir S. |
|
1976 |
15 |
5 |
p. 491-492 2 p. |
artikel |
20 |
Application of the ion-implantation technology to the production of varicap (varactor) diodes
|
|
|
1976 |
15 |
5 |
p. 383- 1 p. |
artikel |
21 |
Application of thermal analysis to the semiconductor plastic package thermal shock testing reliability
|
Ritchie, Kim |
|
1976 |
15 |
5 |
p. 489-490 2 p. |
artikel |
22 |
Applications of ion-implantation in semiconductor devices
|
|
|
1976 |
15 |
5 |
p. 383- 1 p. |
artikel |
23 |
A production reactor for low temperature plasma-enhanced silicon nitride deposition
|
|
|
1976 |
15 |
5 |
p. 380- 1 p. |
artikel |
24 |
A review of fault detection methods for large system
|
|
|
1976 |
15 |
5 |
p. 376- 1 p. |
artikel |
25 |
A six-state system model
|
|
|
1976 |
15 |
5 |
p. 376- 1 p. |
artikel |
26 |
A survey of plasma-etching processes
|
|
|
1976 |
15 |
5 |
p. 378- 1 p. |
artikel |
27 |
A systems approach to condition monitoring
|
|
|
1976 |
15 |
5 |
p. 374-375 2 p. |
artikel |
28 |
Automatic alignment considerations in wafer fabrication
|
|
|
1976 |
15 |
5 |
p. 377- 1 p. |
artikel |
29 |
Availability of repairable units when failure and restoration rates age in real time
|
|
|
1976 |
15 |
5 |
p. 376- 1 p. |
artikel |
30 |
Bayesian decomposition method for computing the reliability of an oriented network
|
|
|
1976 |
15 |
5 |
p. 377- 1 p. |
artikel |
31 |
Best estimates of functions of the parameters of the Gaussian and gamma distributions
|
|
|
1976 |
15 |
5 |
p. 374- 1 p. |
artikel |
32 |
Bipolar bit slices advance fast
|
|
|
1976 |
15 |
5 |
p. 377- 1 p. |
artikel |
33 |
Calculation of lattice dynamical properties from electronic energies. Application to C, Si and Ge
|
|
|
1976 |
15 |
5 |
p. 380- 1 p. |
artikel |
34 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1976 |
15 |
5 |
p. 357-358 2 p. |
artikel |
35 |
Characteristics of an ion-implantation set-up for research
|
|
|
1976 |
15 |
5 |
p. 383- 1 p. |
artikel |
36 |
Charge coupled devices—Basic operation and principles
|
Arora, R.K. |
|
1976 |
15 |
5 |
p. 475-483 9 p. |
artikel |
37 |
Choosing sides in digital watch technology
|
|
|
1976 |
15 |
5 |
p. 377- 1 p. |
artikel |
38 |
Comparison of DPA results on electronic components
|
|
|
1976 |
15 |
5 |
p. 373- 1 p. |
artikel |
39 |
Computer algorithm to determine MOS process-parameters
|
|
|
1976 |
15 |
5 |
p. 378- 1 p. |
artikel |
40 |
Copper tape set to carry IC chips
|
|
|
1976 |
15 |
5 |
p. 377-378 2 p. |
artikel |
41 |
Cost reliability trade off in an electronic module
|
Surendran, K. |
|
1976 |
15 |
5 |
p. 493-496 4 p. |
artikel |
42 |
Current emission from sandwich metal layers Al-Al2O3-Au
|
|
|
1976 |
15 |
5 |
p. 380- 1 p. |
artikel |
43 |
Design for reliability
|
Dryden, M.H. |
|
1976 |
15 |
5 |
p. 399-436 38 p. |
artikel |
44 |
Determination of temperature of integrated-circuit chips in hybrid packaging
|
|
|
1976 |
15 |
5 |
p. 379- 1 p. |
artikel |
45 |
Development of bubble memory chip test system
|
|
|
1976 |
15 |
5 |
p. 378- 1 p. |
artikel |
46 |
Dielectric breakdown properties in silicon dioxide films
|
|
|
1976 |
15 |
5 |
p. 381- 1 p. |
artikel |
47 |
Dielectric isolation techniques for integrated circuits
|
|
|
1976 |
15 |
5 |
p. 378- 1 p. |
artikel |
48 |
Distribution of a random variable defined through a constitutive equation
|
|
|
1976 |
15 |
5 |
p. 376- 1 p. |
artikel |
49 |
Distribution profiles of boron-implanted layers in silicon using a high resolution anodic oxidation cell
|
|
|
1976 |
15 |
5 |
p. 383- 1 p. |
artikel |
50 |
Doped silicon oxide as diffusion source
|
|
|
1976 |
15 |
5 |
p. 379- 1 p. |
artikel |
51 |
Doping uniformity and reproducibility of ion implanted wafers
|
|
|
1976 |
15 |
5 |
p. 383- 1 p. |
artikel |
52 |
Dynamic inspection of large scale integrated circuits
|
|
|
1976 |
15 |
5 |
p. 374- 1 p. |
artikel |
53 |
Effect of standby redundancy on system reliability
|
|
|
1976 |
15 |
5 |
p. 376- 1 p. |
artikel |
54 |
Eight-bit microprocessor aims at control applications
|
|
|
1976 |
15 |
5 |
p. 379- 1 p. |
artikel |
55 |
Electroless NiP processing for hybrid integrated circuits
|
|
|
1976 |
15 |
5 |
p. 381- 1 p. |
artikel |
56 |
Electron-beam lithography for microcircuit fabrication
|
|
|
1976 |
15 |
5 |
p. 384- 1 p. |
artikel |
57 |
Electron transport mechanisms in very thin Al2O3 films
|
|
|
1976 |
15 |
5 |
p. 381- 1 p. |
artikel |
58 |
Electrostatic discharge in microcircuits
|
|
|
1976 |
15 |
5 |
p. 372- 1 p. |
artikel |
59 |
Electrostatics in the electronics environment
|
G.W.A.D., |
|
1976 |
15 |
5 |
p. 370- 1 p. |
artikel |
60 |
Epitaxie par jets moleculaires
|
|
|
1976 |
15 |
5 |
p. 380- 1 p. |
artikel |
61 |
Evaluation of technology options for LSI processing elements
|
|
|
1976 |
15 |
5 |
p. 378- 1 p. |
artikel |
62 |
Evolution of the characteristics and performances of implantation machines
|
|
|
1976 |
15 |
5 |
p. 383- 1 p. |
artikel |
63 |
Factors in balancing government and contractors risk with warranties
|
|
|
1976 |
15 |
5 |
p. 371- 1 p. |
artikel |
64 |
Failure mechanisms in wet tantalum capacitors
|
|
|
1976 |
15 |
5 |
p. 373- 1 p. |
artikel |
65 |
Failure rate analysis of Goddard Space Flight Center spacecraft performance during orbital life
|
|
|
1976 |
15 |
5 |
p. 376- 1 p. |
artikel |
66 |
Failure review board—a management tool for producibility and profit
|
|
|
1976 |
15 |
5 |
p. 371- 1 p. |
artikel |
67 |
Fault isolation of electronic control systems
|
|
|
1976 |
15 |
5 |
p. 375-376 2 p. |
artikel |
68 |
Fluid abrasive trimming of thin-film resistors
|
|
|
1976 |
15 |
5 |
p. 382- 1 p. |
artikel |
69 |
Formation of impurity atmospheres in Cu-Ge alloy studies by positron annihilation
|
|
|
1976 |
15 |
5 |
p. 380- 1 p. |
artikel |
70 |
Government depot maintenance warranties
|
|
|
1976 |
15 |
5 |
p. 371- 1 p. |
artikel |
71 |
Handbook of thick film technology
|
G.W.A.D., |
|
1976 |
15 |
5 |
p. 369-370 2 p. |
artikel |
72 |
Heating in polyethylene terephthalate film AC capacitors
|
|
|
1976 |
15 |
5 |
p. 373- 1 p. |
artikel |
73 |
High energy in scattering as a tool for studying ion-implantation
|
|
|
1976 |
15 |
5 |
p. 384- 1 p. |
artikel |
74 |
High reliability Ta/Al thin-film hybrid circuits
|
|
|
1976 |
15 |
5 |
p. 382- 1 p. |
artikel |
75 |
High temp. burn-in and its effects on reliability
|
|
|
1976 |
15 |
5 |
p. 374- 1 p. |
artikel |
76 |
Hybrid circuit technology keeps rolling along
|
|
|
1976 |
15 |
5 |
p. 382- 1 p. |
artikel |
77 |
Implementation of the design to cost concept
|
|
|
1976 |
15 |
5 |
p. 375- 1 p. |
artikel |
78 |
Influence of low lifetime regions on recombination in high lifetime regions of semiconductors
|
|
|
1976 |
15 |
5 |
p. 379-380 2 p. |
artikel |
79 |
InSb-diffused junction diodes
|
|
|
1976 |
15 |
5 |
p. 380- 1 p. |
artikel |
80 |
Instability phenomena in thin insulating films on silicon
|
Singh, B.R. |
|
1976 |
15 |
5 |
p. 385-398 14 p. |
artikel |
81 |
Integrated microwave transistor amplifiers
|
|
|
1976 |
15 |
5 |
p. 378- 1 p. |
artikel |
82 |
Interface between maintainability and commercial aircraft spares support
|
|
|
1976 |
15 |
5 |
p. 376- 1 p. |
artikel |
83 |
Ion implantation in II–VI semiconductors
|
|
|
1976 |
15 |
5 |
p. 384- 1 p. |
artikel |
84 |
Ion implantation into GaAs and related compounds
|
|
|
1976 |
15 |
5 |
p. 384- 1 p. |
artikel |
85 |
Island trip boosts reliability
|
|
|
1976 |
15 |
5 |
p. 375- 1 p. |
artikel |
86 |
Is maintainability keeping up with electronics?
|
|
|
1976 |
15 |
5 |
p. 374- 1 p. |
artikel |
87 |
Just how reliable are plastic encapsulated semiconductors for military applications and how can the maximum reliability be obtained?
|
|
|
1976 |
15 |
5 |
p. 373- 1 p. |
artikel |
88 |
Long-term life-tests of industrial power thyristors (SCR's) over 50,000 hr
|
|
|
1976 |
15 |
5 |
p. 372-373 2 p. |
artikel |
89 |
Microcomputer reliability improvement using triple-modular redundancy
|
|
|
1976 |
15 |
5 |
p. 375- 1 p. |
artikel |
90 |
Microprocessors and integrated electronic technology
|
|
|
1976 |
15 |
5 |
p. 378- 1 p. |
artikel |
91 |
More and more on less and less
|
|
|
1976 |
15 |
5 |
p. 377- 1 p. |
artikel |
92 |
MOS moves into higher-power applications
|
|
|
1976 |
15 |
5 |
p. 378- 1 p. |
artikel |
93 |
New wafer alignment technique
|
|
|
1976 |
15 |
5 |
p. 377- 1 p. |
artikel |
94 |
Nomograms for the design of reliability acceptance plans
|
|
|
1976 |
15 |
5 |
p. 374- 1 p. |
artikel |
95 |
Observed failure rates of electronic components in computer systems
|
|
|
1976 |
15 |
5 |
p. 372- 1 p. |
artikel |
96 |
On the mechanism of indirect band to band recombination in germanium electron-hole drops
|
|
|
1976 |
15 |
5 |
p. 379- 1 p. |
artikel |
97 |
On the reliability analysis of complex systems
|
Colombo, A.G. |
|
1976 |
15 |
5 |
p. 459-467 9 p. |
artikel |
98 |
Photomask/resist capability—An approach to assessment
|
Volk, Charles E. |
|
1976 |
15 |
5 |
p. 469-474 6 p. |
artikel |
99 |
Photo-thermal probing of Si-SiO2 surface centres—II. Experiment
|
|
|
1976 |
15 |
5 |
p. 379- 1 p. |
artikel |
100 |
Photo-thermal probing of Si-SiO2 surface centres—I. Theory
|
|
|
1976 |
15 |
5 |
p. 380- 1 p. |
artikel |
101 |
Physical aspects of ion-implantation
|
|
|
1976 |
15 |
5 |
p. 384- 1 p. |
artikel |
102 |
Plasma processing at moderate vacuum
|
|
|
1976 |
15 |
5 |
p. 380-381 2 p. |
artikel |
103 |
Prediction of future failures of a system
|
Lwin, T. |
|
1976 |
15 |
5 |
p. 485-488 4 p. |
artikel |
104 |
Present and future programme related to high reliability parts in Europe
|
|
|
1976 |
15 |
5 |
p. 372- 1 p. |
artikel |
105 |
Prevention of liquid-metal embrittlement and stress-corrosion cracking in Kovar leads
|
|
|
1976 |
15 |
5 |
p. 373- 1 p. |
artikel |
106 |
Processor family specialises in dedicated control
|
|
|
1976 |
15 |
5 |
p. 379- 1 p. |
artikel |
107 |
Publications, notices, calls for papers, etc.
|
|
|
1976 |
15 |
5 |
p. 359-367 9 p. |
artikel |
108 |
Raman study of implanted semiconductors
|
|
|
1976 |
15 |
5 |
p. 381- 1 p. |
artikel |
109 |
Recent advances in ion implantation—a state of the art review
|
|
|
1976 |
15 |
5 |
p. 383- 1 p. |
artikel |
110 |
Reliability calculation of redundant systems with non-identical units
|
|
|
1976 |
15 |
5 |
p. 376-377 2 p. |
artikel |
111 |
Reliability growth management of SATCOM terminals
|
|
|
1976 |
15 |
5 |
p. 375- 1 p. |
artikel |
112 |
Reliability modelling algorithms for a class of large repairable systems
|
|
|
1976 |
15 |
5 |
p. 375- 1 p. |
artikel |
113 |
Reliability of copper-plated through-hole printed wiring board
|
|
|
1976 |
15 |
5 |
p. 373- 1 p. |
artikel |
114 |
Reliability of thin film conductors and air gap crossovers for hybrid circuits: Tests, results and design criteria
|
Piacentini, G.F. |
|
1976 |
15 |
5 |
p. 451-458 8 p. |
artikel |
115 |
Repairing faults in plated through-holes
|
|
|
1976 |
15 |
5 |
p. 372- 1 p. |
artikel |
116 |
R.F. relaxation oscillations in polycrystalline TiO2 thin films
|
|
|
1976 |
15 |
5 |
p. 382- 1 p. |
artikel |
117 |
Right-censored, grouped life test data analysis assuming a two-parameter Weibull distribution function
|
Chace, E.F. |
|
1976 |
15 |
5 |
p. 497-499 3 p. |
artikel |
118 |
Silicon p-n insulator-metal (p-n-I-M) devices
|
|
|
1976 |
15 |
5 |
p. 381- 1 p. |
artikel |
119 |
Silicon wafer technology—state of the art 1976
|
|
|
1976 |
15 |
5 |
p. 377- 1 p. |
artikel |
120 |
Some applications of ion-implantation in materials
|
|
|
1976 |
15 |
5 |
p. 383- 1 p. |
artikel |
121 |
Some properties of ion-implanted p-n junctions in silicon
|
|
|
1976 |
15 |
5 |
p. 383- 1 p. |
artikel |
122 |
Stacking faults in silicon epitaxial layers
|
|
|
1976 |
15 |
5 |
p. 380- 1 p. |
artikel |
123 |
Statistical interpretation of meniscograph solderability tests
|
|
|
1976 |
15 |
5 |
p. 382- 1 p. |
artikel |
124 |
Steady-state profit in a 2-unit standby system
|
|
|
1976 |
15 |
5 |
p. 376- 1 p. |
artikel |
125 |
Surface arcover in D.C. capacitors
|
|
|
1976 |
15 |
5 |
p. 372- 1 p. |
artikel |
126 |
Systems analysis by sequential fault trees
|
|
|
1976 |
15 |
5 |
p. 377- 1 p. |
artikel |
127 |
Techniques of adjusting thin- and thick-film resistors in hybrid microelectronic circuits
|
|
|
1976 |
15 |
5 |
p. 382- 1 p. |
artikel |
128 |
Test system checks microprocessors and LSI memories
|
|
|
1976 |
15 |
5 |
p. 378- 1 p. |
artikel |
129 |
The assurance of quality and reliability
|
|
|
1976 |
15 |
5 |
p. 374- 1 p. |
artikel |
130 |
The configuration-based approach for 3d impurities in palladium and platinum
|
|
|
1976 |
15 |
5 |
p. 379- 1 p. |
artikel |
131 |
The present status of microelectronics
|
Ingram-Cotton, John |
|
1976 |
15 |
5 |
p. 355-356 2 p. |
artikel |
132 |
Thermal emission rates and activation energies of electrons at tantalum centres in silicon
|
|
|
1976 |
15 |
5 |
p. 380- 1 p. |
artikel |
133 |
Thick-film hybrid techniques offer new hope for the blind
|
|
|
1976 |
15 |
5 |
p. 382- 1 p. |
artikel |
134 |
Thin-film deposition techniques and design of thin-film passive components
|
|
|
1976 |
15 |
5 |
p. 382- 1 p. |
artikel |
135 |
Tri-pyramids in silicon epitaxial layers
|
|
|
1976 |
15 |
5 |
p. 379- 1 p. |
artikel |
136 |
When is goods inward testing necessary?
|
|
|
1976 |
15 |
5 |
p. 371- 1 p. |
artikel |