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                             136 results found
no title author magazine year volume issue page(s) type
1 A bibliography on charge-coupled devices 1976
 15 5 p. 377-
1 p.
 article
2 A burn-in programme for wearout unaffected equipments 1976
 15 5 p. 375-
1 p.
 article
3 Accelerated vibration fatigue life testing of leads and soldered joints 1976
 15 5 p. 372-
1 p.
 article
4 A contractor view of warranty contracting 1976
 15 5 p. 371-
1 p.
 article
5 Adhesion measurement of thin films 1976
 15 5 p. 381-382
2 p.
 article
6 A low-power circuit block for digital telephone exchanges 1976
 15 5 p. 378-
1 p.
 article
7 A manufacturing reliability program for xerographic copying machines Douglas Ekings, J.
 1976
 15 5 p. 437-450
14 p.
 article
8 A many-state Markov model for computer software performance parameters 1976
 15 5 p. 375-
1 p.
 article
9 A method for calculation of network reliability 1976
 15 5 p. 376-
1 p.
 article
10 A method of grading mica for use in high-reliability capacitors 1976
 15 5 p. 373-374
2 p.
 article
11 A MOS model for computer-aided design 1976
 15 5 p. 377-
1 p.
 article
12 An active R filter using CMOS transistor arrays 1976
 15 5 p. 378-379
2 p.
 article
13 Analysis of a repairable system which operates at discrete times 1976
 15 5 p. 375-
1 p.
 article
14 Analysis of a three-state system with two types of components 1976
 15 5 p. 374-
1 p.
 article
15 Analysis of implanted layers by means of secondary ion mass spectrometry (SIMS) 1976
 15 5 p. 384-
1 p.
 article
16 An evaluation of exponential and Weibull test plans 1976
 15 5 p. 371-
1 p.
 article
17 An experimental investigation of the dielectric properties of thermally evaporated rare earth oxides for use in thin-film capacitors 1976
 15 5 p. 381-
1 p.
 article
18 An integrated channel selector for VHF/UHF 1976
 15 5 p. 501-502
2 p.
 article
19 A note on a four-state system Dhillon, Balbir S.
 1976
 15 5 p. 491-492
2 p.
 article
20 Application of the ion-implantation technology to the production of varicap (varactor) diodes 1976
 15 5 p. 383-
1 p.
 article
21 Application of thermal analysis to the semiconductor plastic package thermal shock testing reliability Ritchie, Kim
 1976
 15 5 p. 489-490
2 p.
 article
22 Applications of ion-implantation in semiconductor devices 1976
 15 5 p. 383-
1 p.
 article
23 A production reactor for low temperature plasma-enhanced silicon nitride deposition 1976
 15 5 p. 380-
1 p.
 article
24 A review of fault detection methods for large system 1976
 15 5 p. 376-
1 p.
 article
25 A six-state system model 1976
 15 5 p. 376-
1 p.
 article
26 A survey of plasma-etching processes 1976
 15 5 p. 378-
1 p.
 article
27 A systems approach to condition monitoring 1976
 15 5 p. 374-375
2 p.
 article
28 Automatic alignment considerations in wafer fabrication 1976
 15 5 p. 377-
1 p.
 article
29 Availability of repairable units when failure and restoration rates age in real time 1976
 15 5 p. 376-
1 p.
 article
30 Bayesian decomposition method for computing the reliability of an oriented network 1976
 15 5 p. 377-
1 p.
 article
31 Best estimates of functions of the parameters of the Gaussian and gamma distributions 1976
 15 5 p. 374-
1 p.
 article
32 Bipolar bit slices advance fast 1976
 15 5 p. 377-
1 p.
 article
33 Calculation of lattice dynamical properties from electronic energies. Application to C, Si and Ge 1976
 15 5 p. 380-
1 p.
 article
34 Calendar of international conferences, symposia, lectures and meetings of interest 1976
 15 5 p. 357-358
2 p.
 article
35 Characteristics of an ion-implantation set-up for research 1976
 15 5 p. 383-
1 p.
 article
36 Charge coupled devices—Basic operation and principles Arora, R.K.
 1976
 15 5 p. 475-483
9 p.
 article
37 Choosing sides in digital watch technology 1976
 15 5 p. 377-
1 p.
 article
38 Comparison of DPA results on electronic components 1976
 15 5 p. 373-
1 p.
 article
39 Computer algorithm to determine MOS process-parameters 1976
 15 5 p. 378-
1 p.
 article
40 Copper tape set to carry IC chips 1976
 15 5 p. 377-378
2 p.
 article
41 Cost reliability trade off in an electronic module Surendran, K.
 1976
 15 5 p. 493-496
4 p.
 article
42 Current emission from sandwich metal layers Al-Al2O3-Au 1976
 15 5 p. 380-
1 p.
 article
43 Design for reliability Dryden, M.H.
 1976
 15 5 p. 399-436
38 p.
 article
44 Determination of temperature of integrated-circuit chips in hybrid packaging 1976
 15 5 p. 379-
1 p.
 article
45 Development of bubble memory chip test system 1976
 15 5 p. 378-
1 p.
 article
46 Dielectric breakdown properties in silicon dioxide films 1976
 15 5 p. 381-
1 p.
 article
47 Dielectric isolation techniques for integrated circuits 1976
 15 5 p. 378-
1 p.
 article
48 Distribution of a random variable defined through a constitutive equation 1976
 15 5 p. 376-
1 p.
 article
49 Distribution profiles of boron-implanted layers in silicon using a high resolution anodic oxidation cell 1976
 15 5 p. 383-
1 p.
 article
50 Doped silicon oxide as diffusion source 1976
 15 5 p. 379-
1 p.
 article
51 Doping uniformity and reproducibility of ion implanted wafers 1976
 15 5 p. 383-
1 p.
 article
52 Dynamic inspection of large scale integrated circuits 1976
 15 5 p. 374-
1 p.
 article
53 Effect of standby redundancy on system reliability 1976
 15 5 p. 376-
1 p.
 article
54 Eight-bit microprocessor aims at control applications 1976
 15 5 p. 379-
1 p.
 article
55 Electroless NiP processing for hybrid integrated circuits 1976
 15 5 p. 381-
1 p.
 article
56 Electron-beam lithography for microcircuit fabrication 1976
 15 5 p. 384-
1 p.
 article
57 Electron transport mechanisms in very thin Al2O3 films 1976
 15 5 p. 381-
1 p.
 article
58 Electrostatic discharge in microcircuits 1976
 15 5 p. 372-
1 p.
 article
59 Electrostatics in the electronics environment G.W.A.D.,
 1976
 15 5 p. 370-
1 p.
 article
60 Epitaxie par jets moleculaires 1976
 15 5 p. 380-
1 p.
 article
61 Evaluation of technology options for LSI processing elements 1976
 15 5 p. 378-
1 p.
 article
62 Evolution of the characteristics and performances of implantation machines 1976
 15 5 p. 383-
1 p.
 article
63 Factors in balancing government and contractors risk with warranties 1976
 15 5 p. 371-
1 p.
 article
64 Failure mechanisms in wet tantalum capacitors 1976
 15 5 p. 373-
1 p.
 article
65 Failure rate analysis of Goddard Space Flight Center spacecraft performance during orbital life 1976
 15 5 p. 376-
1 p.
 article
66 Failure review board—a management tool for producibility and profit 1976
 15 5 p. 371-
1 p.
 article
67 Fault isolation of electronic control systems 1976
 15 5 p. 375-376
2 p.
 article
68 Fluid abrasive trimming of thin-film resistors 1976
 15 5 p. 382-
1 p.
 article
69 Formation of impurity atmospheres in Cu-Ge alloy studies by positron annihilation 1976
 15 5 p. 380-
1 p.
 article
70 Government depot maintenance warranties 1976
 15 5 p. 371-
1 p.
 article
71 Handbook of thick film technology G.W.A.D.,
 1976
 15 5 p. 369-370
2 p.
 article
72 Heating in polyethylene terephthalate film AC capacitors 1976
 15 5 p. 373-
1 p.
 article
73 High energy in scattering as a tool for studying ion-implantation 1976
 15 5 p. 384-
1 p.
 article
74 High reliability Ta/Al thin-film hybrid circuits 1976
 15 5 p. 382-
1 p.
 article
75 High temp. burn-in and its effects on reliability 1976
 15 5 p. 374-
1 p.
 article
76 Hybrid circuit technology keeps rolling along 1976
 15 5 p. 382-
1 p.
 article
77 Implementation of the design to cost concept 1976
 15 5 p. 375-
1 p.
 article
78 Influence of low lifetime regions on recombination in high lifetime regions of semiconductors 1976
 15 5 p. 379-380
2 p.
 article
79 InSb-diffused junction diodes 1976
 15 5 p. 380-
1 p.
 article
80 Instability phenomena in thin insulating films on silicon Singh, B.R.
 1976
 15 5 p. 385-398
14 p.
 article
81 Integrated microwave transistor amplifiers 1976
 15 5 p. 378-
1 p.
 article
82 Interface between maintainability and commercial aircraft spares support 1976
 15 5 p. 376-
1 p.
 article
83 Ion implantation in II–VI semiconductors 1976
 15 5 p. 384-
1 p.
 article
84 Ion implantation into GaAs and related compounds 1976
 15 5 p. 384-
1 p.
 article
85 Island trip boosts reliability 1976
 15 5 p. 375-
1 p.
 article
86 Is maintainability keeping up with electronics? 1976
 15 5 p. 374-
1 p.
 article
87 Just how reliable are plastic encapsulated semiconductors for military applications and how can the maximum reliability be obtained? 1976
 15 5 p. 373-
1 p.
 article
88 Long-term life-tests of industrial power thyristors (SCR's) over 50,000 hr 1976
 15 5 p. 372-373
2 p.
 article
89 Microcomputer reliability improvement using triple-modular redundancy 1976
 15 5 p. 375-
1 p.
 article
90 Microprocessors and integrated electronic technology 1976
 15 5 p. 378-
1 p.
 article
91 More and more on less and less 1976
 15 5 p. 377-
1 p.
 article
92 MOS moves into higher-power applications 1976
 15 5 p. 378-
1 p.
 article
93 New wafer alignment technique 1976
 15 5 p. 377-
1 p.
 article
94 Nomograms for the design of reliability acceptance plans 1976
 15 5 p. 374-
1 p.
 article
95 Observed failure rates of electronic components in computer systems 1976
 15 5 p. 372-
1 p.
 article
96 On the mechanism of indirect band to band recombination in germanium electron-hole drops 1976
 15 5 p. 379-
1 p.
 article
97 On the reliability analysis of complex systems Colombo, A.G.
 1976
 15 5 p. 459-467
9 p.
 article
98 Photomask/resist capability—An approach to assessment Volk, Charles E.
 1976
 15 5 p. 469-474
6 p.
 article
99 Photo-thermal probing of Si-SiO2 surface centres—II. Experiment 1976
 15 5 p. 379-
1 p.
 article
100 Photo-thermal probing of Si-SiO2 surface centres—I. Theory 1976
 15 5 p. 380-
1 p.
 article
101 Physical aspects of ion-implantation 1976
 15 5 p. 384-
1 p.
 article
102 Plasma processing at moderate vacuum 1976
 15 5 p. 380-381
2 p.
 article
103 Prediction of future failures of a system Lwin, T.
 1976
 15 5 p. 485-488
4 p.
 article
104 Present and future programme related to high reliability parts in Europe 1976
 15 5 p. 372-
1 p.
 article
105 Prevention of liquid-metal embrittlement and stress-corrosion cracking in Kovar leads 1976
 15 5 p. 373-
1 p.
 article
106 Processor family specialises in dedicated control 1976
 15 5 p. 379-
1 p.
 article
107 Publications, notices, calls for papers, etc. 1976
 15 5 p. 359-367
9 p.
 article
108 Raman study of implanted semiconductors 1976
 15 5 p. 381-
1 p.
 article
109 Recent advances in ion implantation—a state of the art review 1976
 15 5 p. 383-
1 p.
 article
110 Reliability calculation of redundant systems with non-identical units 1976
 15 5 p. 376-377
2 p.
 article
111 Reliability growth management of SATCOM terminals 1976
 15 5 p. 375-
1 p.
 article
112 Reliability modelling algorithms for a class of large repairable systems 1976
 15 5 p. 375-
1 p.
 article
113 Reliability of copper-plated through-hole printed wiring board 1976
 15 5 p. 373-
1 p.
 article
114 Reliability of thin film conductors and air gap crossovers for hybrid circuits: Tests, results and design criteria Piacentini, G.F.
 1976
 15 5 p. 451-458
8 p.
 article
115 Repairing faults in plated through-holes 1976
 15 5 p. 372-
1 p.
 article
116 R.F. relaxation oscillations in polycrystalline TiO2 thin films 1976
 15 5 p. 382-
1 p.
 article
117 Right-censored, grouped life test data analysis assuming a two-parameter Weibull distribution function Chace, E.F.
 1976
 15 5 p. 497-499
3 p.
 article
118 Silicon p-n insulator-metal (p-n-I-M) devices 1976
 15 5 p. 381-
1 p.
 article
119 Silicon wafer technology—state of the art 1976 1976
 15 5 p. 377-
1 p.
 article
120 Some applications of ion-implantation in materials 1976
 15 5 p. 383-
1 p.
 article
121 Some properties of ion-implanted p-n junctions in silicon 1976
 15 5 p. 383-
1 p.
 article
122 Stacking faults in silicon epitaxial layers 1976
 15 5 p. 380-
1 p.
 article
123 Statistical interpretation of meniscograph solderability tests 1976
 15 5 p. 382-
1 p.
 article
124 Steady-state profit in a 2-unit standby system 1976
 15 5 p. 376-
1 p.
 article
125 Surface arcover in D.C. capacitors 1976
 15 5 p. 372-
1 p.
 article
126 Systems analysis by sequential fault trees 1976
 15 5 p. 377-
1 p.
 article
127 Techniques of adjusting thin- and thick-film resistors in hybrid microelectronic circuits 1976
 15 5 p. 382-
1 p.
 article
128 Test system checks microprocessors and LSI memories 1976
 15 5 p. 378-
1 p.
 article
129 The assurance of quality and reliability 1976
 15 5 p. 374-
1 p.
 article
130 The configuration-based approach for 3d impurities in palladium and platinum 1976
 15 5 p. 379-
1 p.
 article
131 The present status of microelectronics Ingram-Cotton, John
 1976
 15 5 p. 355-356
2 p.
 article
132 Thermal emission rates and activation energies of electrons at tantalum centres in silicon 1976
 15 5 p. 380-
1 p.
 article
133 Thick-film hybrid techniques offer new hope for the blind 1976
 15 5 p. 382-
1 p.
 article
134 Thin-film deposition techniques and design of thin-film passive components 1976
 15 5 p. 382-
1 p.
 article
135 Tri-pyramids in silicon epitaxial layers 1976
 15 5 p. 379-
1 p.
 article
136 When is goods inward testing necessary? 1976
 15 5 p. 371-
1 p.
 article
                             136 results found
 
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