| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A high-efficiency aging test with new data processing method for semiconductor device
|
Yang, Xinhuan
|
|
|
143 |
C |
p.
|
article
|
| 2 |
Editorial Board
|
|
|
|
143 |
C |
p.
|
article
|
| 3 |
Enhancing the lifetime of STT-RAM using compression based wear leveling technique
|
Priya, Bhukya Krishna
|
|
|
143 |
C |
p.
|
article
|
| 4 |
Impact of interface trap charges on analog/RF and linearity performances of PGP negative capacitance FET
|
Chaudhary, Shalini
|
|
|
143 |
C |
p.
|
article
|
| 5 |
Improvement of the heat resistance of a liquid mold compound by bismaleimide resin
|
Ishikawa, Yuki
|
|
|
143 |
C |
p.
|
article
|
| 6 |
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits
|
Ayoub, Bassel
|
|
|
143 |
C |
p.
|
article
|
| 7 |
Mechanical stress in a tapered channel hole of 3D NAND flash memory
|
Yoon, DongGwan
|
|
|
143 |
C |
p.
|
article
|
| 8 |
Microelectronics Reliability: Publisher’s note
|
Li, Jimeng
|
|
|
143 |
C |
p.
|
article
|
| 9 |
Optimization of creep and thermal features of the Sn-Ag-Cu-Zn alloy by the magnetic field
|
Hammad, A.E.
|
|
|
143 |
C |
p.
|
article
|
| 10 |
Programming mechanism and characteristics of Sense-Switch pFlash cells
|
Liu, Guozhu
|
|
|
143 |
C |
p.
|
article
|
| 11 |
Study on formation mechanism of different differential resistance branches at avalanche breakdown curve of SGT-MOSFET
|
Su, Le
|
|
|
143 |
C |
p.
|
article
|
| 12 |
Temperature distribution in multichip IGBT module and its impact on collector current sharing
|
Chen, Cuili
|
|
|
143 |
C |
p.
|
article
|
| 13 |
Thermal and mechanical reliability of thermal through-silicon vias in three-dimensional integrated circuits
|
Qu, Chenlei
|
|
|
143 |
C |
p.
|
article
|
Journal description