| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A built-in self-test and self-adjustment method of MEMS pressure sensor
|
Zhu, Manhong
|
|
|
136 |
C |
p.
|
artikel
|
| 2 |
Analysis of electrically conductive adhesives in shingled solar modules by X-ray imaging techniques
|
Hartweg, Barry
|
|
|
136 |
C |
p.
|
artikel
|
| 3 |
An efficient structure to improve the reliability of deep neural networks on ARMs
|
Liu, Zhi
|
|
|
136 |
C |
p.
|
artikel
|
| 4 |
An equivalent circuit model of HCI effect for short-channel N-MOSFET
|
Zhang, Jun-an
|
|
|
136 |
C |
p.
|
artikel
|
| 5 |
BEoL stack robustness investigations utilizing Cu-pillar immobilization and micromechanical loading methods
|
Silomon, Jendrik
|
|
|
136 |
C |
p.
|
artikel
|
| 6 |
Composite powders with carbon nanotubes for laser printing of electronics
|
Słoma, Marcin
|
|
|
136 |
C |
p.
|
artikel
|
| 7 |
Detailed total ionizing dose effects on LDMOS transistors
|
Houadef, Ali
|
|
|
136 |
C |
p.
|
artikel
|
| 8 |
Editorial Board
|
|
|
|
136 |
C |
p.
|
artikel
|
| 9 |
EEPROM endurance degradation at different temperatures: State of the art TCAD simulation
|
Matteo, Franck
|
|
|
136 |
C |
p.
|
artikel
|
| 10 |
Effects of multi-factors on the junction temperature of LED automotive lamp chips
|
Xiao, Yuanbin
|
|
|
136 |
C |
p.
|
artikel
|
| 11 |
Elucidating the large variation in ion diffusivity of microelectronic packaging materials
|
Herrmann, A.
|
|
|
136 |
C |
p.
|
artikel
|
| 12 |
Error correction improvement based on weak-bit-flipping for resistive memories
|
Gherman, Valentin
|
|
|
136 |
C |
p.
|
artikel
|
| 13 |
Failure mechanism of 4H-SiC junction barrier Schottky diodes under harsh thermal cycling stress
|
Zhang, Yuan-Lan
|
|
|
136 |
C |
p.
|
artikel
|
| 14 |
Finite element thermal modelling of power MOSFET packages
|
Cioban, R.
|
|
|
136 |
C |
p.
|
artikel
|
| 15 |
Influence of gate voltage dependent piezoelectric polarization on damage effect of GaN HEMT induced by high power electromagnetic pulse
|
Wang, Lei
|
|
|
136 |
C |
p.
|
artikel
|
| 16 |
Low actuation voltage cantilever-type RF-MEMS shunt switches for 5G applications
|
Saleh, Heba
|
|
|
136 |
C |
p.
|
artikel
|
| 17 |
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading
|
Lei, Mingqi
|
|
|
136 |
C |
p.
|
artikel
|
| 18 |
Optimizing the on-chip electrostatic discharge protection device by Taguchi's methodology
|
Huang, Shao-Chang
|
|
|
136 |
C |
p.
|
artikel
|
| 19 |
Panel level IC-package technology development
|
Fang, Jen-Kuang
|
|
|
136 |
C |
p.
|
artikel
|
| 20 |
Read latency decrease schemes based on check node error rate for 3D NAND flash memories
|
Li, Qianhui
|
|
|
136 |
C |
p.
|
artikel
|
| 21 |
Reliability analysis of degrading systems based on time-varying copula
|
Yang, Chengqiang
|
|
|
136 |
C |
p.
|
artikel
|
| 22 |
Residual strain around a through-silicon via
|
Coppeta, R.A.
|
|
|
136 |
C |
p.
|
artikel
|
| 23 |
Soft error mechanism in SOI D flip-flop induced by space electrostatic discharge
|
Yuan, Run-Jie
|
|
|
136 |
C |
p.
|
artikel
|
| 24 |
Suppression strategy for process-induced warpage of novel fan-out wafer level packaging
|
Yu, Ching-Feng
|
|
|
136 |
C |
p.
|
artikel
|
| 25 |
Transient risk of water layer formation on PCBAs in different climates: Climate data analysis and experimental study
|
Conseil-Gudla, Helene
|
|
|
136 |
C |
p.
|
artikel
|
| 26 |
Using checksum to improve the reliability of embedded convolutional neural networks
|
Liu, Zhi
|
|
|
136 |
C |
p.
|
artikel
|
| 27 |
Verification of creep properties and rupture lifetime evaluation methods using small diameter Sn-3.0Ag-0.5Cu/Sn-58Bi/Sn-5Sb specimens
|
Hiyoshi, Noritake
|
|
|
136 |
C |
p.
|
artikel
|
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