| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A new technique to check the correct mounting of the power module heatsinks
|
Quitadamo, Matteo Vincenzo
|
|
|
128 |
C |
p.
|
article
|
| 2 |
An improved accelerated degradation model for LED reliability assessment with self-heating impacts
|
Truong, Minh-Tuan
|
|
|
128 |
C |
p.
|
article
|
| 3 |
A transport model describing how defect accumulation leads to intrinsic dielectric breakdown and post-breakdown conduction
|
Xu, Yueming
|
|
|
128 |
C |
p.
|
article
|
| 4 |
Automotive optoelectronic components submitted to thermal shock: Impact of component architecture on mechanical reliability
|
NOCAIRI, Safa
|
|
|
128 |
C |
p.
|
article
|
| 5 |
Correction factors to strength of thin silicon die in three- and four-point bending tests due to nonlinear effects
|
Tsai, M.Y.
|
|
|
128 |
C |
p.
|
article
|
| 6 |
Developed non-destructive verification methods for accelerated temperature cycling of power MOSFETs
|
Jang, You-Cheol
|
|
|
128 |
C |
p.
|
article
|
| 7 |
Editorial Board
|
|
|
|
128 |
C |
p.
|
article
|
| 8 |
Effect of indentation depth and strain rate on mechanical properties of Sn0.3Ag0.7Cu
|
Niu, Xiaoyan
|
|
|
128 |
C |
p.
|
article
|
| 9 |
Electron-beam-induced current (EBIC) imaging technique to quicken polysilicon defect localization in MOSFETs
|
Zheng, Shijun
|
|
|
128 |
C |
p.
|
article
|
| 10 |
Heavy-ion induced single event effects and latent damages in SiC power MOSFETs
|
Martinella, C.
|
|
|
128 |
C |
p.
|
article
|
| 11 |
Modeling and optimization of OC fault diagnosis for inverters based on GR-PTA-BN
|
Sumin, Han
|
|
|
128 |
C |
p.
|
article
|
| 12 |
Neutron-induced effects on a self-refresh DRAM
|
Matana Luza, Lucas
|
|
|
128 |
C |
p.
|
article
|
| 13 |
New decoding techniques for modified product code used in critical applications
|
Freitas, David C.C.
|
|
|
128 |
C |
p.
|
article
|
| 14 |
Predictive modeling sheds useful light on burn-in testing (BIT): Brief review and recent extension
|
Suhir, E.
|
|
|
128 |
C |
p.
|
article
|
| 15 |
Sintering of SiC chip via Au80Sn20 solder and its joint strength and thermomechanical reliability
|
Li, Donghua
|
|
|
128 |
C |
p.
|
article
|
| 16 |
Spectral analysis of the IEC waveform, a comparison of generators and pulsers
|
Muhonen, Kathleen
|
|
|
128 |
C |
p.
|
article
|
| 17 |
Study of underfill corner cracks by the confocal-DIC and phantom-nodes methods
|
Yang, Ying
|
|
|
128 |
C |
p.
|
article
|
| 18 |
Study on high power microwave nonlinear effects and degradation characteristics of C-band low noise amplifier
|
Fuxing, Li
|
|
|
128 |
C |
p.
|
article
|
| 19 |
Wear-out failure analysis of modular multilevel converter-based STATCOM: The role of the modulation strategy and IGBT blocking voltage
|
de Sousa, R.O.
|
|
|
128 |
C |
p.
|
article
|
Journal description