| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A highly reliable radiation hardened 8T SRAM cell design
|
Lv, Yinghuan
|
|
|
125 |
C |
p.
|
artikel
|
| 2 |
Degradation of AIIIBV/Ge triple junction solar cells irradiated by gamma-rays, electrons and neutrons
|
Ryabtseva, M.V.
|
|
|
125 |
C |
p.
|
artikel
|
| 3 |
Editorial Board
|
|
|
|
125 |
C |
p.
|
artikel
|
| 4 |
Electrical overstress effect characterization on Power MOS Trenchfet and correlation with time dependent dielectric breakdown
|
Mazza, B.
|
|
|
125 |
C |
p.
|
artikel
|
| 5 |
Hydrothermal growth method for the deposition of ZnO films: Structural, chemical and optical studies
|
Krajian, H.
|
|
|
125 |
C |
p.
|
artikel
|
| 6 |
Large array device characteristics improvements
|
Huang, Shao-Chang
|
|
|
125 |
C |
p.
|
artikel
|
| 7 |
Memoryless linearity in undoped and B-doped graphene FETs: A relative investigation to report improved reliability
|
Chandrasekar, L.
|
|
|
125 |
C |
p.
|
artikel
|
| 8 |
Migration of adhesive material in electrostatically actuated MEMS switch
|
Uvarov, Ilia V.
|
|
|
125 |
C |
p.
|
artikel
|
| 9 |
Modeling of interface trap charges induced degradation in underlap DG and GAA MOSFETs
|
Agrawal, Sonal
|
|
|
125 |
C |
p.
|
artikel
|
| 10 |
Modeling of MEMS Electrothermal Microgripper employing POD-DEIM and POD method
|
Roy, Ananya
|
|
|
125 |
C |
p.
|
artikel
|
| 11 |
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load
|
Liu, Yang
|
|
|
125 |
C |
p.
|
artikel
|
| 12 |
Observation of photoemission behaviour during avalanche breakdown of insulated gate bipolar transistor with defect in the metal contact
|
Endo, Koichi
|
|
|
125 |
C |
p.
|
artikel
|
| 13 |
Performance of wide-bandgap discrete and module cascodes at sub-1 kV: GaN vs. SiC
|
Gunaydin, Yasin
|
|
|
125 |
C |
p.
|
artikel
|
| 14 |
Pitfalls for transient response analysis with VF-TLP
|
Smedes, Theo
|
|
|
125 |
C |
p.
|
artikel
|
| 15 |
Quantifying flux residues after soldering on technical copper using ultraviolet visible (UV–Vis) spectroscopy and multivariate analysis
|
Englert, Tim
|
|
|
125 |
C |
p.
|
artikel
|
| 16 |
Reliability analysis of a fault-tolerant RISC-V system-on-chip
|
Santos, Douglas Almeida
|
|
|
125 |
C |
p.
|
artikel
|
| 17 |
Single event effects of SiC diode demonstrated by pulsed-laser two photon absorption
|
Shangguan, ShiPeng
|
|
|
125 |
C |
p.
|
artikel
|
| 18 |
Solder joints reliability of through hole assemblies with various land and hole design
|
Sobolewski, Maciej
|
|
|
125 |
C |
p.
|
artikel
|
| 19 |
Sub-10 MeV proton-induced single-event transients in 65 nm CMOS inverter chains
|
Wu, Zhenyu
|
|
|
125 |
C |
p.
|
artikel
|
| 20 |
Temperature-dependent electrical characteristics of neutron-irradiated GaN Schottky barrier diodes
|
Zhu, Min
|
|
|
125 |
C |
p.
|
artikel
|
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