| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Computational evaluation of optimal reservoir and sink lengths for threshold current density of electromigration damage considering void and hillock formation
|
Takaya, Ryuji
|
|
|
118 |
C |
p.
|
artikel
|
| 2 |
Editorial Board
|
|
|
|
118 |
C |
p.
|
artikel
|
| 3 |
Engineering application research on reliability prediction of the combined DC-DC power supply
|
He, Yuchen
|
|
|
118 |
C |
p.
|
artikel
|
| 4 |
FEM model calibration for simulation aided thermal design
|
Cioban, R.
|
|
|
118 |
C |
p.
|
artikel
|
| 5 |
Improving the reliability of SRAM-based PUFs under varying operation conditions and aging degradation
|
Saraza-Canflanca, P.
|
|
|
118 |
C |
p.
|
artikel
|
| 6 |
Influence of post-bonding heating process on the long-term reliability of Cu/Al contact
|
Eto, Motoki
|
|
|
118 |
C |
p.
|
artikel
|
| 7 |
Reduced length redundancy adaptive protection for the cascaded integrator-comb interpolation filter on FPGA
|
Gear, Kyle W.
|
|
|
118 |
C |
p.
|
artikel
|
| 8 |
Reliability analysis for TO-247 multilayered power module packaging under mechanical oscillation based on finite element method
|
Ghaderi, Davood
|
|
|
118 |
C |
p.
|
artikel
|
| 9 |
Ruggedness of Dual-GCT against dynamic avalanche and surge current
|
Yang, Wuhua
|
|
|
118 |
C |
p.
|
artikel
|
| 10 |
Stochastic behavioral models for system level reliability analysis including non-normal and correlated process variation
|
Taddiken, Maike
|
|
|
118 |
C |
p.
|
artikel
|
| 11 |
Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A review
|
Ma, Lulu
|
|
|
118 |
C |
p.
|
artikel
|
| 12 |
Study on the influence of fretting wear on electrical performance of SMA connector
|
Feng, Chenzefang
|
|
|
118 |
C |
p.
|
artikel
|
| 13 |
Thermal characterization of GaN lateral power HEMTs on Si, SOI, and poly-AlN substrates
|
Magnani, Alessandro
|
|
|
118 |
C |
p.
|
artikel
|
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