nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Adhesive strength of thick-film PdAg conductors
|
|
|
1972 |
11 |
1 |
p. 27- 1 p. |
artikel |
2 |
Aircraft maintenance and reliability
|
Fukushima, M. |
|
1972 |
11 |
1 |
p. 41-46 6 p. |
artikel |
3 |
Aluminum ultrasonic joining in spider and wire connections
|
|
|
1972 |
11 |
1 |
p. 20- 1 p. |
artikel |
4 |
A method of assessing the risks associated with reliability demonstration testing
|
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|
1972 |
11 |
1 |
p. 16- 1 p. |
artikel |
5 |
A 20 MHz digital frequency meter using ttl integrated circuits (Part 1)
|
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1972 |
11 |
1 |
p. 20-21 2 p. |
artikel |
6 |
A monolithic channel filter—manufacture with a new technology
|
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|
1972 |
11 |
1 |
p. 21-22 2 p. |
artikel |
7 |
An approach to a standard topology for digital hybrid integrated circuits
|
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|
1972 |
11 |
1 |
p. 18- 1 p. |
artikel |
8 |
A new high-performance co-firable paste system
|
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1972 |
11 |
1 |
p. 27- 1 p. |
artikel |
9 |
A new self-scanned photodiode array
|
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1972 |
11 |
1 |
p. 21- 1 p. |
artikel |
10 |
An improved microwave silicon MESFET
|
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|
1972 |
11 |
1 |
p. 23- 1 p. |
artikel |
11 |
Anomalous diffusion of Al into SiC
|
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1972 |
11 |
1 |
p. 23- 1 p. |
artikel |
12 |
An overview of photomasking technology in the past decade
|
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1972 |
11 |
1 |
p. 18- 1 p. |
artikel |
13 |
A plasma oxidation process for removing photoresist films
|
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|
1972 |
11 |
1 |
p. 20- 1 p. |
artikel |
14 |
Application of MIL-STD-781B to redundant systems
|
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1972 |
11 |
1 |
p. 16- 1 p. |
artikel |
15 |
A review of the fundamentals of vacuum metallurgy
|
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1972 |
11 |
1 |
p. 26- 1 p. |
artikel |
16 |
Aspects of multi-layered thick-film hybrids
|
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1972 |
11 |
1 |
p. 26- 1 p. |
artikel |
17 |
A study of new shallow diffusion techniques in silicon for microwave structures
|
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|
1972 |
11 |
1 |
p. 19- 1 p. |
artikel |
18 |
A study of the contacts of a diffused resistor
|
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1972 |
11 |
1 |
p. 21- 1 p. |
artikel |
19 |
Beam-leads, versatile chips with a built-in interconnection system
|
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1972 |
11 |
1 |
p. 19- 1 p. |
artikel |
20 |
Bistable noise in p-n junctions
|
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1972 |
11 |
1 |
p. 23- 1 p. |
artikel |
21 |
Buried wire multilayer ceramics
|
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|
1972 |
11 |
1 |
p. 18- 1 p. |
artikel |
22 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
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1972 |
11 |
1 |
p. 3-4 2 p. |
artikel |
23 |
Calls for papers
|
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1972 |
11 |
1 |
p. 7- 1 p. |
artikel |
24 |
Characterization of SiO using fine features of X-ray K emission spectra
|
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1972 |
11 |
1 |
p. 22- 1 p. |
artikel |
25 |
Charge-coupled devices—a new approach to MIS device structures
|
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1972 |
11 |
1 |
p. 18-19 2 p. |
artikel |
26 |
Coming up fast from behind—denser bipolar devices
|
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1972 |
11 |
1 |
p. 20- 1 p. |
artikel |
27 |
Component data for statistical circuit analysis
|
Jensen, F. |
|
1972 |
11 |
1 |
p. 79-85 7 p. |
artikel |
28 |
Conversion of silicon nitride into silicon dioxide through the influence of oxygen
|
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1972 |
11 |
1 |
p. 23- 1 p. |
artikel |
29 |
Correlation of bright spots with crystal defects in silicon vidicons
|
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1972 |
11 |
1 |
p. 14- 1 p. |
artikel |
30 |
Course
|
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|
1972 |
11 |
1 |
p. 5- 1 p. |
artikel |
31 |
Critical mechanical design evaluation of electronic communication systems
|
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|
1972 |
11 |
1 |
p. 17- 1 p. |
artikel |
32 |
Design considerations for a hybrid power series regulator
|
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|
1972 |
11 |
1 |
p. 19- 1 p. |
artikel |
33 |
Designing differential FET inputs with overall performance in mind
|
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|
1972 |
11 |
1 |
p. 20- 1 p. |
artikel |
34 |
Detection of failures in combinational digital circuits
|
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|
1972 |
11 |
1 |
p. 16- 1 p. |
artikel |
35 |
Developments in copper alloys for semiconductor connectors and packages
|
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|
1972 |
11 |
1 |
p. 22- 1 p. |
artikel |
36 |
Doping dependence of second breakdown in a p-n junction
|
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|
1972 |
11 |
1 |
p. 14-15 2 p. |
artikel |
37 |
Drift velocity of electrons and holes and associated anisotropic effects in silicon
|
|
|
1972 |
11 |
1 |
p. 24- 1 p. |
artikel |
38 |
Economical electrical life testing of toggle switches
|
Bora, J.S. |
|
1972 |
11 |
1 |
p. 93- 1 p. |
artikel |
39 |
Editorial Board
|
|
|
1972 |
11 |
1 |
p. IFC- 1 p. |
artikel |
40 |
Effects of humidity and organic coating on surface potential propagation in passivated devices
|
|
|
1972 |
11 |
1 |
p. 14- 1 p. |
artikel |
41 |
Electromigration damage in AlCu thin films
|
|
|
1972 |
11 |
1 |
p. 15- 1 p. |
artikel |
42 |
Electronic structure of defect centers in SiO2
|
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|
1972 |
11 |
1 |
p. 15- 1 p. |
artikel |
43 |
Experimental results on transient space charge limited currents in p-n junctions
|
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|
1972 |
11 |
1 |
p. 23- 1 p. |
artikel |
44 |
Failure modes in thick-film hybrids
|
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|
1972 |
11 |
1 |
p. 17- 1 p. |
artikel |
45 |
Failure physics on the electro-mechanical parts
|
Uekusa, C. |
|
1972 |
11 |
1 |
p. 59-60 2 p. |
artikel |
46 |
Ferroelectric films by flash evaporation of PZT
|
|
|
1972 |
11 |
1 |
p. 27- 1 p. |
artikel |
47 |
Figure of merit of Bayesian analysis and modeling
|
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|
1972 |
11 |
1 |
p. 13- 1 p. |
artikel |
48 |
Flow reliability of communication net
|
|
|
1972 |
11 |
1 |
p. 16- 1 p. |
artikel |
49 |
Fringe field corrections for capacitors on thin dielectric layers
|
|
|
1972 |
11 |
1 |
p. 22- 1 p. |
artikel |
50 |
Highly reliable components for the electronics switching system in Japan
|
Hanzawa, M. |
|
1972 |
11 |
1 |
p. 53-55 3 p. |
artikel |
51 |
High value resistors for integrated circuits
|
|
|
1972 |
11 |
1 |
p. 95- 1 p. |
artikel |
52 |
IC OP amps getting it all together
|
|
|
1972 |
11 |
1 |
p. 21- 1 p. |
artikel |
53 |
Impurity concentration dependent density of states and resulting fermi level for silicon
|
|
|
1972 |
11 |
1 |
p. 24- 1 p. |
artikel |
54 |
Integrated injection logic
|
|
|
1972 |
11 |
1 |
p. 94-IN6 nvt p. |
artikel |
55 |
Large silicon slice mounting
|
|
|
1972 |
11 |
1 |
p. 19- 1 p. |
artikel |
56 |
Laser trimming of silicon-chromium thin-film resistors
|
|
|
1972 |
11 |
1 |
p. 27- 1 p. |
artikel |
57 |
Letter to the editor
|
Young, K.J. |
|
1972 |
11 |
1 |
p. 1- 1 p. |
artikel |
58 |
Linear IC market in ferment
|
|
|
1972 |
11 |
1 |
p. 18- 1 p. |
artikel |
59 |
Making sense out of the MOS muddle, Part 1
|
|
|
1972 |
11 |
1 |
p. 17-18 2 p. |
artikel |
60 |
Matched-varactor chip brings electronic tuning to a-m radios
|
|
|
1972 |
11 |
1 |
p. 22- 1 p. |
artikel |
61 |
Materials in electronics
|
G.W.A.D., |
|
1972 |
11 |
1 |
p. 29- 1 p. |
artikel |
62 |
Measuring techniques for trimming hybrid circuit resistors
|
|
|
1972 |
11 |
1 |
p. 25- 1 p. |
artikel |
63 |
Measuring the thickness of very thin layers by X-ray interference
|
|
|
1972 |
11 |
1 |
p. 26- 1 p. |
artikel |
64 |
Metallurgical properties and electrical characteristics of palladium silicide-silicon contacts
|
|
|
1972 |
11 |
1 |
p. 21- 1 p. |
artikel |
65 |
MOSFET memory circuits
|
|
|
1972 |
11 |
1 |
p. 21- 1 p. |
artikel |
66 |
MOS firms eye 1-transistor cells
|
|
|
1972 |
11 |
1 |
p. 20- 1 p. |
artikel |
67 |
MOS/LSI brings complex circuits within reach of any designer
|
|
|
1972 |
11 |
1 |
p. 21- 1 p. |
artikel |
68 |
Multilayer debugging process
|
Ninomiya, T. |
|
1972 |
11 |
1 |
p. 65-69 5 p. |
artikel |
69 |
Multilayering for a low cost hermetic thick-film substrate package
|
|
|
1972 |
11 |
1 |
p. 25- 1 p. |
artikel |
70 |
Multilayer substrates utilizing thin-film and thick-film technologies
|
|
|
1972 |
11 |
1 |
p. 25- 1 p. |
artikel |
71 |
New low cost high-performance thick-film resistor paste
|
|
|
1972 |
11 |
1 |
p. 26- 1 p. |
artikel |
72 |
NHK-topics system
|
Sonoda, S. |
|
1972 |
11 |
1 |
p. 38-41 4 p. |
artikel |
73 |
Nitride-oxide layer proofs memory against data loss
|
|
|
1972 |
11 |
1 |
p. 19- 1 p. |
artikel |
74 |
Nonparametric analysis of reliability data in an extended failure model
|
Abe, Shu-Nichi |
|
1972 |
11 |
1 |
p. 64-65 2 p. |
artikel |
75 |
On single-cycle availability
|
|
|
1972 |
11 |
1 |
p. 17- 1 p. |
artikel |
76 |
On the emitter degradation by avalanche breakdown in planar transistors
|
|
|
1972 |
11 |
1 |
p. 14- 1 p. |
artikel |
77 |
Optimum design method achieving maximum system effectiveness
|
Sasaki, M. |
|
1972 |
11 |
1 |
p. 62-63 2 p. |
artikel |
78 |
Orientation dependence of the diffusion of boron in silicon
|
|
|
1972 |
11 |
1 |
p. 24- 1 p. |
artikel |
79 |
Packaging techniques for modern microelectronics equipment
|
|
|
1972 |
11 |
1 |
p. 18- 1 p. |
artikel |
80 |
Papers to be published in future issues
|
|
|
1972 |
11 |
1 |
p. 31- 1 p. |
artikel |
81 |
Passivation of semiconductor surfaces
|
|
|
1972 |
11 |
1 |
p. 23- 1 p. |
artikel |
82 |
Photoformed plated interconnection of embedded IC chips
|
|
|
1972 |
11 |
1 |
p. 20- 1 p. |
artikel |
83 |
Plastic encapsulated semiconductors; field performance vs. laboratory testing
|
|
|
1972 |
11 |
1 |
p. 14- 1 p. |
artikel |
84 |
Preliminary experience with ion-beam thinning of semiconductor materials
|
|
|
1972 |
11 |
1 |
p. 27- 1 p. |
artikel |
85 |
Preliminary program 1972 Reliability Physics Symposium
|
|
|
1972 |
11 |
1 |
p. 9-10 2 p. |
artikel |
86 |
Probleme der Fehlererkennung in Masken für integrierte Halbleiterschaltungen bei kohärent-optischer Filterung
|
|
|
1972 |
11 |
1 |
p. 19- 1 p. |
artikel |
87 |
Production method for aluminum beam leads on ceramic substrates
|
|
|
1972 |
11 |
1 |
p. 18- 1 p. |
artikel |
88 |
Production of a hybrid integrated circuit for PICTUREPHONE® service
|
|
|
1972 |
11 |
1 |
p. 21- 1 p. |
artikel |
89 |
Product reliability—Automobile
|
Iwata, A. |
|
1972 |
11 |
1 |
p. 50-51 2 p. |
artikel |
90 |
Properties and processes for photoresists in semiconductor manufacture
|
|
|
1972 |
11 |
1 |
p. 19- 1 p. |
artikel |
91 |
Quality assurance and reliability for construction equipment, especially bulldozers
|
Fuse, Y. |
|
1972 |
11 |
1 |
p. 48-50 3 p. |
artikel |
92 |
Reactively evaporated titanium nitride resistors for microcircuits
|
Osadnik, S.J. |
|
1972 |
11 |
1 |
p. 71-78 8 p. |
artikel |
93 |
Recent United Kingdom patents in microelectronics
|
|
|
1972 |
11 |
1 |
p. 11-12 2 p. |
artikel |
94 |
Recursive Bayesian estimation using Gaussian sums
|
|
|
1972 |
11 |
1 |
p. 13- 1 p. |
artikel |
95 |
Reliability assurance in the manufacturing phase
|
|
|
1972 |
11 |
1 |
p. 13-14 2 p. |
artikel |
96 |
Reliability assurance of electronic components mainly for consumer products
|
Ishihara, K. |
|
1972 |
11 |
1 |
p. 55-58 4 p. |
artikel |
97 |
Reliability design of the DEX electronic switching system
|
Shiromizu, M. |
|
1972 |
11 |
1 |
p. 34-37 4 p. |
artikel |
98 |
Reliability experience of digital telemetry
|
Cox, H. |
|
1972 |
11 |
1 |
p. 87-90 4 p. |
artikel |
99 |
Reliability of Al2O3-SiO2 IGFET integrated circuits
|
|
|
1972 |
11 |
1 |
p. 14- 1 p. |
artikel |
100 |
Reliability of interconnection for ultrasonic facedown bonding
|
|
|
1972 |
11 |
1 |
p. 16- 1 p. |
artikel |
101 |
Reliability of oscilloscope
|
Numasawa, A. |
|
1972 |
11 |
1 |
p. 48- 1 p. |
artikel |
102 |
Reliability of products electronic mechanical equipment electronic desk top calculator
|
Sasaki, T. |
|
1972 |
11 |
1 |
p. 46-47 2 p. |
artikel |
103 |
Reliability of rolling bearing
|
Yoshida, K. |
|
1972 |
11 |
1 |
p. 60-62 3 p. |
artikel |
104 |
Reliability result of signalling and telecommunication facilities on the new Tokaido line
|
Sakata, T. |
|
1972 |
11 |
1 |
p. 33-34 2 p. |
artikel |
105 |
ROM can be electrically programed and reprogramed and reprogramed…
|
|
|
1972 |
11 |
1 |
p. 23- 1 p. |
artikel |
106 |
Screening for reliability growth
|
|
|
1972 |
11 |
1 |
p. 16- 1 p. |
artikel |
107 |
Semiconductor random-access memories
|
|
|
1972 |
11 |
1 |
p. 20- 1 p. |
artikel |
108 |
Shillelagh reliability program development to deployment
|
|
|
1972 |
11 |
1 |
p. 17- 1 p. |
artikel |
109 |
Signal processing in acoustic surface-wave devices
|
|
|
1972 |
11 |
1 |
p. 17- 1 p. |
artikel |
110 |
Simulation model for the maintenance of a deteriorating component system
|
|
|
1972 |
11 |
1 |
p. 17- 1 p. |
artikel |
111 |
Solid state photoresist technology
|
|
|
1972 |
11 |
1 |
p. 19- 1 p. |
artikel |
112 |
Some investigations on Au-CdS-type metal-semiconductor barriers
|
|
|
1972 |
11 |
1 |
p. 24- 1 p. |
artikel |
113 |
Some problems on reliability of semiconductor integrated circuits
|
Thuneki, S. |
|
1972 |
11 |
1 |
p. 52- 1 p. |
artikel |
114 |
Specific contact resistance of metal-semiconductor barriers
|
|
|
1972 |
11 |
1 |
p. 24- 1 p. |
artikel |
115 |
The distribution of mobile carriers in the pinch-off region of an insulated-gate field-effect transistor and its influence on device breakdown
|
|
|
1972 |
11 |
1 |
p. 15- 1 p. |
artikel |
116 |
The effect of the physical properties of alumina substrates on their use in microwave hybrid circuits
|
|
|
1972 |
11 |
1 |
p. 20- 1 p. |
artikel |
117 |
The effects of trimming methods on current noise in thick-film resistors
|
|
|
1972 |
11 |
1 |
p. 24-25 2 p. |
artikel |
118 |
The measurement of interface state charge in the MOS system
|
|
|
1972 |
11 |
1 |
p. 22- 1 p. |
artikel |
119 |
Thermal analysis of beam-lead transistor chip
|
|
|
1972 |
11 |
1 |
p. 20- 1 p. |
artikel |
120 |
The solubility of carbon in pulled silicon crystals
|
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|
1972 |
11 |
1 |
p. 22- 1 p. |
artikel |
121 |
The surface properties of nickel films evaporated in ultrahigh vacuum
|
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|
1972 |
11 |
1 |
p. 25- 1 p. |
artikel |
122 |
Thick-film inductors and their use in tuned circuits at VHF
|
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|
1972 |
11 |
1 |
p. 26-27 2 p. |
artikel |
123 |
Thick-film resistor adjustment by high voltage discharge
|
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|
1972 |
11 |
1 |
p. 25-26 2 p. |
artikel |
124 |
Typical current vs. voltage curve of sodium-silicon N contact. Height of potential barrier
|
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|
1972 |
11 |
1 |
p. 22- 1 p. |
artikel |
125 |
Use of tests at elevated temperatures to accelerate the life of a MOS integrated circuit
|
|
|
1972 |
11 |
1 |
p. 15- 1 p. |
artikel |
126 |
Using a digital computer for solving the drift equation in a p-n junction
|
|
|
1972 |
11 |
1 |
p. 24- 1 p. |
artikel |
127 |
Vacua: how they may be improved or impaired by vacuum pumps and traps
|
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|
1972 |
11 |
1 |
p. 26- 1 p. |
artikel |
128 |
Vacuum effects on fusing devices
|
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|
1972 |
11 |
1 |
p. 15- 1 p. |
artikel |
129 |
Valence force potentials for calculating crystal vibrations in silicon
|
|
|
1972 |
11 |
1 |
p. 23- 1 p. |
artikel |
130 |
Wire bonds of thick-film conductors
|
|
|
1972 |
11 |
1 |
p. 25- 1 p. |
artikel |
131 |
Worst case TTL line driving
|
|
|
1972 |
11 |
1 |
p. 16- 1 p. |
artikel |