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                             131 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Adhesive strength of thick-film PdAg conductors 1972
11 1 p. 27-
1 p.
artikel
2 Aircraft maintenance and reliability Fukushima, M.
1972
11 1 p. 41-46
6 p.
artikel
3 Aluminum ultrasonic joining in spider and wire connections 1972
11 1 p. 20-
1 p.
artikel
4 A method of assessing the risks associated with reliability demonstration testing 1972
11 1 p. 16-
1 p.
artikel
5 A 20 MHz digital frequency meter using ttl integrated circuits (Part 1) 1972
11 1 p. 20-21
2 p.
artikel
6 A monolithic channel filter—manufacture with a new technology 1972
11 1 p. 21-22
2 p.
artikel
7 An approach to a standard topology for digital hybrid integrated circuits 1972
11 1 p. 18-
1 p.
artikel
8 A new high-performance co-firable paste system 1972
11 1 p. 27-
1 p.
artikel
9 A new self-scanned photodiode array 1972
11 1 p. 21-
1 p.
artikel
10 An improved microwave silicon MESFET 1972
11 1 p. 23-
1 p.
artikel
11 Anomalous diffusion of Al into SiC 1972
11 1 p. 23-
1 p.
artikel
12 An overview of photomasking technology in the past decade 1972
11 1 p. 18-
1 p.
artikel
13 A plasma oxidation process for removing photoresist films 1972
11 1 p. 20-
1 p.
artikel
14 Application of MIL-STD-781B to redundant systems 1972
11 1 p. 16-
1 p.
artikel
15 A review of the fundamentals of vacuum metallurgy 1972
11 1 p. 26-
1 p.
artikel
16 Aspects of multi-layered thick-film hybrids 1972
11 1 p. 26-
1 p.
artikel
17 A study of new shallow diffusion techniques in silicon for microwave structures 1972
11 1 p. 19-
1 p.
artikel
18 A study of the contacts of a diffused resistor 1972
11 1 p. 21-
1 p.
artikel
19 Beam-leads, versatile chips with a built-in interconnection system 1972
11 1 p. 19-
1 p.
artikel
20 Bistable noise in p-n junctions 1972
11 1 p. 23-
1 p.
artikel
21 Buried wire multilayer ceramics 1972
11 1 p. 18-
1 p.
artikel
22 Calendar of international conferences, symposia, lectures and meetings of interest 1972
11 1 p. 3-4
2 p.
artikel
23 Calls for papers 1972
11 1 p. 7-
1 p.
artikel
24 Characterization of SiO using fine features of X-ray K emission spectra 1972
11 1 p. 22-
1 p.
artikel
25 Charge-coupled devices—a new approach to MIS device structures 1972
11 1 p. 18-19
2 p.
artikel
26 Coming up fast from behind—denser bipolar devices 1972
11 1 p. 20-
1 p.
artikel
27 Component data for statistical circuit analysis Jensen, F.
1972
11 1 p. 79-85
7 p.
artikel
28 Conversion of silicon nitride into silicon dioxide through the influence of oxygen 1972
11 1 p. 23-
1 p.
artikel
29 Correlation of bright spots with crystal defects in silicon vidicons 1972
11 1 p. 14-
1 p.
artikel
30 Course 1972
11 1 p. 5-
1 p.
artikel
31 Critical mechanical design evaluation of electronic communication systems 1972
11 1 p. 17-
1 p.
artikel
32 Design considerations for a hybrid power series regulator 1972
11 1 p. 19-
1 p.
artikel
33 Designing differential FET inputs with overall performance in mind 1972
11 1 p. 20-
1 p.
artikel
34 Detection of failures in combinational digital circuits 1972
11 1 p. 16-
1 p.
artikel
35 Developments in copper alloys for semiconductor connectors and packages 1972
11 1 p. 22-
1 p.
artikel
36 Doping dependence of second breakdown in a p-n junction 1972
11 1 p. 14-15
2 p.
artikel
37 Drift velocity of electrons and holes and associated anisotropic effects in silicon 1972
11 1 p. 24-
1 p.
artikel
38 Economical electrical life testing of toggle switches Bora, J.S.
1972
11 1 p. 93-
1 p.
artikel
39 Editorial Board 1972
11 1 p. IFC-
1 p.
artikel
40 Effects of humidity and organic coating on surface potential propagation in passivated devices 1972
11 1 p. 14-
1 p.
artikel
41 Electromigration damage in AlCu thin films 1972
11 1 p. 15-
1 p.
artikel
42 Electronic structure of defect centers in SiO2 1972
11 1 p. 15-
1 p.
artikel
43 Experimental results on transient space charge limited currents in p-n junctions 1972
11 1 p. 23-
1 p.
artikel
44 Failure modes in thick-film hybrids 1972
11 1 p. 17-
1 p.
artikel
45 Failure physics on the electro-mechanical parts Uekusa, C.
1972
11 1 p. 59-60
2 p.
artikel
46 Ferroelectric films by flash evaporation of PZT 1972
11 1 p. 27-
1 p.
artikel
47 Figure of merit of Bayesian analysis and modeling 1972
11 1 p. 13-
1 p.
artikel
48 Flow reliability of communication net 1972
11 1 p. 16-
1 p.
artikel
49 Fringe field corrections for capacitors on thin dielectric layers 1972
11 1 p. 22-
1 p.
artikel
50 Highly reliable components for the electronics switching system in Japan Hanzawa, M.
1972
11 1 p. 53-55
3 p.
artikel
51 High value resistors for integrated circuits 1972
11 1 p. 95-
1 p.
artikel
52 IC OP amps getting it all together 1972
11 1 p. 21-
1 p.
artikel
53 Impurity concentration dependent density of states and resulting fermi level for silicon 1972
11 1 p. 24-
1 p.
artikel
54 Integrated injection logic 1972
11 1 p. 94-IN6
nvt p.
artikel
55 Large silicon slice mounting 1972
11 1 p. 19-
1 p.
artikel
56 Laser trimming of silicon-chromium thin-film resistors 1972
11 1 p. 27-
1 p.
artikel
57 Letter to the editor Young, K.J.
1972
11 1 p. 1-
1 p.
artikel
58 Linear IC market in ferment 1972
11 1 p. 18-
1 p.
artikel
59 Making sense out of the MOS muddle, Part 1 1972
11 1 p. 17-18
2 p.
artikel
60 Matched-varactor chip brings electronic tuning to a-m radios 1972
11 1 p. 22-
1 p.
artikel
61 Materials in electronics G.W.A.D.,
1972
11 1 p. 29-
1 p.
artikel
62 Measuring techniques for trimming hybrid circuit resistors 1972
11 1 p. 25-
1 p.
artikel
63 Measuring the thickness of very thin layers by X-ray interference 1972
11 1 p. 26-
1 p.
artikel
64 Metallurgical properties and electrical characteristics of palladium silicide-silicon contacts 1972
11 1 p. 21-
1 p.
artikel
65 MOSFET memory circuits 1972
11 1 p. 21-
1 p.
artikel
66 MOS firms eye 1-transistor cells 1972
11 1 p. 20-
1 p.
artikel
67 MOS/LSI brings complex circuits within reach of any designer 1972
11 1 p. 21-
1 p.
artikel
68 Multilayer debugging process Ninomiya, T.
1972
11 1 p. 65-69
5 p.
artikel
69 Multilayering for a low cost hermetic thick-film substrate package 1972
11 1 p. 25-
1 p.
artikel
70 Multilayer substrates utilizing thin-film and thick-film technologies 1972
11 1 p. 25-
1 p.
artikel
71 New low cost high-performance thick-film resistor paste 1972
11 1 p. 26-
1 p.
artikel
72 NHK-topics system Sonoda, S.
1972
11 1 p. 38-41
4 p.
artikel
73 Nitride-oxide layer proofs memory against data loss 1972
11 1 p. 19-
1 p.
artikel
74 Nonparametric analysis of reliability data in an extended failure model Abe, Shu-Nichi
1972
11 1 p. 64-65
2 p.
artikel
75 On single-cycle availability 1972
11 1 p. 17-
1 p.
artikel
76 On the emitter degradation by avalanche breakdown in planar transistors 1972
11 1 p. 14-
1 p.
artikel
77 Optimum design method achieving maximum system effectiveness Sasaki, M.
1972
11 1 p. 62-63
2 p.
artikel
78 Orientation dependence of the diffusion of boron in silicon 1972
11 1 p. 24-
1 p.
artikel
79 Packaging techniques for modern microelectronics equipment 1972
11 1 p. 18-
1 p.
artikel
80 Papers to be published in future issues 1972
11 1 p. 31-
1 p.
artikel
81 Passivation of semiconductor surfaces 1972
11 1 p. 23-
1 p.
artikel
82 Photoformed plated interconnection of embedded IC chips 1972
11 1 p. 20-
1 p.
artikel
83 Plastic encapsulated semiconductors; field performance vs. laboratory testing 1972
11 1 p. 14-
1 p.
artikel
84 Preliminary experience with ion-beam thinning of semiconductor materials 1972
11 1 p. 27-
1 p.
artikel
85 Preliminary program 1972 Reliability Physics Symposium 1972
11 1 p. 9-10
2 p.
artikel
86 Probleme der Fehlererkennung in Masken für integrierte Halbleiterschaltungen bei kohärent-optischer Filterung 1972
11 1 p. 19-
1 p.
artikel
87 Production method for aluminum beam leads on ceramic substrates 1972
11 1 p. 18-
1 p.
artikel
88 Production of a hybrid integrated circuit for PICTUREPHONE® service 1972
11 1 p. 21-
1 p.
artikel
89 Product reliability—Automobile Iwata, A.
1972
11 1 p. 50-51
2 p.
artikel
90 Properties and processes for photoresists in semiconductor manufacture 1972
11 1 p. 19-
1 p.
artikel
91 Quality assurance and reliability for construction equipment, especially bulldozers Fuse, Y.
1972
11 1 p. 48-50
3 p.
artikel
92 Reactively evaporated titanium nitride resistors for microcircuits Osadnik, S.J.
1972
11 1 p. 71-78
8 p.
artikel
93 Recent United Kingdom patents in microelectronics 1972
11 1 p. 11-12
2 p.
artikel
94 Recursive Bayesian estimation using Gaussian sums 1972
11 1 p. 13-
1 p.
artikel
95 Reliability assurance in the manufacturing phase 1972
11 1 p. 13-14
2 p.
artikel
96 Reliability assurance of electronic components mainly for consumer products Ishihara, K.
1972
11 1 p. 55-58
4 p.
artikel
97 Reliability design of the DEX electronic switching system Shiromizu, M.
1972
11 1 p. 34-37
4 p.
artikel
98 Reliability experience of digital telemetry Cox, H.
1972
11 1 p. 87-90
4 p.
artikel
99 Reliability of Al2O3-SiO2 IGFET integrated circuits 1972
11 1 p. 14-
1 p.
artikel
100 Reliability of interconnection for ultrasonic facedown bonding 1972
11 1 p. 16-
1 p.
artikel
101 Reliability of oscilloscope Numasawa, A.
1972
11 1 p. 48-
1 p.
artikel
102 Reliability of products electronic mechanical equipment electronic desk top calculator Sasaki, T.
1972
11 1 p. 46-47
2 p.
artikel
103 Reliability of rolling bearing Yoshida, K.
1972
11 1 p. 60-62
3 p.
artikel
104 Reliability result of signalling and telecommunication facilities on the new Tokaido line Sakata, T.
1972
11 1 p. 33-34
2 p.
artikel
105 ROM can be electrically programed and reprogramed and reprogramed… 1972
11 1 p. 23-
1 p.
artikel
106 Screening for reliability growth 1972
11 1 p. 16-
1 p.
artikel
107 Semiconductor random-access memories 1972
11 1 p. 20-
1 p.
artikel
108 Shillelagh reliability program development to deployment 1972
11 1 p. 17-
1 p.
artikel
109 Signal processing in acoustic surface-wave devices 1972
11 1 p. 17-
1 p.
artikel
110 Simulation model for the maintenance of a deteriorating component system 1972
11 1 p. 17-
1 p.
artikel
111 Solid state photoresist technology 1972
11 1 p. 19-
1 p.
artikel
112 Some investigations on Au-CdS-type metal-semiconductor barriers 1972
11 1 p. 24-
1 p.
artikel
113 Some problems on reliability of semiconductor integrated circuits Thuneki, S.
1972
11 1 p. 52-
1 p.
artikel
114 Specific contact resistance of metal-semiconductor barriers 1972
11 1 p. 24-
1 p.
artikel
115 The distribution of mobile carriers in the pinch-off region of an insulated-gate field-effect transistor and its influence on device breakdown 1972
11 1 p. 15-
1 p.
artikel
116 The effect of the physical properties of alumina substrates on their use in microwave hybrid circuits 1972
11 1 p. 20-
1 p.
artikel
117 The effects of trimming methods on current noise in thick-film resistors 1972
11 1 p. 24-25
2 p.
artikel
118 The measurement of interface state charge in the MOS system 1972
11 1 p. 22-
1 p.
artikel
119 Thermal analysis of beam-lead transistor chip 1972
11 1 p. 20-
1 p.
artikel
120 The solubility of carbon in pulled silicon crystals 1972
11 1 p. 22-
1 p.
artikel
121 The surface properties of nickel films evaporated in ultrahigh vacuum 1972
11 1 p. 25-
1 p.
artikel
122 Thick-film inductors and their use in tuned circuits at VHF 1972
11 1 p. 26-27
2 p.
artikel
123 Thick-film resistor adjustment by high voltage discharge 1972
11 1 p. 25-26
2 p.
artikel
124 Typical current vs. voltage curve of sodium-silicon N contact. Height of potential barrier 1972
11 1 p. 22-
1 p.
artikel
125 Use of tests at elevated temperatures to accelerate the life of a MOS integrated circuit 1972
11 1 p. 15-
1 p.
artikel
126 Using a digital computer for solving the drift equation in a p-n junction 1972
11 1 p. 24-
1 p.
artikel
127 Vacua: how they may be improved or impaired by vacuum pumps and traps 1972
11 1 p. 26-
1 p.
artikel
128 Vacuum effects on fusing devices 1972
11 1 p. 15-
1 p.
artikel
129 Valence force potentials for calculating crystal vibrations in silicon 1972
11 1 p. 23-
1 p.
artikel
130 Wire bonds of thick-film conductors 1972
11 1 p. 25-
1 p.
artikel
131 Worst case TTL line driving 1972
11 1 p. 16-
1 p.
artikel
                             131 gevonden resultaten
 
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