| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Adhesive strength of thick-film PdAg conductors
|
|
|
1972
|
11 |
1 |
p. 27-
1 p.
|
artikel
|
| 2 |
Aircraft maintenance and reliability
|
Fukushima, M.
|
|
1972
|
11 |
1 |
p. 41-46
6 p.
|
artikel
|
| 3 |
Aluminum ultrasonic joining in spider and wire connections
|
|
|
1972
|
11 |
1 |
p. 20-
1 p.
|
artikel
|
| 4 |
A method of assessing the risks associated with reliability demonstration testing
|
|
|
1972
|
11 |
1 |
p. 16-
1 p.
|
artikel
|
| 5 |
A 20 MHz digital frequency meter using ttl integrated circuits (Part 1)
|
|
|
1972
|
11 |
1 |
p. 20-21
2 p.
|
artikel
|
| 6 |
A monolithic channel filter—manufacture with a new technology
|
|
|
1972
|
11 |
1 |
p. 21-22
2 p.
|
artikel
|
| 7 |
An approach to a standard topology for digital hybrid integrated circuits
|
|
|
1972
|
11 |
1 |
p. 18-
1 p.
|
artikel
|
| 8 |
A new high-performance co-firable paste system
|
|
|
1972
|
11 |
1 |
p. 27-
1 p.
|
artikel
|
| 9 |
A new self-scanned photodiode array
|
|
|
1972
|
11 |
1 |
p. 21-
1 p.
|
artikel
|
| 10 |
An improved microwave silicon MESFET
|
|
|
1972
|
11 |
1 |
p. 23-
1 p.
|
artikel
|
| 11 |
Anomalous diffusion of Al into SiC
|
|
|
1972
|
11 |
1 |
p. 23-
1 p.
|
artikel
|
| 12 |
An overview of photomasking technology in the past decade
|
|
|
1972
|
11 |
1 |
p. 18-
1 p.
|
artikel
|
| 13 |
A plasma oxidation process for removing photoresist films
|
|
|
1972
|
11 |
1 |
p. 20-
1 p.
|
artikel
|
| 14 |
Application of MIL-STD-781B to redundant systems
|
|
|
1972
|
11 |
1 |
p. 16-
1 p.
|
artikel
|
| 15 |
A review of the fundamentals of vacuum metallurgy
|
|
|
1972
|
11 |
1 |
p. 26-
1 p.
|
artikel
|
| 16 |
Aspects of multi-layered thick-film hybrids
|
|
|
1972
|
11 |
1 |
p. 26-
1 p.
|
artikel
|
| 17 |
A study of new shallow diffusion techniques in silicon for microwave structures
|
|
|
1972
|
11 |
1 |
p. 19-
1 p.
|
artikel
|
| 18 |
A study of the contacts of a diffused resistor
|
|
|
1972
|
11 |
1 |
p. 21-
1 p.
|
artikel
|
| 19 |
Beam-leads, versatile chips with a built-in interconnection system
|
|
|
1972
|
11 |
1 |
p. 19-
1 p.
|
artikel
|
| 20 |
Bistable noise in p-n junctions
|
|
|
1972
|
11 |
1 |
p. 23-
1 p.
|
artikel
|
| 21 |
Buried wire multilayer ceramics
|
|
|
1972
|
11 |
1 |
p. 18-
1 p.
|
artikel
|
| 22 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1972
|
11 |
1 |
p. 3-4
2 p.
|
artikel
|
| 23 |
Calls for papers
|
|
|
1972
|
11 |
1 |
p. 7-
1 p.
|
artikel
|
| 24 |
Characterization of SiO using fine features of X-ray K emission spectra
|
|
|
1972
|
11 |
1 |
p. 22-
1 p.
|
artikel
|
| 25 |
Charge-coupled devices—a new approach to MIS device structures
|
|
|
1972
|
11 |
1 |
p. 18-19
2 p.
|
artikel
|
| 26 |
Coming up fast from behind—denser bipolar devices
|
|
|
1972
|
11 |
1 |
p. 20-
1 p.
|
artikel
|
| 27 |
Component data for statistical circuit analysis
|
Jensen, F.
|
|
1972
|
11 |
1 |
p. 79-85
7 p.
|
artikel
|
| 28 |
Conversion of silicon nitride into silicon dioxide through the influence of oxygen
|
|
|
1972
|
11 |
1 |
p. 23-
1 p.
|
artikel
|
| 29 |
Correlation of bright spots with crystal defects in silicon vidicons
|
|
|
1972
|
11 |
1 |
p. 14-
1 p.
|
artikel
|
| 30 |
Course
|
|
|
1972
|
11 |
1 |
p. 5-
1 p.
|
artikel
|
| 31 |
Critical mechanical design evaluation of electronic communication systems
|
|
|
1972
|
11 |
1 |
p. 17-
1 p.
|
artikel
|
| 32 |
Design considerations for a hybrid power series regulator
|
|
|
1972
|
11 |
1 |
p. 19-
1 p.
|
artikel
|
| 33 |
Designing differential FET inputs with overall performance in mind
|
|
|
1972
|
11 |
1 |
p. 20-
1 p.
|
artikel
|
| 34 |
Detection of failures in combinational digital circuits
|
|
|
1972
|
11 |
1 |
p. 16-
1 p.
|
artikel
|
| 35 |
Developments in copper alloys for semiconductor connectors and packages
|
|
|
1972
|
11 |
1 |
p. 22-
1 p.
|
artikel
|
| 36 |
Doping dependence of second breakdown in a p-n junction
|
|
|
1972
|
11 |
1 |
p. 14-15
2 p.
|
artikel
|
| 37 |
Drift velocity of electrons and holes and associated anisotropic effects in silicon
|
|
|
1972
|
11 |
1 |
p. 24-
1 p.
|
artikel
|
| 38 |
Economical electrical life testing of toggle switches
|
Bora, J.S.
|
|
1972
|
11 |
1 |
p. 93-
1 p.
|
artikel
|
| 39 |
Editorial Board
|
|
|
1972
|
11 |
1 |
p. IFC-
1 p.
|
artikel
|
| 40 |
Effects of humidity and organic coating on surface potential propagation in passivated devices
|
|
|
1972
|
11 |
1 |
p. 14-
1 p.
|
artikel
|
| 41 |
Electromigration damage in AlCu thin films
|
|
|
1972
|
11 |
1 |
p. 15-
1 p.
|
artikel
|
| 42 |
Electronic structure of defect centers in SiO2
|
|
|
1972
|
11 |
1 |
p. 15-
1 p.
|
artikel
|
| 43 |
Experimental results on transient space charge limited currents in p-n junctions
|
|
|
1972
|
11 |
1 |
p. 23-
1 p.
|
artikel
|
| 44 |
Failure modes in thick-film hybrids
|
|
|
1972
|
11 |
1 |
p. 17-
1 p.
|
artikel
|
| 45 |
Failure physics on the electro-mechanical parts
|
Uekusa, C.
|
|
1972
|
11 |
1 |
p. 59-60
2 p.
|
artikel
|
| 46 |
Ferroelectric films by flash evaporation of PZT
|
|
|
1972
|
11 |
1 |
p. 27-
1 p.
|
artikel
|
| 47 |
Figure of merit of Bayesian analysis and modeling
|
|
|
1972
|
11 |
1 |
p. 13-
1 p.
|
artikel
|
| 48 |
Flow reliability of communication net
|
|
|
1972
|
11 |
1 |
p. 16-
1 p.
|
artikel
|
| 49 |
Fringe field corrections for capacitors on thin dielectric layers
|
|
|
1972
|
11 |
1 |
p. 22-
1 p.
|
artikel
|
| 50 |
Highly reliable components for the electronics switching system in Japan
|
Hanzawa, M.
|
|
1972
|
11 |
1 |
p. 53-55
3 p.
|
artikel
|
| 51 |
High value resistors for integrated circuits
|
|
|
1972
|
11 |
1 |
p. 95-
1 p.
|
artikel
|
| 52 |
IC OP amps getting it all together
|
|
|
1972
|
11 |
1 |
p. 21-
1 p.
|
artikel
|
| 53 |
Impurity concentration dependent density of states and resulting fermi level for silicon
|
|
|
1972
|
11 |
1 |
p. 24-
1 p.
|
artikel
|
| 54 |
Integrated injection logic
|
|
|
1972
|
11 |
1 |
p. 94-IN6
nvt p.
|
artikel
|
| 55 |
Large silicon slice mounting
|
|
|
1972
|
11 |
1 |
p. 19-
1 p.
|
artikel
|
| 56 |
Laser trimming of silicon-chromium thin-film resistors
|
|
|
1972
|
11 |
1 |
p. 27-
1 p.
|
artikel
|
| 57 |
Letter to the editor
|
Young, K.J.
|
|
1972
|
11 |
1 |
p. 1-
1 p.
|
artikel
|
| 58 |
Linear IC market in ferment
|
|
|
1972
|
11 |
1 |
p. 18-
1 p.
|
artikel
|
| 59 |
Making sense out of the MOS muddle, Part 1
|
|
|
1972
|
11 |
1 |
p. 17-18
2 p.
|
artikel
|
| 60 |
Matched-varactor chip brings electronic tuning to a-m radios
|
|
|
1972
|
11 |
1 |
p. 22-
1 p.
|
artikel
|
| 61 |
Materials in electronics
|
G.W.A.D.,
|
|
1972
|
11 |
1 |
p. 29-
1 p.
|
artikel
|
| 62 |
Measuring techniques for trimming hybrid circuit resistors
|
|
|
1972
|
11 |
1 |
p. 25-
1 p.
|
artikel
|
| 63 |
Measuring the thickness of very thin layers by X-ray interference
|
|
|
1972
|
11 |
1 |
p. 26-
1 p.
|
artikel
|
| 64 |
Metallurgical properties and electrical characteristics of palladium silicide-silicon contacts
|
|
|
1972
|
11 |
1 |
p. 21-
1 p.
|
artikel
|
| 65 |
MOSFET memory circuits
|
|
|
1972
|
11 |
1 |
p. 21-
1 p.
|
artikel
|
| 66 |
MOS firms eye 1-transistor cells
|
|
|
1972
|
11 |
1 |
p. 20-
1 p.
|
artikel
|
| 67 |
MOS/LSI brings complex circuits within reach of any designer
|
|
|
1972
|
11 |
1 |
p. 21-
1 p.
|
artikel
|
| 68 |
Multilayer debugging process
|
Ninomiya, T.
|
|
1972
|
11 |
1 |
p. 65-69
5 p.
|
artikel
|
| 69 |
Multilayering for a low cost hermetic thick-film substrate package
|
|
|
1972
|
11 |
1 |
p. 25-
1 p.
|
artikel
|
| 70 |
Multilayer substrates utilizing thin-film and thick-film technologies
|
|
|
1972
|
11 |
1 |
p. 25-
1 p.
|
artikel
|
| 71 |
New low cost high-performance thick-film resistor paste
|
|
|
1972
|
11 |
1 |
p. 26-
1 p.
|
artikel
|
| 72 |
NHK-topics system
|
Sonoda, S.
|
|
1972
|
11 |
1 |
p. 38-41
4 p.
|
artikel
|
| 73 |
Nitride-oxide layer proofs memory against data loss
|
|
|
1972
|
11 |
1 |
p. 19-
1 p.
|
artikel
|
| 74 |
Nonparametric analysis of reliability data in an extended failure model
|
Abe, Shu-Nichi
|
|
1972
|
11 |
1 |
p. 64-65
2 p.
|
artikel
|
| 75 |
On single-cycle availability
|
|
|
1972
|
11 |
1 |
p. 17-
1 p.
|
artikel
|
| 76 |
On the emitter degradation by avalanche breakdown in planar transistors
|
|
|
1972
|
11 |
1 |
p. 14-
1 p.
|
artikel
|
| 77 |
Optimum design method achieving maximum system effectiveness
|
Sasaki, M.
|
|
1972
|
11 |
1 |
p. 62-63
2 p.
|
artikel
|
| 78 |
Orientation dependence of the diffusion of boron in silicon
|
|
|
1972
|
11 |
1 |
p. 24-
1 p.
|
artikel
|
| 79 |
Packaging techniques for modern microelectronics equipment
|
|
|
1972
|
11 |
1 |
p. 18-
1 p.
|
artikel
|
| 80 |
Papers to be published in future issues
|
|
|
1972
|
11 |
1 |
p. 31-
1 p.
|
artikel
|
| 81 |
Passivation of semiconductor surfaces
|
|
|
1972
|
11 |
1 |
p. 23-
1 p.
|
artikel
|
| 82 |
Photoformed plated interconnection of embedded IC chips
|
|
|
1972
|
11 |
1 |
p. 20-
1 p.
|
artikel
|
| 83 |
Plastic encapsulated semiconductors; field performance vs. laboratory testing
|
|
|
1972
|
11 |
1 |
p. 14-
1 p.
|
artikel
|
| 84 |
Preliminary experience with ion-beam thinning of semiconductor materials
|
|
|
1972
|
11 |
1 |
p. 27-
1 p.
|
artikel
|
| 85 |
Preliminary program 1972 Reliability Physics Symposium
|
|
|
1972
|
11 |
1 |
p. 9-10
2 p.
|
artikel
|
| 86 |
Probleme der Fehlererkennung in Masken für integrierte Halbleiterschaltungen bei kohärent-optischer Filterung
|
|
|
1972
|
11 |
1 |
p. 19-
1 p.
|
artikel
|
| 87 |
Production method for aluminum beam leads on ceramic substrates
|
|
|
1972
|
11 |
1 |
p. 18-
1 p.
|
artikel
|
| 88 |
Production of a hybrid integrated circuit for PICTUREPHONE® service
|
|
|
1972
|
11 |
1 |
p. 21-
1 p.
|
artikel
|
| 89 |
Product reliability—Automobile
|
Iwata, A.
|
|
1972
|
11 |
1 |
p. 50-51
2 p.
|
artikel
|
| 90 |
Properties and processes for photoresists in semiconductor manufacture
|
|
|
1972
|
11 |
1 |
p. 19-
1 p.
|
artikel
|
| 91 |
Quality assurance and reliability for construction equipment, especially bulldozers
|
Fuse, Y.
|
|
1972
|
11 |
1 |
p. 48-50
3 p.
|
artikel
|
| 92 |
Reactively evaporated titanium nitride resistors for microcircuits
|
Osadnik, S.J.
|
|
1972
|
11 |
1 |
p. 71-78
8 p.
|
artikel
|
| 93 |
Recent United Kingdom patents in microelectronics
|
|
|
1972
|
11 |
1 |
p. 11-12
2 p.
|
artikel
|
| 94 |
Recursive Bayesian estimation using Gaussian sums
|
|
|
1972
|
11 |
1 |
p. 13-
1 p.
|
artikel
|
| 95 |
Reliability assurance in the manufacturing phase
|
|
|
1972
|
11 |
1 |
p. 13-14
2 p.
|
artikel
|
| 96 |
Reliability assurance of electronic components mainly for consumer products
|
Ishihara, K.
|
|
1972
|
11 |
1 |
p. 55-58
4 p.
|
artikel
|
| 97 |
Reliability design of the DEX electronic switching system
|
Shiromizu, M.
|
|
1972
|
11 |
1 |
p. 34-37
4 p.
|
artikel
|
| 98 |
Reliability experience of digital telemetry
|
Cox, H.
|
|
1972
|
11 |
1 |
p. 87-90
4 p.
|
artikel
|
| 99 |
Reliability of Al2O3-SiO2 IGFET integrated circuits
|
|
|
1972
|
11 |
1 |
p. 14-
1 p.
|
artikel
|
| 100 |
Reliability of interconnection for ultrasonic facedown bonding
|
|
|
1972
|
11 |
1 |
p. 16-
1 p.
|
artikel
|
| 101 |
Reliability of oscilloscope
|
Numasawa, A.
|
|
1972
|
11 |
1 |
p. 48-
1 p.
|
artikel
|
| 102 |
Reliability of products electronic mechanical equipment electronic desk top calculator
|
Sasaki, T.
|
|
1972
|
11 |
1 |
p. 46-47
2 p.
|
artikel
|
| 103 |
Reliability of rolling bearing
|
Yoshida, K.
|
|
1972
|
11 |
1 |
p. 60-62
3 p.
|
artikel
|
| 104 |
Reliability result of signalling and telecommunication facilities on the new Tokaido line
|
Sakata, T.
|
|
1972
|
11 |
1 |
p. 33-34
2 p.
|
artikel
|
| 105 |
ROM can be electrically programed and reprogramed and reprogramed…
|
|
|
1972
|
11 |
1 |
p. 23-
1 p.
|
artikel
|
| 106 |
Screening for reliability growth
|
|
|
1972
|
11 |
1 |
p. 16-
1 p.
|
artikel
|
| 107 |
Semiconductor random-access memories
|
|
|
1972
|
11 |
1 |
p. 20-
1 p.
|
artikel
|
| 108 |
Shillelagh reliability program development to deployment
|
|
|
1972
|
11 |
1 |
p. 17-
1 p.
|
artikel
|
| 109 |
Signal processing in acoustic surface-wave devices
|
|
|
1972
|
11 |
1 |
p. 17-
1 p.
|
artikel
|
| 110 |
Simulation model for the maintenance of a deteriorating component system
|
|
|
1972
|
11 |
1 |
p. 17-
1 p.
|
artikel
|
| 111 |
Solid state photoresist technology
|
|
|
1972
|
11 |
1 |
p. 19-
1 p.
|
artikel
|
| 112 |
Some investigations on Au-CdS-type metal-semiconductor barriers
|
|
|
1972
|
11 |
1 |
p. 24-
1 p.
|
artikel
|
| 113 |
Some problems on reliability of semiconductor integrated circuits
|
Thuneki, S.
|
|
1972
|
11 |
1 |
p. 52-
1 p.
|
artikel
|
| 114 |
Specific contact resistance of metal-semiconductor barriers
|
|
|
1972
|
11 |
1 |
p. 24-
1 p.
|
artikel
|
| 115 |
The distribution of mobile carriers in the pinch-off region of an insulated-gate field-effect transistor and its influence on device breakdown
|
|
|
1972
|
11 |
1 |
p. 15-
1 p.
|
artikel
|
| 116 |
The effect of the physical properties of alumina substrates on their use in microwave hybrid circuits
|
|
|
1972
|
11 |
1 |
p. 20-
1 p.
|
artikel
|
| 117 |
The effects of trimming methods on current noise in thick-film resistors
|
|
|
1972
|
11 |
1 |
p. 24-25
2 p.
|
artikel
|
| 118 |
The measurement of interface state charge in the MOS system
|
|
|
1972
|
11 |
1 |
p. 22-
1 p.
|
artikel
|
| 119 |
Thermal analysis of beam-lead transistor chip
|
|
|
1972
|
11 |
1 |
p. 20-
1 p.
|
artikel
|
| 120 |
The solubility of carbon in pulled silicon crystals
|
|
|
1972
|
11 |
1 |
p. 22-
1 p.
|
artikel
|
| 121 |
The surface properties of nickel films evaporated in ultrahigh vacuum
|
|
|
1972
|
11 |
1 |
p. 25-
1 p.
|
artikel
|
| 122 |
Thick-film inductors and their use in tuned circuits at VHF
|
|
|
1972
|
11 |
1 |
p. 26-27
2 p.
|
artikel
|
| 123 |
Thick-film resistor adjustment by high voltage discharge
|
|
|
1972
|
11 |
1 |
p. 25-26
2 p.
|
artikel
|
| 124 |
Typical current vs. voltage curve of sodium-silicon N contact. Height of potential barrier
|
|
|
1972
|
11 |
1 |
p. 22-
1 p.
|
artikel
|
| 125 |
Use of tests at elevated temperatures to accelerate the life of a MOS integrated circuit
|
|
|
1972
|
11 |
1 |
p. 15-
1 p.
|
artikel
|
| 126 |
Using a digital computer for solving the drift equation in a p-n junction
|
|
|
1972
|
11 |
1 |
p. 24-
1 p.
|
artikel
|
| 127 |
Vacua: how they may be improved or impaired by vacuum pumps and traps
|
|
|
1972
|
11 |
1 |
p. 26-
1 p.
|
artikel
|
| 128 |
Vacuum effects on fusing devices
|
|
|
1972
|
11 |
1 |
p. 15-
1 p.
|
artikel
|
| 129 |
Valence force potentials for calculating crystal vibrations in silicon
|
|
|
1972
|
11 |
1 |
p. 23-
1 p.
|
artikel
|
| 130 |
Wire bonds of thick-film conductors
|
|
|
1972
|
11 |
1 |
p. 25-
1 p.
|
artikel
|
| 131 |
Worst case TTL line driving
|
|
|
1972
|
11 |
1 |
p. 16-
1 p.
|
artikel
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