nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
An equilibrium model for buried SiGe strained layers
|
Fischer, A. |
|
2000 |
44 |
5 |
p. 869-873 5 p. |
artikel |
2 |
A spectro-microscopic approach for spatially resolved characterisation of semiconductor structures in PEEM
|
Hoffmann, P |
|
2000 |
44 |
5 |
p. 837-843 7 p. |
artikel |
3 |
Cross-sectional STM/STS — a useful tool for identification of dopants in silicon
|
Nuffer, R. |
|
2000 |
44 |
5 |
p. 875-880 6 p. |
artikel |
4 |
Crystal growth under heat field rotation conditions
|
Kokh, Alexandr E |
|
2000 |
44 |
5 |
p. 819-824 6 p. |
artikel |
5 |
Dopant diffusion during rapid thermal oxidation
|
Stadler, A |
|
2000 |
44 |
5 |
p. 831-835 5 p. |
artikel |
6 |
Editorial
|
|
|
2000 |
44 |
5 |
p. v- 1 p. |
artikel |
7 |
Efficient backup schemes for processors in embedded systems
|
Pflanz, M |
|
2000 |
44 |
5 |
p. 791-796 6 p. |
artikel |
8 |
Field effect in organic devices with solution-doped arylamino-poly-(phenylene-vinylene)
|
Scheinert, S. |
|
2000 |
44 |
5 |
p. 845-853 9 p. |
artikel |
9 |
Front-end process simulation
|
Rafferty, C.S |
|
2000 |
44 |
5 |
p. 863-868 6 p. |
artikel |
10 |
Index
|
|
|
2000 |
44 |
5 |
p. I- 1 p. |
artikel |
11 |
Influence of melt convection on the interface during Czochralski crystal growth
|
Miller, W. |
|
2000 |
44 |
5 |
p. 825-830 6 p. |
artikel |
12 |
Integration of quantum transport models in classical device simulators
|
Racec, P.N. |
|
2000 |
44 |
5 |
p. 881-886 6 p. |
artikel |
13 |
Nonlinear optical characterization of the surface of silicon wafers: In-situ detection of external stress
|
Reif, J |
|
2000 |
44 |
5 |
p. 809-813 5 p. |
artikel |
14 |
Optimization of 0.18 μm CMOS devices by coupled process and device simulation
|
Burenkov, A. |
|
2000 |
44 |
5 |
p. 767-774 8 p. |
artikel |
15 |
Overview of status and challenges of system testing on chip with embedded DRAMS
|
Falter, T |
|
2000 |
44 |
5 |
p. 761-766 6 p. |
artikel |
16 |
Polymeric electrodes
|
Appel, G |
|
2000 |
44 |
5 |
p. 855-861 7 p. |
artikel |
17 |
Reliability of built in aluminum interconnection with low-ε dielectric based on porous anodic alumina
|
Lazarouk, S |
|
2000 |
44 |
5 |
p. 815-818 4 p. |
artikel |
18 |
Silicon-on-insulator: materials aspects and applications
|
Plößl, Andreas |
|
2000 |
44 |
5 |
p. 775-782 8 p. |
artikel |
19 |
Tailoring dopant diffusion for advanced SiGe:C heterojunction bipolar transistors
|
Rücker, H. |
|
2000 |
44 |
5 |
p. 783-789 7 p. |
artikel |
20 |
Two- and three-dimensional numerical modeling of copper electroplating for advanced ULSI metallization
|
Ritter, G. |
|
2000 |
44 |
5 |
p. 797-807 11 p. |
artikel |