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Effect of aging treatment on bonding interface properties of hot-pressed Cu/Al clad material |
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Titel: |
Effect of aging treatment on bonding interface properties of hot-pressed Cu/Al clad material |
Auteur: |
Lee, Sangmok Son, In-Soo Lee, Jin-Kyung Lee, Jong-Sup Kim, Yong-Bae Lee, Geun-An Lee, Sang-Pill Cho, Young-Rae Bae, Dong-Su |
Verschenen in: |
International journal of precision engineering and manufacturing |
Paginering: |
Jaargang 16 (2015) nr. 3 pagina's 525-530 |
Jaar: |
2015 |
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Uitgever: |
Korean Society for Precision Engineering, Springer |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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