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Effect of aging treatment on bonding interface properties of hot-pressed Cu/Al clad material |
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Title: |
Effect of aging treatment on bonding interface properties of hot-pressed Cu/Al clad material |
Author: |
Lee, Sangmok Son, In-Soo Lee, Jin-Kyung Lee, Jong-Sup Kim, Yong-Bae Lee, Geun-An Lee, Sang-Pill Cho, Young-Rae Bae, Dong-Su |
Appeared in: |
International journal of precision engineering and manufacturing |
Paging: |
Volume 16 (2015) nr. 3 pages 525-530 |
Year: |
2015 |
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Publisher: |
Korean Society for Precision Engineering, Springer |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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