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Journal description
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Details for article 11 of 30 found articles
| Title: |
Effects of electroplated Cu thickness and polyimide plasma treatment conditions on the interfacial fracture mechanics parameters in the Cu/Cr/polyimide system |
| Author: |
Park, Young Bae Yu, Jin |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 7 (2001) nr. 2 pages 123-131 |
| Year: |
2001 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 30 found articles
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