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Journal description
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Details for article 53 of 201 found articles
| Title: |
Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints |
| Author: |
Sun, Lei Chen, Ming-he Wei, Chun-chun Zhang, Liang Yang, Fan |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 29 (2018) nr. 12 pages 9757-9763 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 53 of 201 found articles
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