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Details for article 44 of 102 found articles
| Title: |
Metallurgical behaviors of lead-free solder alloys with respect to Ag content in a ball grid array package around melting temperatures |
| Author: |
Jeong, Seokwon Jang, Jin-Wook Yoo, Sejin Park, Jinduck Cho, Sungil Han, Junsoo An, Sangho |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 28 (2017) nr. 22 pages 17038-17043 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 44 of 102 found articles
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