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Journal description
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Details for article 143 of 151 found articles
| Title: |
The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding |
| Author: |
Kim, Sun-Chul Lee, Ja Yeon Park, Jae-Yong Lee, Tae-Young Kim, Young-Ho |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 27 (2016) nr. 7 pages 6646-6655 |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 143 of 151 found articles
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