|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 121 of 125 found articles
| Title: |
The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test |
| Author: |
Lee, Christine Jill Chen, Wei-Yu Chou, Tzu-Ting Lee, Tae-Kyu Wu, Yew-Chung Chang, Tao-Chih Duh, Jenq-Gong |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 26 (2015) nr. 12 pages 10055-10061 |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 121 of 125 found articles
| << previous | next >> |