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                                       Details for article 7 of 10 found articles
 
 
  High aspect ratio etched sub-micron structures in silicon obtained by cryogenic plasma deep-etching through perforated polymer thin films
 
 
Title: High aspect ratio etched sub-micron structures in silicon obtained by cryogenic plasma deep-etching through perforated polymer thin films
Author: Kulsreshath, M.
Vital, A.
Lefaucheux, P.
Sinturel, C.
Tillocher, T.
Vayer, M.
Boufnichel, M.
Dussart, R.
Appeared in: Micro and nano engineering
Paging: Volume 1 (2018) nr. C pages 42-48
Year: 2018
Contents:
Publisher: The Authors
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 7 of 10 found articles
 
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