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Journal description
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Details for article 197 of 217 found articles
| Title: |
The effect of solder paste volume on surface mount assembly self-alignment |
| Author: |
Pan, K. Ha, J.H. Wang, H.Y. Veeraraghavan, V. Park, S.B. |
| Appeared in: |
Procedia manufacturing |
| Paging: | Volume 38 () nr. C pages 1381-1393 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 197 of 217 found articles
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