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                                       Details for article 197 of 217 found articles
 
 
  The effect of solder paste volume on surface mount assembly self-alignment
 
 
Title: The effect of solder paste volume on surface mount assembly self-alignment
Author: Pan, K.
Ha, J.H.
Wang, H.Y.
Veeraraghavan, V.
Park, S.B.
Appeared in: Procedia manufacturing
Paging: Volume 38 () nr. C pages 1381-1393
Year: 2019
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 197 of 217 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands