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Journal description
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Details for article 21 of 99 found articles
| Title: |
Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films |
| Author: |
Somaiah, Nalla Kumar, Praveen |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 49 () nr. 1 pages 96-108 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 99 found articles
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